Abstract:
The invention relates to different methods for distortion-free production of data carriers having at least in partial areas a transparent plastic layer with a surface structure in the form of a lens structure. The surface structure can be produced by cutting method or embossed by applying heat and pressure. Alternatively the surface structure can be produced as a separate element which is connected after its production with the data carrier.
Abstract:
A multilayer data carrier is described which bears general printed data and furthermore has a transparent layer containing additives which are absorbent for a laser beam. The transparent layer is designed so that it exists in the card compound as a thin, nonself-supporting layer.
Abstract:
The invention relates to a data carrier into which, by a laser beam, identifiers (20, 22) are introduced in the form of patterns, letters, numbers and/or images that are visible due to local changes in the optical properties of the data carrier, effected by the laser beam and resulting from material transformations. According to the present invention, the data carrier comprises a laser-sensitive recording layer (26) that is transparent in the visible spectral range and that is provided with a surface relief in the form of a lens grid (28). The identifiers are introduced with the laser beam from different directions through the lens grid (28) into the recording layer (26) and are perceptible when later viewed from those same directions. The data carrier is transparent at least in the area of the introduced identifiers (20, 22).
Abstract:
A connector includes an inner structure divided into first, second, and third components. The first component includes plug contacts disposed so as to form a circular plug face configured for connection to a mating connector. The second component includes a connection block having connection contacts configured for connection of a data line connection. The third component includes a printed circuit board configured to provide an adaptable connecting element between the connection block and the plug contacts. The printed circuit board includes a plurality of layers in a sandwich configuration, the plurality of layers including layers having conductive trace alternating with layers having a dielectric. A first layer having a dielectric is disposed between two layers having conductive trace so as to form a first parallel plate capacitor. A second layer having a dielectric is disposed between two layers having trace so as to form a second parallel plate capacitor. A third layer having a dielectric is disposed between the first and second parallel plate capacitors. At least one of the first and second layers is thinner than the third layer.
Abstract:
A connector includes an inner structure divided into first, second, and third components. The first component includes plug contacts disposed so as to form a circular plug face configured for connection to a mating connector. The second component includes a connection block having connection contacts configured for connection of a data line connection. The third component includes a printed circuit board configured to provide an adaptable connecting element between the connection block and the plug contacts. The printed circuit board includes a plurality of layers in a sandwich configuration, the plurality of layers including layers having conductive trace alternating with layers having a dielectric. A first layer having a dielectric is disposed between two layers having conductive trace so as to form a first parallel plate capacitor. A second layer having a dielectric is disposed between two layers having trace so as to form a second parallel plate capacitor. A third layer having a dielectric is disposed between the first and second parallel plate capacitors. At least one of the first and second layers is thinner than the third layer
Abstract:
For throughplating flexible circuit boards, two electrically conductive layers located on opposing surfaces are electrically interconnected by cutting through the circuit board using a simple cutting tool for producing a passage. A defined quantity of conductive material is then inserted optionally into the through hole.
Abstract:
A multilayer data carrier is described which bears general printed data and furthermore has a transparent layer containing additives which are absorbent for a laser beam. The transparent layer is designed so that it exists in the card compound as a thin, nonself-supporting layer.
Abstract:
The invention relates to a data carrier into which, by a laser beam, identifiers (20, 22) are introduced in the form of patterns, letters, numbers and/or images that are visible due to local changes in the optical properties of the data carrier, effected by the laser beam and resulting from material transformations. According to the present invention, the data carrier comprises a laser-sensitive recording layer (26) that is transparent in the visible spectral range and that is provided with a surface relief in the form of a lens grid (28). The identifiers are introduced with the laser beam from different directions through the lens grid (28) into the recording layer (26) and are perceptible when later viewed from those same directions. The data carrier is transparent at least in the area of the introduced identifiers (20, 22).
Abstract:
The invention describes a method for producing chip cards with contactless and/or contact-type operation having a multilayer card body, an integrated circuit and at least one coil (2, 21) for data exchange and for power supply. The coil (2, 21) is applied to one or more layers (11) of the card body by printing technology, whereby after production of the printed coil a metal foil (4, 41) is placed over the coil terminals (32, 33) and laminated into the card body, thereby producing the connection between the contact areas (32, 33) of the printed coil and the metal foil (4, 41).