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公开(公告)号：US20100106105A1
公开(公告)日：2010-04-29
申请号：US12651485
申请日：2010-01-04
Applicant: Yehoshua Yeshurun , Meir Hefetz , Meint De Boer , J.W. Berenschot , J.G.E. Gardeniers
Inventor： Yehoshua Yeshurun , Meir Hefetz , Meint De Boer , J.W. Berenschot , J.G.E. Gardeniers
IPC: A61M5/00
CPC classification number: B81C1/005 , A61M37/0015 , A61M2037/003 , A61M2037/0053 , B81B2203/0361
Abstract: A method for processing a wafer to form a plurality of hollow microneedles projecting from a substrate includes forming, by use of a dry etching process, a number of groups of recessed features, each including at least one slot deployed to form an open shape having an included area and at least one hole located within the included area. The internal surfaces of the holes and the slots are then coated with a protective layer. An anisotropic wet etching process is then performed in such a manner as to remove material from outside the included areas while leaving a projecting feature within each of the included areas. The protective layer is then removed to reveal the microneedles.
Abstract translation: 用于处理晶片以形成从基板突出的多个中空微针的方法包括通过使用干蚀刻工艺形成多个凹陷特征组，每组包括展开以形成具有 包括区域和位于所包含区域内的至少一个孔。 然后用保护层涂覆孔和槽的内表面。 然后以这样的方式进行各向异性湿法蚀刻工艺，以便在包含区域的外部移除材料，同时在每个所包含的区域内留下突出特征。 然后去除保护层以显露微针。
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公开(公告)号：US07850657B2
公开(公告)日：2010-12-14
申请号：US12651485
申请日：2010-01-04
Applicant: Yehoshua Yeshurun , Meir Hefetz , Meint de Boer , J.W. Berenschot , J.G.E. Gardeniers
Inventor： Yehoshua Yeshurun , Meir Hefetz , Meint de Boer , J.W. Berenschot , J.G.E. Gardeniers
IPC: A61M5/00
CPC classification number: B81C1/005 , A61M37/0015 , A61M2037/003 , A61M2037/0053 , B81B2203/0361
Abstract: A method for processing a wafer to form a plurality of hollow microneedles projecting from a substrate includes forming, by use of a dry etching process, a number of groups of recessed features, each including at least one slot deployed to form an open shape having an included area and at least one hole located within the included area. The internal surfaces of the holes and the slots are then coated with a protective layer. An anisotropic wet etching process is then performed in such a manner as to remove material from outside the included areas while leaving a projecting feature within each of the included areas. The protective layer is then removed to reveal the microneedles.
Abstract translation: 用于处理晶片以形成从基板突出的多个中空微针的方法包括通过使用干蚀刻工艺形成多个凹陷特征组，每组包括展开以形成具有 包括区域和位于所包含区域内的至少一个孔。 然后用保护层涂覆孔和槽的内表面。 然后以这样的方式进行各向异性湿法蚀刻工艺，以便在包含区域的外部移除材料，同时在每个所包含的区域内留下突出特征。 然后去除保护层以显露微针。
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公开(公告)号：US07648484B2
公开(公告)日：2010-01-19
申请号：US10362835
申请日：2001-08-28
Applicant: Yehoshua Yeshurun , Mier Hefetz , Meint De Boer , J. W. Berenschot , J. G. E. Gardeniers
Inventor： Yehoshua Yeshurun , Mier Hefetz , Meint De Boer , J. W. Berenschot , J. G. E. Gardeniers
IPC: A61M5/00
CPC classification number: B81C1/005 , A61M37/0015 , A61M2037/003 , A61M2037/0053 , B81B2203/0361
Abstract: A method for processing a wafer to form a plurality of hollow microneedles projecting from a substrate includes forming, by use of a dry etching process, a number of groups of recessed features, each including at least one slot deployed to form an open shape having an included area and at least one hole located within the included area. The internal surfaces of the holes and the slots are then coated with a protective layer. An anisotropic wet etching process is then performed in such a manner as to remove material from outside the included areas while leaving a projecting feature within each of the included areas. The protective layer is then removed to reveal the microneedles.
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公开(公告)号：US20050029223A1
公开(公告)日：2005-02-10
申请号：US10362835
申请日：2001-08-28
Applicant: Yehoshua Yeshurun , Mier Hefetz , Meint De Boer , J. W. Berenschot , J. G. E. Gardeniers
Inventor： Yehoshua Yeshurun , Mier Hefetz , Meint De Boer , J. W. Berenschot , J. G. E. Gardeniers
CPC classification number: B81C1/005 , A61M37/0015 , A61M2037/003 , A61M2037/0053 , B81B2203/0361
Abstract: A method for processing a wafer to form a plurality of hollow microneedles projecing from a substrate includes forming, by use of a dry etching process, a number of groups of recessed features, each including at least one slot deployed to form an open shape having an included area and at least one hole located within the included area. The internal surfaces of the holes and the slots are then coated with a protective layer. An anisotropic wet etching process is then performed in such a manner as to remove material from outside the included areas while leaving a projecting feature within each of the included areas. The protective layer is then removed to reveal the microneedles.
Abstract translation: 用于处理晶片以形成从衬底投射的多个中空微针的方法包括通过使用干蚀刻工艺形成多个凹陷特征组，每组包括展开以形成开放形状的至少一个槽， 包括区域和位于所包含区域内的至少一个孔。 然后用保护层涂覆孔和槽的内表面。 然后以这样的方式进行各向异性湿法蚀刻工艺，以便在包含区域的外部移除材料，同时在每个所包含的区域内留下突出特征。 然后去除保护层以显露微针。
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Patent Agency Ranking
5.发明申请公开(公告)号：US20100224590A1
公开(公告)日：2010-09-09
申请号：US12160444
申请日：2008-05-20
Applicant: Yehoshua Yeshurun , Meint de Boer , J.W. Berenschot
Inventor： Yehoshua Yeshurun , Meint de Boer , J.W. Berenschot
IPC: B81C1/00
CPC classification number: B81C1/00111 , A61M37/0015 , A61M2037/003 , A61M2037/0053 , B81B2201/055
Abstract: A method for forming a hollow microneedle structure includes processing the front side of a wafer to form at least one microneedle projecting from a substrate and a through-bore passing through the microneedle and through a thickness of the substrate. An entire length of the through-bore is formed by a dry etching process performed from the front side of the wafer. Most preferably, upright surfaces of the microneedle structure and the through bore of the structure are formed by dry etching performed via a single mask with differing depths obtained by harnessing aspect ratio limitations of the dry etching process.
Abstract translation: 用于形成中空微针结构的方法包括处理晶片的前侧以形成从基底突出的至少一个微针和穿过微针并穿过基底的厚度的通孔。 通孔的整个长度通过从晶片的前侧进行的干蚀刻工艺形成。 最优选地，微针结构的直立表面和结构的通孔通过经由通过利用干蚀刻工艺的纵横比限制而获得的不同深度的单个掩模执行的干蚀刻形成。
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公开(公告)号：US06533949B1
公开(公告)日：2003-03-18
申请号：US09677175
申请日：2000-10-02
Applicant: Yehoshua Yeshurun , Meir Hefetz , Meint de Boer , J. W. Berenschot , J. G. E. Gardeniers
Inventor： Yehoshua Yeshurun , Meir Hefetz , Meint de Boer , J. W. Berenschot , J. G. E. Gardeniers
IPC: A61M3700
CPC classification number: B81C1/005 , A61M37/0015 , A61M2037/003 , A61M2037/0053 , B81B2203/0361
Abstract: A method for processing a wafer to form a plurality of hollow microneedles projecting from a substrate includes forming, by use of a dry etching process, a number of groups of recessed features, each including at least one slot deployed to form an open shape having an included area and at least one hole located within the included area. The internal surfaces of the holes and the slots are then coated with a protective layer. An anisotropic wet etching process is then performed in such a manner as to remove material from outside the included areas while leaving a projecting feature within each of the included areas. The protective layer is then removed to reveal the microneedles.
Abstract translation: 用于处理晶片以形成从基板突出的多个中空微针的方法包括通过使用干蚀刻工艺形成多个凹陷特征组，每组包括展开以形成具有开口形状的开口形状的至少一个凹槽， 包括区域和位于所包含区域内的至少一个孔。 然后用保护层涂覆孔和槽的内表面。 然后以这样的方式进行各向异性湿法蚀刻工艺，以便在包含区域的外部移除材料，同时在每个所包含的区域内留下突出特征。 然后去除保护层以显露微针。
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公开(公告)号：US08454844B2
公开(公告)日：2013-06-04
申请号：US12958437
申请日：2010-12-02
Applicant: Yehoshua Yeshurun , Mier Hefetz , Meint De Boer , Erwin J W Berenschot , Hans Gardeniers
Inventor： Yehoshua Yeshurun , Mier Hefetz , Meint De Boer , Erwin J W Berenschot , Hans Gardeniers
IPC: C25F3/00
CPC classification number: B81C1/005 , A61M37/0015 , A61M2037/003 , A61M2037/0053 , B81B2203/0361
Abstract: A method for processing a wafer to form a plurality of hollow microneedles projecting from a substrate includes forming, by use of a dry etching process, a number of groups of recessed features, each including at least one slot deployed to form an open shape having an included area and at least one hole located within the included area. The internal surfaces of the holes and the slots are then coated with a protective layer. An anisotropic wet etching process is then performed in such a manner as to remove material from outside the included areas while leaving a projecting feature within each of the included areas. The protective layer is then removed to reveal the microneedles.
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公开(公告)号：US20110073560A1
公开(公告)日：2011-03-31
申请号：US12958437
申请日：2010-12-02
Applicant: Yehoshua Yeshurun , Mier Hefetz , Meint De Boer , J.W. Berenschot , J.G.E. Gardeniers
Inventor： Yehoshua Yeshurun , Mier Hefetz , Meint De Boer , J.W. Berenschot , J.G.E. Gardeniers
IPC: B05D3/10
CPC classification number: B81C1/005 , A61M37/0015 , A61M2037/003 , A61M2037/0053 , B81B2203/0361
Abstract: A method for processing a wafer to form a plurality of hollow microneedles projecting from a substrate includes forming, by use of a dry etching process, a number of groups of recessed features, each including at least one slot deployed to form an open shape having an included area and at least one hole located within the included area. The internal surfaces of the holes and the slots are then coated with a protective layer. An anisotropic wet etching process is then performed in such a manner as to remove material from outside the included areas while leaving a projecting feature within each of the included areas. The protective layer is then removed to reveal the microneedles.
Abstract translation: 用于处理晶片以形成从基板突出的多个中空微针的方法包括通过使用干蚀刻工艺形成多个凹陷特征组，每组包括展开以形成具有 包括区域和位于所包含区域内的至少一个孔。 然后用保护层涂覆孔和槽的内表面。 然后以这样的方式进行各向异性湿法蚀刻工艺，以便在包含区域的外部移除材料，同时在每个所包含的区域内留下突出特征。 然后去除保护层以显露微针。
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公开(公告)号：US06924087B2
公开(公告)日：2005-08-02
申请号：US10397359
申请日：2003-03-27
Applicant: Yehoshua Yeshurun , Meir Hefetz , Erwin Berenschot , Meint de Boer , Dominique Maria Altpeter , Garrit Boom
Inventor： Yehoshua Yeshurun , Meir Hefetz , Erwin Berenschot , Meint de Boer , Dominique Maria Altpeter , Garrit Boom
CPC classification number: A61M37/0015 , A61M2037/003 , A61M2037/0053 , G03F7/00 , G03F7/0035 , Y10S430/167
Abstract: A method for producing microneedles. The method including disposing a first layer of a radiation sensitive polymer on to a working surface and selectively irradiating the first layer such that the first layer has at least one irradiated region and at least one non-irradiated region. The method also including developing the first layer so as to selectively remove one of the at least one irradiated region and the at least one non-irradiated region such that, at least part of at least one remaining region at least partially defines a form of at least part of a microneedle structure. A microneedle structure including a plurality of microneedles at least partially formed from a radiation sensitive polymer.
Abstract translation: 一种生产微针的方法。 该方法包括将辐射敏感聚合物的第一层设置在工作表面上并选择性地照射第一层，使得第一层具有至少一个照射区域和至少一个未照射区域。 该方法还包括显影第一层以便选择性地去除至少一个照射区域和至少一个未照射区域中的一个，使得至少一个剩余区域的至少一部分至少部分地限定了 至少部分微针结构。 包括至少部分由辐射敏感聚合物形成的多个微针的微针结构。
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