公开(公告)号：US5211565A

公开(公告)日：1993-05-18

申请号：US854312

申请日：1992-03-19

Applicant: Nicholas J. Krajewski ,  Carl D. Breske ,  David J. Johnson ,  David R. Kiefer ,  Kent T. McDaniel ,  William T. Moore, Jr. ,  Michael R. Edwards ,  Bricky A. Stephenson ,  Anthony A. Vacca

Inventor： Nicholas J. Krajewski ,  Carl D. Breske ,  David J. Johnson ,  David R. Kiefer ,  Kent T. McDaniel ,  William T. Moore, Jr. ,  Michael R. Edwards ,  Bricky A. Stephenson ,  Anthony A. Vacca

IPC: H01R4/01 ,  H01R12/50 ,  H01R12/71 ,  H01R12/79 ,  H01R12/82 ,  H05K1/14 ,  H05K3/32 ,  H05K3/40 ,  H05K7/14

CPC classification number: H01R12/71 ,  H01R12/79 ,  H01R12/82 ,  H01R23/68 ,  H01R4/01 ,  H05K7/1444 ,  H05K1/14 ,  H05K1/145 ,  H05K3/325 ,  H05K3/403

Abstract: The invention comprises a plurality of stacked planar processing circuit boards surrounded on at least one side by a plurality of memory boards located substantially perpendicular to the planar processing boards, the processing and memory boards connected by orthogonal interconnect modules. The orthogonal interconnect modules allow closely-spaced orthogonal connection of the processing boards to the memory boards. The memory boards are of a densely packed design having a plurality of removeable memory chip stacks located on the memory boards.

Abstract translation: 本发明包括多个层叠的平面处理电路板，其由至少一侧由基本上垂直于平面处理板定位的多个存储器板，由正交互连模块连接的处理器和存储器板包围。 正交互连模块允许处理板与存储板的紧密间隔的正交连接。 存储器板具有密集封装的设计，其具有位于存储器板上的多个可移除的存储芯片堆叠。

公开(公告)号：US5195237A

公开(公告)日：1993-03-23

申请号：US814067

申请日：1991-12-24

Applicant: Seymour R. Cray ,  Nicholas J. Krajewski

Inventor： Seymour R. Cray ,  Nicholas J. Krajewski

IPC: H01L21/48 ,  H01L21/607 ,  H01L23/538 ,  H01L25/065 ,  H05K3/30 ,  H05K3/32 ,  H05K3/36

CPC classification number: H01L24/11 ,  H01L21/4853 ,  H01L23/5384 ,  H01L23/5385 ,  H01L25/0655 ,  H01L25/0657 ,  H01R12/523 ,  H05K3/308 ,  H05K3/328 ,  H05K3/36 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/4943 ,  H01L2224/78301 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2225/06593 ,  H01L2225/06596 ,  H01L24/45 ,  H01L24/49 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01204 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H05K2201/096 ,  H05K2201/1059 ,  H05K2201/10825 ,  H05K2201/10909 ,  H05K2201/10946 ,  H05K2203/0495 ,  H05K3/368 ,  Y10T29/4914 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/4979

Abstract: A method and apparatus for interconnecting electronic circuits using nearly pure soft annealed gold mechanically compressed within through-plated holes. The invention has its application in attaching integrated circuit dice directly to circuit boards by ball bonding gold wires to the bonding pads of the integrated circuit dice in a substantially perpendicular relationship to the surfaces of the dice and inserting the gold leads into through-plated holes of circuit boards which provide an electrical and a mechanical connection once the leads are compressed within the through-plated holes. The present invention also finds its application in the interconnection of sandwiched circuit board assemblies where soft gold lead wires are inserted into axially aligned through-plated holes of the circuit boards and compressed so that the gold lead wires compress and buckle within the through-plated holes, forming an electrical connection between the circuit boards.

Abstract translation: 一种使用在纯通孔内机械压缩的近纯软质退火金的电子电路互连的方法和装置。 本发明的应用是将集成电路芯片直接连接到电路板上，通过将金线以与芯片表面基本垂直的方式与集成电路芯片的焊盘焊接在一起，将金线插入到通孔的通孔中 一旦导线在穿透孔内被压缩就提供电气和机械连接的电路板。 本发明还将其应用于夹层电路板组件的互连中，其中软金导线插入到电路板的轴向对齐的通孔中并被压缩，使得金引线在穿透孔内压缩和弯曲 在电路板之间形成电连接。

公开(公告)号：US5152696A

公开(公告)日：1992-10-06

申请号：US679653

申请日：1991-04-02

Applicant: Nicholas J. Krajewski ,  David J. Johnson ,  Arthur O. Kunstmann

Inventor： Nicholas J. Krajewski ,  David J. Johnson ,  Arthur O. Kunstmann

IPC: H05K3/30 ,  H05K3/36

CPC classification number: H05K3/368 ,  H01R12/523 ,  H05K2201/0311 ,  H05K2201/096 ,  H05K2201/1059 ,  H05K2201/10856 ,  H05K2201/10909 ,  H05K3/308 ,  Y10S439/931

Abstract: Z-axis connectors for interconnecting stacked printed circuit boards are formed from resilient material and have contact sections larger than cooperating through-plated holes formed in the boards. The connectors are drawn through the through-plated holes in the stacked circuit board, causing the contact section of the connector to frictionally engage the through-plated holes on at least two boards.

Abstract translation: 用于互连堆叠印刷电路板的Z轴连接器由弹性材料形成，并且具有大于在板中形成的协作通孔的接触部分。 连接器通过堆叠电路板中的通孔被拉出，使得连接器的接触部分摩擦地接合至少两个板上的通孔。

公开(公告)号：US5167511A

公开(公告)日：1992-12-01

申请号：US618603

申请日：1990-11-27

Applicant: Nicholas J. Krajewski ,  Carl D. Breske ,  David J. Johnson ,  David R. Kiefer ,  Kent T. McDaniel ,  William T. Moore, Jr. ,  Michael R. Edwards ,  Bricky A. Stephenson ,  Anthony A. Vacca

Inventor： Nicholas J. Krajewski ,  Carl D. Breske ,  David J. Johnson ,  David R. Kiefer ,  Kent T. McDaniel ,  William T. Moore, Jr. ,  Michael R. Edwards ,  Bricky A. Stephenson ,  Anthony A. Vacca

IPC: H01R4/01 ,  H01R12/50 ,  H01R12/62 ,  H01R12/71 ,  H01R12/82 ,  H05K1/14 ,  H05K3/32 ,  H05K3/40 ,  H05K7/14

CPC classification number: H01R12/62 ,  H01R12/71 ,  H01R12/82 ,  H01R23/68 ,  H01R4/01 ,  H05K7/1444 ,  H05K1/14 ,  H05K1/145 ,  H05K3/325 ,  H05K3/403

Abstract: The invention comprises a plurality of stacked planar processing circuit boards surrounded on at least one side by a plurality of memory boards located substantially perpendicular to the planar processing boards, the processing and memory boards connected by orthogonal interconnect modules. The orthogonal interconnect modules allow closely-spaced orthogonal connection of the processing boards to the memory boards. The memory boards are of a densely packed design having a plurality of removeable memory chip stacks located on the memory boards.

Abstract translation: 本发明包括多个层叠的平面处理电路板，其由至少一侧由基本上垂直于平面处理板定位的多个存储器板，由正交互连模块连接的处理器和存储器板包围。 正交互连模块允许处理板与存储板的紧密间隔的正交连接。 存储器板具有密集封装的设计，其具有位于存储器板上的多个可移除的存储芯片堆叠。

公开(公告)号：US5129830A

公开(公告)日：1992-07-14

申请号：US606168

申请日：1990-10-31

Applicant: Nicholas J. Krajewski ,  David J. Johnson ,  Arthur O. Kunstmann

Inventor： Nicholas J. Krajewski ,  David J. Johnson ,  Arthur O. Kunstmann

IPC: H05K3/30 ,  H05K3/36

CPC classification number: H05K3/368 ,  H01R12/523 ,  H05K2201/0311 ,  H05K2201/096 ,  H05K2201/1059 ,  H05K2201/10856 ,  H05K2201/10909 ,  H05K3/308

Abstract: Z-axis pin connectors for interconnecting stacked printed circuit boards are formed from resilient material and have contact sections larger than cooperating through-plated holes formed in the boards. The pin connectors are drawn through the through-plated holes in the stacked circuit board, causing the contact section of the pin connector to frictionally engage the through-plated holes on at least two boards.

Abstract translation: 用于互连堆叠印刷电路板的Z轴销连接器由弹性材料形成，并且具有大于在板中形成的协作通孔的接触部分。 引脚连接器通过堆叠电路板中的通孔被拉出，使得引脚连接器的接触部分摩擦地接合至少两个板上的通孔。

公开(公告)号：US20080147358A1

公开(公告)日：2008-06-19

申请号：US12006444

申请日：2008-01-02

Applicant: Daniel L. Kunkel ,  Mark L. Patterson ,  Nicholas J. Krajewski ,  Nancy Burgess ,  Mark J. Farley

Inventor： Daniel L. Kunkel ,  Mark L. Patterson ,  Nicholas J. Krajewski ,  Nancy Burgess ,  Mark J. Farley

IPC: G08B1/00 ,  G01J1/44

CPC classification number: G06Q10/08

Abstract: Sensors and techniques useful with operating an automated data acquisition and notification system having a plurality of receptacles adapted to store items. In each of the plurality of receptacles, at least one sensor is operated to detect a presence of an item in that receptacle. Light is emitted from a planar surface within the receptacle to a space within the receptacle opposite the planar surface. While that light is emitted light incident on the planar surface is detected. A determination is made whether an amount of light that is detected is significant to indicate a presence of the item.

Abstract translation: 用于操作具有适于存储物品的多个容器的自动数据采集和通知系统的传感器和技术。 在多个插座中的每一个中，操作至少一个传感器以检测在该容器中的物品的存在。 光从容器内的平坦表面发射到容器内与平面相对的空间。 当发出光时，检测到入射在平面上的光。 确定检测到的光量是否显着以指示物品的存在。

公开(公告)号：US5194710A

公开(公告)日：1993-03-16

申请号：US704067

申请日：1991-05-22

Applicant: Kent T. McDaniel ,  David J. Johnson ,  Nicholas J. Krajewski ,  David W. LeMay

Inventor： Kent T. McDaniel ,  David J. Johnson ,  Nicholas J. Krajewski ,  David W. LeMay

IPC: B23K26/02 ,  B23K26/06 ,  H01L21/60 ,  H05K3/34

CPC classification number: H01L24/80 ,  B23K26/037 ,  B23K26/066 ,  H05K3/3421 ,  H05K3/3494 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K2201/10689 ,  H05K2203/0195 ,  H05K2203/107 ,  H05K2203/304 ,  Y02P70/613

Abstract: An apparatus and method of making a beam of directed energy used to bond leads to bonding areas is disclosed. The masking tool preferably includes a groove adapted to allow the beam to strike the lead while masking the surrounding substrate to prevent damage to it. The tool preferably reflects the energy striking it away from the substrate. The method can include the use of an external heat source to provide heat to the bonding process or, in the alternative, provide heat sinking to protect the electrical components from heat damage. Alternate embodiments of the tool can include a plurality of grooves or slots to allow scanning of the beam in the bonding process.

Abstract translation: 公开了一种用于制造用于将引线键合到结合区域的定向能量束的装置和方法。 掩蔽工具优选地包括适于允许束撞击引线同时遮蔽周围基底以防止损坏引线的凹槽。 该工具优选地将其远离基板的能量反射出来。 该方法可以包括使用外部热源来为接合过程提供热量，或者替代地，提供散热以保护电气部件免受热损伤。 工具的替代实施例可以包括多个凹槽或槽，以允许在粘合过程中扫描光束。

公开(公告)号：US5112232A

公开(公告)日：1992-05-12

申请号：US657653

申请日：1991-02-15

Applicant: Seymour R. Cray ,  Nicholas J. Krajewski

Inventor： Seymour R. Cray ,  Nicholas J. Krajewski

IPC: H01L21/48 ,  H01L21/607 ,  H01R12/58 ,  H05K3/30 ,  H05K3/32 ,  H05K3/36

CPC classification number: H01L24/11 ,  H01L21/4853 ,  H01R12/523 ,  H05K3/308 ,  H05K3/328 ,  H05K3/36 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4943 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2225/06593 ,  H01L2225/06596 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K2201/096 ,  H05K2201/1059 ,  H05K2201/10825 ,  H05K2201/10909 ,  H05K2201/10946 ,  H05K2203/0495 ,  H05K3/368

Abstract: A method and apparatus for interconnecting electronic circuit boards through the use of twisted wire jumpers which are formed from multifilament wire and which have enlarged bird cages formed along the pins. The pins are drawn through a stack of circuit boards to position the cages in contact with interconnection aperture located in the printed circuit boards. The frictional engagement of the cages in the apertures provides both electrical interconnection of, and mechanical coupling between the printed circuit boards.This application is a division of co pending patent application Her. No. 07/347,507, filed May 4, 1989, now U.S. Pat. No. 5,014,419, issued May 14, 1991, U.S. Pat. application Ser. No. 07/347,507 was a continuation-in-part of application Ser. No. 07/053,142, filed May 21, 1989, now U.S. Pat. No. 5,054,192, issued Oct. 8, 1991. All of these applications and patents are assigned to the same assignee.

Abstract translation: 一种用于通过使用由多丝线形成并且具有沿着销形成的扩大的鸟笼的双绞线跳线来互连电子电路板的方法和装置。 引脚穿过电路板堆叠以将网格定位成与位于印刷电路板中的互连孔接触。 保持架在孔中的摩擦接合提供印刷电路板之间的电互连和机械耦合。 这个应用是她的共同未决专利申请的一个部门。 1989年5月4日提交的现在的美国专利No.07 / 347,507。 1991年5月14日授权的美国专利5,014,419。 应用程序 第07 / 347,507号是应用程序Ser的部分延续。 1989年5月21日提交的现在的美国专利No.07 / 053,142。 1991年10月8日授权的第5,054,192号。所有这些申请和专利都转让给同一受让人。

公开(公告)号：US5014419A

公开(公告)日：1991-05-14

申请号：US347507

申请日：1989-05-04

Applicant: Seymour R. Cray ,  Nicholas J. Krajewski

Inventor： Seymour R. Cray ,  Nicholas J. Krajewski

IPC: H01L21/48 ,  H01L21/607 ,  H01R11/01 ,  H01R12/52 ,  H01R43/16 ,  H05K3/30 ,  H05K3/32 ,  H05K3/36

CPC classification number: H01L24/11 ,  H01L21/4853 ,  H01R12/523 ,  H05K3/308 ,  H05K3/328 ,  H05K3/36 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4943 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2225/06593 ,  H01L2225/06596 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12033 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K2201/096 ,  H05K2201/1059 ,  H05K2201/10825 ,  H05K2201/10909 ,  H05K2201/10946 ,  H05K2203/0495 ,  H05K3/368 ,  Y10T29/49126 ,  Y10T29/4914 ,  Y10T29/49144 ,  Y10T29/49153

Abstract: A method and apparatus for interconnecting electronic circuit boards through the use of twisted wire jumpers which are formed from multifilament wire and which have enlarged bird cages formed along the pins. The pins are drawn through a stack of circuit boards to position the cages in contact with interconnection apertures located in the printed circuit boards. The frictional engagement of the cages in the apertures provides both electrical inter connection of, and mechanical coupling between the printed circuit boards.

Abstract translation: 一种用于通过使用由多丝线形成并且具有沿着销形成的扩大的鸟笼的双绞线跳线来互连电子电路板的方法和装置。 引脚穿过电路板堆叠，以将网格定位成与位于印刷电路板中的互连孔接触。 保持架在孔中的摩擦接合提供印刷电路板之间的电连接和机械耦合。

公开(公告)号：US5106310A

公开(公告)日：1992-04-21

申请号：US606577

申请日：1990-10-31

Applicant: Nicholas J. Krajewski ,  David J. Johnson ,  Arthur O. Kunstmann

Inventor： Nicholas J. Krajewski ,  David J. Johnson ,  Arthur O. Kunstmann

IPC: H01R12/58 ,  H05K3/30 ,  H05K3/36

CPC classification number: H01R12/523 ,  H05K3/368 ,  H05K2201/0311 ,  H05K2201/096 ,  H05K2201/1059 ,  H05K2201/10856 ,  H05K2201/10909 ,  H05K3/308 ,  Y10S439/931

Abstract: Z-axis pin connectors for interconnecting stacked printed circuit boards are formed from resilient material and have contact sections larger than cooperating through-plated holes formed in the boards. The pin connectors are drawn through the through-plated holes in the stacked circuit board, causing the contact section of the pin connector to frictionally engage the through-plated holes on at least two boards. Formation of pin connectors from a resilient thermoplastic material coated with a conductive layer is also disclosed.

Abstract translation: 用于互连堆叠印刷电路板的Z轴销连接器由弹性材料形成，并且具有大于在板中形成的协作通孔的接触部分。 引脚连接器通过堆叠电路板中的通孔被拉出，使得引脚连接器的接触部分摩擦地接合至少两个板上的通孔。 还公开了由涂覆有导电层的弹性热塑性材料形成销连接器。