公开(公告)号：US20100236823A1

公开(公告)日：2010-09-23

申请号：US12406850

申请日：2009-03-18

Applicant: LIEN-FEN HU ,  JORGE E. MARTINEZ-VARGAS, JR. ,  SAMUEL M. LEE ,  KARL A. SAUTER ,  AARON MENDELSOHN

Inventor： LIEN-FEN HU ,  JORGE E. MARTINEZ-VARGAS, JR. ,  SAMUEL M. LEE ,  KARL A. SAUTER ,  AARON MENDELSOHN

IPC: H05K1/11 ,  H05K3/00

CPC classification number: H05K1/116 ,  H05K1/0201 ,  H05K3/3447 ,  H05K3/3468 ,  H05K3/429 ,  H05K2201/062 ,  H05K2201/09627 ,  H05K2201/0979 ,  Y10T29/49155

Abstract: Systems and methods for providing plated through-holes (PTH) in PCBs, which advantageously allow improved soldering capabilities, are described herein. Such systems and methods are achieved by reducing the heat sinking effects of PTHs by providing one or more vias surrounding the PTHs to provide an electrical connection between the PTH and the internal and bottom conductive layers of a PCB. In this regard, the PTHs are spaced apart from at least one of the internal conductive layers (e.g., ground or power layers), so the heat sinking effects are reduced. This feature enables molten solder to substantially fill the entire PTH before freezing, thereby improving the mechanical and electrical connection between an electrical component and the PCB.

Abstract translation: 本文描述了用于在PCB中提供电镀通孔（PTH）的系统和方法，其有利地允许改进的焊接能力。 通过提供围绕PTH的一个或多个通孔来提供PTH与PCB的内部和底部导电层之间的电连接来减少PTH的散热效应来实现这种系统和方法。 在这方面，PTH与至少一个内部导电层（例如，接地层或功率层）间隔开，因此降低了散热效果。 该特征使得熔融焊料在冷冻之前基本上填充整个PTH，从而改善电气部件和PCB之间的机械和电连接。