Abstract:
A plasma control apparatus includes a power source unit, a resonance producing unit, and a voltmeter. The resonance producing unit includes an LC circuit formed by a coil L1 and a capacitor C1 connected to each other, and a sensor S2 configured to detect a phase difference between current flowing in and voltage applied to the LC circuit, and the capacitor C1 of the LC circuit has a capacitance larger than an expected capacitance of the plasma P. The power source unit 1 configured to control the magnitude of radio-frequency power to be supplied in such a manner as to bring the voltage measured with the voltmeter 5 close to a set voltage as a target, and controls the frequency of the radio-frequency power to be supplied in such a manner as to minimize the phase difference detected with the sensor S2.
Abstract:
A heating device capable of efficiently heating an object to be heated with a small heating element and a plasma processing apparatus provided with the heating device are provided. A plasma processing apparatus 1 includes a processing chamber 2 having a plasma generating space 3a defined in an upper portion thereof and a processing space 4a defined in a lower portion thereof, a platen 9 disposed in the processing space 4a for placing a substrate K thereon, a processing gas supply unit 7 supplying a processing gas into the plasma generating space 3a, a plasma generating unit 5 generating plasma from the processing gas supplied into the plasma generating space 3a by RF power, a plasma-generation RF power supply 6 supplying RF power to the plasma generating unit 5, and a heating device 13. The heating device 13 is composed of a heating element 14 including a conductor having a product ρ·μ [Ω·H] of its electrical resistivity ρ [Ω·m] and its magnetic permeability μ [H/m] equal to or greater than 8.0×10−13, and a heating RF power supply 16 supplying RF power to the heating element 14.
Abstract:
A plasma etching apparatus 1 includes a processing chamber 2 having a plasma generating portion 3, a processing portion 4, an exhaust portion 5, and a manifold portion 6 defined inside, and an exhaust mechanism 30 for exhausting gas in the processing chamber 2, the exhaust mechanism 30 is composed of a vacuum pump 31 having an intake port connected to an opening 8, a valve body 32 inserted through an opening 9, and a moving mechanism 34 for moving the valve body 32 in upward and downward directions, and the intake port of the vacuum pump 31 is connected to the opening 8 which is formed in a third chamber 2c forming a part of the processing chamber 2.
Abstract:
A maintenance support system includes a terminal including an imaging device, a device configured to identify a three-dimensional area TA including a maintenance target T with reference to a predetermined reference point, a device for identifying a position (vector A) of the imaging device in an initial state with respect to the reference point, a device for identifying a change of position (vector B) from the initial state of the imaging device, a device for identifying a position (vector C) of the reference point with reference to the imaging device in a post-movement state in which the terminal has moved, and identifying a pixel area corresponding to the three-dimensional area in a captured image, and a device for generating a processed image in which a portion other than the pixel area is made invisible. A communication device is provided for transmitting the processed image to a support terminal.
Abstract:
Provided are a production process determination device for a substrate processing apparatus, which can easily suppress deterioration of determination accuracy, and the like. A production process determination device 20 includes a process log acquisition section 21 that acquires process log data of a substrate processing apparatus 10, and a determination section 22 that creates input data based on the process log data and performs determination regarding production process in the substrate processing apparatus based on the input data. The determination section includes multiple learning models 25 each of which receives input of the input data and each of which outputs a determination result regarding the production process, and the multiple learning models are generated by performing machine learning by use of mutually different training datasets. The determination section can switch the learning model to be used for determination among the multiple learning models.
Abstract:
Provided is an abnormality detection apparatus and the like capable of quickly and accurately detecting lifting abnormality of a substrate attributable to detachment failure of a substrate from an electrostatic chuck, or the like. An abnormality detection apparatus 100 includes a measurement section 2 configured to measure a parameter having a correlation with load applied to a lifting mechanism 4; and a detection section 3 configured to detect lifting abnormality of a substrate S. The detection section 3 includes a learning model 31 generated by using machine learning, in which the learning model 31 receives, as input, a plurality of measurements of the parameter continuously measured by the measurement section 2 during lifting-up of the substrate S by the lifting mechanism 4, and outputs a level of lifting abnormality of the substrate S.
Abstract:
Provided is a substrate placing table (15) capable of reducing influences of external factors such as the temperature inside a chamber (11). The substrate placing table (15) disposed in the chamber (11) in a plasma processing apparatus (1) includes an electrostatic chuck (61) and a cooling jacket (62), and the electrostatic chuck (61) consists of an upper disk part (61a) having an electrode (71) for electrostatic attraction incorporated therein, and a lower disk part (61 b) having a greater diameter than the upper disk part (61a) and having a heater (72) incorporated therein. A focus ring (64) disposed outside the upper disk part (61a) in a radial direction of the upper disk part (61a) and covering an upper surface of the lower disk part (61 b), an upper annular cover (65) for thermal insulation enclosing the lower disk part (61 b) and at least a part of the cooling jacket (62), and a lower annular cover (66) for thermal insulation clamping the cooling jacket (62) between itself and the upper annular cover (65) are made of ceramics.
Abstract:
A method of reducing carbon and/or hydrogen atom content ratio relative to contents of silicon atoms and nitrogen atoms in a silicon nitride film formed by a plasma CVD method using an organic silane as a material, and improving film quality such as electrical properties. A silicon nitride film is formed with the organic silane and at least one additive gas selected from a group consisting of hydrogen and ammonia by a plasma CVD method. The silicon nitride film has a carbon atom content ratio of less than 0.8 assuming that a sum of a silicon atom content and a nitrogen atom content in the silicon nitride film is 1. The silicon nitride film has improved properties such as reduced leakage current.
Abstract:
A maintenance support system prevents leakage of confidential information by excluding a maintenance target while imposing few restrictions on imaging conditions. A maintenance support system 100 includes a wearable terminal 1 including an imaging device 12, a first identifying device 31 configured to identify a first three-dimensional area TA including a maintenance target T with reference to a predetermined reference point M, and a second identifying device 32 configured to identify a mask pixel area excluding an effective pixel area corresponding to the first three-dimensional area for a captured image acquired by the imaging device in a post-movement state in which the wearable terminal has moved. A processed-image generating device 33 is configured to generate a processed image in which the mask pixel area is made invisible and a communication device 34 is configured to transmit the processed image to a support terminal 2.
Abstract:
A plasma processing apparatus 100, which has an impact on global warming and allows for high-throughput plasma processing, includes a chamber 1 in which plasma is generated, a mounting table 2 disposed in the chamber, wherein a substrate S is mounted on the mounting table 2, and a gas supply source 3 (3a to 3d) for supplying gas for generating plasma in the chamber, wherein the substrate is subjected to deep etching by executing alternately and repeatedly an etching process S2 of etching the substrate by using plasma and a protective film deposition process S3 of depositing a protective film in a recess formed through the etching process by using plasma. It is characterized in that, in the protective film deposition process S3, a mixed gas of C4F8 and 2,3,3,3-tetrafluoropropene is supplied from the gas supply sources 3b, 3c into the chamber as gas supplied for generating plasma.