公开(公告)号：US20060209516A1

公开(公告)日：2006-09-21

申请号：US11082547

申请日：2005-03-17

Applicant: Suresh Chengalva ,  Bruce Myers ,  Matthew Walsh

Inventor： Suresh Chengalva ,  Bruce Myers ,  Matthew Walsh

IPC: H05K7/20

CPC classification number: H01L23/367 ,  H01L23/3675 ,  H01L23/4275 ,  H01L23/433 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An electronic assembly with integral thermal transient suppression includes an integrated circuit (IC) chip disposed within a cavity of an IC device package. A transient thermal suppression material (TTSM) is disposed in the cavity in thermal contact with the IC chip. A heat sink may also be provided in thermal contact with the chip. When present, the heat sink serves as a cover of the packaged IC chip and may include fins extending from an upper surface (in contact with air) and a lower surface (in thermal contact with the TTSM). The TTSM may be thought of as a phase change material that absorbs energy dissipated by the IC chip in a phase change event.

Abstract translation: 具有整体热瞬变抑制的电子组件包括设置在IC器件封装的腔内的集成电路（IC）芯片。 瞬态热抑制材料（TTSM）设置在与IC芯片热接触的空腔中。 还可以提供与芯片热接触的散热器。 当存在时，散热器用作封装的IC芯片的盖，并且可以包括从上表面（与空气接触）和下表面（与TTSM热接触）延伸的翅片。 TTSM可以被认为是在相变事件中吸收由IC芯片消耗的能量的相变材料。

公开(公告)号：US20060120058A1

公开(公告)日：2006-06-08

申请号：US10904904

申请日：2004-12-03

Applicant: Manuel Fairchild ,  David Zimmerman ,  Suresh Chengalva

Inventor： Manuel Fairchild ,  David Zimmerman ,  Suresh Chengalva

IPC: H05K7/06 ,  H05K7/20

CPC classification number: H05K1/021 ,  H01L23/13 ,  H01L23/36 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/5389 ,  H01L24/48 ,  H01L25/16 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/4847 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19107 ,  H05K1/0306 ,  H05K1/183 ,  H05K3/0061 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/09745 ,  H05K2201/1056 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A circuit board assembly having a laminate construction of multiple layers, such as a LTCC ceramic substrate, with conductor lines between adjacent pairs of layers. A heat sink is bonded to a first surface of the substrate, and a cavity is defined by and between the heat sink and the substrate such that a base wall of the cavity is defined by one of the layers with conductor lines thereof being present on the base wall. A surface-mount circuit device is received within the cavity, mounted to the base wall, and electrically connected to the conductor lines on the base wall. The device is received within the cavity such that a surface of the device contacts a surface region of the heat sink. The surface of the device is bonded to the surface region of the heat sink to provide a substantially direct thermal path from the device to the heat sink.

Abstract translation: 一种具有多层叠层结构的电路板组件，例如LTCC陶瓷衬底，在相邻层之间具有导体线。 散热器结合到基板的第一表面，并且空腔由散热器和基板之间和之间限定，使得空腔的底壁由其中一个层限定，其导体线存在于 底墙。 表面安装电路器件被容纳在腔内，安装到底壁上，并且电连接到底壁上的导体线。 该装置被容纳在腔体内，使得该装置的表面接触散热器的表面区域。 装置的表面结合到散热器的表面区域，以提供从装置到散热器的基本上直接的热路径。

公开(公告)号：US20060038284A1

公开(公告)日：2006-02-23

申请号：US10919625

申请日：2004-08-17

Applicant: Scott Brandenburg ,  Suresh Chengalva ,  Thomas Degenkolb

Inventor： Scott Brandenburg ,  Suresh Chengalva ,  Thomas Degenkolb

IPC: H01L23/34

CPC classification number: H01L23/473 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/00 ,  H01L2224/0401

Abstract: An encapsulated microelectronic package includes a fluid conducting cooling tube directly coupled to one or more semiconductor chips, with the encapsulant being molded over the semiconductor chips and portions of the cooling tube in proximity to the semiconductor chips. The encapsulant immobilizes the cooling tube with respect to the semiconductor chips, and the cooling tube and encapsulant are designed to minimize differences in their coefficients of thermal expansion relative to the semiconductor chips.

公开(公告)号：US20050109534A1

公开(公告)日：2005-05-26

申请号：US10717839

申请日：2003-11-20

Applicant: Suresh Chengalva ,  David Ihms ,  Bruce Myers

Inventor： Suresh Chengalva ,  David Ihms ,  Bruce Myers

IPC: H05K1/02 ,  H05K3/00 ,  H05K1/18

CPC classification number: H05K1/0206 ,  H01L2224/16225 ,  H01L2224/73204 ,  H05K1/0271 ,  H05K3/0061 ,  H05K2201/068 ,  H05K2201/10204 ,  H05K2201/10545 ,  H05K2201/10674 ,  H05K2201/2009

Abstract: A circuit board assembly comprising a laminate substrate and a surface mount device having a CTE less than that of the laminate substrate and attached with at least one solder joint to a first surface of the laminate substrate. The assembly further includes a localized stiffener attached to a second surface of the laminate substrate so as to be directly opposite the circuit device. The localized stiffener is formed of a material and is shaped so that, when attached to the laminate substrate, the stiffener is capable of increasing the thermal cycle fatigue life of the one or more solder joints that attach the device to the substrate.

Abstract translation: 一种电路板组件，包括层压基板和表面安装装置，所述表面安装装置的CTE小于层压基板的CTE，并且与至少一个焊接接头连接到层叠基板的第一表面。 组件还包括附着到层叠基板的第二表面以便与电路装置直接相对的局部加强件。 局部加强件由材料形成并且被成形为使得当附接到层叠基板时，加强件能够增加将该装置附接到基板的一个或多个焊点的热循环疲劳寿命。

公开(公告)号：US20070114656A1

公开(公告)日：2007-05-24

申请号：US11654318

申请日：2007-01-17

Applicant: Scott Brandenburg ,  Suresh Chengalva ,  Thomas Degenkolb

Inventor： Scott Brandenburg ,  Suresh Chengalva ,  Thomas Degenkolb

IPC: H01L23/34

CPC classification number: H01L23/473 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/00 ,  H01L2224/0401

Abstract: An encapsulated microelectronic package includes a fluid conducting cooling tube directly coupled to one or more semiconductor chips, with the encapsulant being molded over the semiconductor chips and portions of the cooling tube in proximity to the semiconductor chips. The encapsulant immobilizes the cooling tube with respect to the semiconductor chips, and the cooling tube and encapsulant are designed to minimize differences in their coefficients of thermal expansion relative to the semiconductor chips.

公开(公告)号：US20050077614A1

公开(公告)日：2005-04-14

申请号：US10683009

申请日：2003-10-10

Applicant: Suresh Chengalva ,  Dwadasi Sarma ,  David Zimmerman ,  Larry Mandel ,  Kevin Gertiser

Inventor： Suresh Chengalva ,  Dwadasi Sarma ,  David Zimmerman ,  Larry Mandel ,  Kevin Gertiser

IPC: H01L23/42 ,  H01L25/065 ,  H01L23/10

CPC classification number: H01L23/42 ,  H01L25/0655 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An electronic package having enhanced heat dissipation is provided exhibiting dual conductive heat paths in opposing directions. The package includes a substrate and a semiconductor device mounted to the substrate. The semiconductor device has electrical circuitry a first surface, and a second surface oppositely disposed from the first surface. A thermally conductive heat sink is assembled over the semiconductor device such that a cavity is formed between the semiconductor device and the heat sink. A thermally conductive and electrically insulative material is disposed in the cavity between the semiconductor device and the heat sink.

Abstract translation: 提供具有增强的散热的电子封装，其呈现出相反方向上的双重传导热路径。 封装包括衬底和安装到衬底的半导体器件。 半导体器件具有第一表面的电路和与第一表面相对设置的第二表面。 在半导体器件上组装导热散热器，使得在半导体器件和散热器之间形成腔体。 导热和电绝缘材料设置在半导体器件和散热器之间的空腔中。

公开(公告)号：US20060285300A1

公开(公告)日：2006-12-21

申请号：US11155371

申请日：2005-06-17

Applicant: Scott Brandenburg ,  Suresh Chengalva

Inventor： Scott Brandenburg ,  Suresh Chengalva

IPC: H05K7/20

CPC classification number: H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A cooled electronic assembly includes an integrated-circuit device carrier (such as a printed circuit board), a device (such as a flip chip), a liquid pump, a molding material, a heat exchanger, and a cover. The device and the liquid pump are electrically connected to the integrated-circuit device carrier. The molding material is molded to the device, to the liquid pump, and to the integrated-circuit device carrier. The cover has a coolant channel fluidly connected to the heat exchanger, wherein the cover is attached to the molding material. The coolant channel and the heat exchanger together at least partially define a closed coolant circuit. The liquid pump is operatively connected to the closed coolant circuit. A method for cooling a printed circuit board includes placing a liquid coolant in the closed coolant circuit and electrically activating the liquid pump through the printed circuit board.

Abstract translation: 冷却的电子组件包括集成电路器件载体（例如印刷电路板），器件（例如倒装芯片），液体泵，成型材料，热交换器和盖。 该装置和液体泵电连接到集成电路装置载体。 模制材料被模制到装置，液体泵和集成电路装置载体上。 盖具有流体地连接到热交换器的冷却剂通道，其中盖附接到模制材料。 冷却剂通道和热交换器一起至少部分地限定了封闭的冷却剂回路。 液体泵可操作地连接到封闭的冷却剂回路。 一种用于冷却印刷电路板的方法包括将液体冷却剂放置在封闭的冷却剂回路中并通过印刷电路板电激活液体泵。

公开(公告)号：US20050081377A1

公开(公告)日：2005-04-21

申请号：US10963455

申请日：2004-10-13

Applicant: Scott Brandenburg ,  Bruce Myers ,  Jeenhuei Tsai ,  Suresh Chengalva

Inventor： Scott Brandenburg ,  Bruce Myers ,  Jeenhuei Tsai ,  Suresh Chengalva

IPC: H05K1/02 ,  H05K3/28 ,  H05K5/06 ,  H05K9/00 ,  H01L21/44

CPC classification number: H05K5/065 ,  H05K1/0203 ,  H05K3/284 ,  H05K9/0045 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49171 ,  Y10T29/49172

Abstract: An overmolded electronic assembly having an electromagnetic interference shield, in the form of a thin metal film or foil, coupled to the top of or within an overmolded body. The shield effectively reduces the amount of electromagnetic interference (“EMI”) emissions from penetrating within the assembly to the circuit board without substantially increasing the cost of the unit. Thus, an electronic assembly having improved vibration, moisture, and EMI emission resistance is achieved as compared with traditional overmolded or metal assemblies. Further, because the shield can be formed on the electronic assembly in one continuous processing step, a substantial savings in time and cost for the manufacturing process is also realized.

Abstract translation: 一种包覆成型的电子组件，其具有金属薄膜或薄片形式的电磁干扰屏蔽件，该电磁干扰屏蔽件耦合到包覆成型体的顶部或内部。 屏蔽有效地减少了组件内电路干扰（“EMI”）的发射量，而不会大大增加设备的成本。 因此，与传统的包覆成型或金属组件相比，实现了具有改善的振动，湿度和EMI排放电阻的电子组件。 此外，由于可以在一个连续的处理步骤中在电子组件上形成屏蔽，所以也实现了制造过程的显着节省时间和成本。

公开(公告)号：US20050078456A1

公开(公告)日：2005-04-14

申请号：US10683015

申请日：2003-10-10

Applicant: Larry Mandel ,  Kevin Gertiser ,  Suresh Chengalva ,  Dwadasi Sarma ,  David Zimmerman

Inventor： Larry Mandel ,  Kevin Gertiser ,  Suresh Chengalva ,  Dwadasi Sarma ,  David Zimmerman

IPC: H01L21/48 ,  H01L21/56 ,  H01L23/367 ,  H01L23/42 ,  H01L23/427 ,  H05K7/20 ,  F28F7/00

CPC classification number: H01L23/427 ,  H01L21/4878 ,  H01L21/4882 ,  H01L21/563 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/42 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/73253 ,  Y10T29/49144

Abstract: An electronic package having enhanced heat dissipation is provided exhibiting dual conductive heat paths in opposing directions. The package includes a substrate having electrical conductors thereon and a flip chip mounted to the substrate. The flip chip has a first surface, solder bumps on the first surface, and a second surface oppositely disposed from the first surface. The flip chip is mounted to the substrate such that the solder bumps are registered with the conductors on the substrate. The package further includes a stamped metal heat sink in heat transfer relationship with the second surface of the flip chip. The heat sink includes a cavity formed adjacent to the flip chip containing a thermally conductive material.

Abstract translation: 提供具有增强的散热的电子封装，其呈现出相反方向上的双重传导热路径。 封装包括其上具有电导体的基板和安装到基板的倒装芯片。 倒装芯片具有第一表面，第一表面上的焊料凸块和与第一表面相对设置的第二表面。 倒装芯片安装到基板上，使得焊料凸块与基板上的导体对准。 该封装还包括与倒装芯片的第二表面传热关系的冲压金属散热器。 散热器包括与包含导热材料的倒装芯片相邻形成的空腔。

公开(公告)号：US20070064399A1

公开(公告)日：2007-03-22

申请号：US11583316

申请日：2006-10-19

Applicant: Larry Mandel ,  Kevin Gertiser ,  Suresh Chengalva ,  Dwadasi Sarma ,  David Zimmerman

Inventor： Larry Mandel ,  Kevin Gertiser ,  Suresh Chengalva ,  Dwadasi Sarma ,  David Zimmerman

IPC: H05K7/20

CPC classification number: H01L23/427 ,  H01L21/4878 ,  H01L21/4882 ,  H01L21/563 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/42 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/73253 ,  Y10T29/49144

Abstract: An electronic package having enhanced heat dissipation is provided exhibiting dual conductive heat paths in opposing directions. The package includes a substrate having electrical conductors thereon and a flip chip mounted to the substrate. The flip chip has a first surface, solder bumps on the first surface, and a second surface oppositely disposed from the first surface. The flip chip is mounted to the substrate such that the solder bumps are registered with the conductors on the substrate. The package further includes a stamped metal heat sink in heat transfer relationship with the second surface of the flip chip. The heat sink includes a cavity formed adjacent to the flip chip containing a thermally conductive material.