公开(公告)号：US20030180448A1

公开(公告)日：2003-09-25

申请号：US10105812

申请日：2002-03-21

Applicant: T.L.M. ADVANCED LASER TECHNOLOGY LTD.

Inventor： Edward Brook-Levinson ,  Michael Kogan ,  Paikin Vacheslav

IPC: B05D005/12

CPC classification number: H05K3/107 ,  H05K3/0032 ,  H05K3/105 ,  H05K3/185 ,  H05K2201/0347 ,  H05K2201/0376 ,  H05K2201/09036 ,  H05K2203/107 ,  H05K2203/125

Abstract: The present invention provides a method for the production of a patterned structure for printed circuit boards (PCBs), or intermediate layer for multilayer PCBs, comprising: (i) providing an electrically insulating substrate; (ii) applying electromagnetic radiation to the substrate to selectively create in said substrate vias and/or grooves and thereby produce a patterned substrate wherein the vias and/or the grooves correspond to the desired pattern of plated vias and/or conductive tracks; (iii) applying a solution of one or more soluble metal salts, on one or both sides of the patterned substrate obtained in step (ii) so as to form, upon drying, a metal salt-based layer on the surface of the substrate and the inner surfaces of the vias and/or the grooves; (iv) selectively irradiate said vias and/or grooves with a laser beam; (v) removing the metal salt-based layer from the non-irradiated surfaces of one or both sides of the substrate, while leaving said layer on the inner surfaces of the laser-irradiated vias and/or grooves; and (vi) depositing a conductive material on said vias and/or grooves inner surfaces so as to obtain an electrically insulating substrate comprising a desired pattern of plated, conductive vias and/or conductive tracks.

Abstract translation: 本发明提供一种用于生产用于印刷电路板（PCB）或多层PCB的中间层的图案化结构的方法，包括：（i）提供电绝缘基板; （ii）向所述衬底施加电磁辐射以在所述衬底通孔和/或沟槽中选择性地产生，从而产生图案化衬底，其中所述通孔和/或所述凹槽对应于所需的电镀通孔和/或导电轨迹图案; （iii）在步骤（ii）中获得的图案化衬底的一侧或两侧上施加一种或多种可溶性金属盐的溶液，以在干燥后形成在衬底表面上的金属盐基层，以及 通孔和/或沟槽的内表面; （iv）用激光束选择性地照射所述通孔和/或凹槽; （v）从衬底的一侧或两侧的未照射表面上除去金属盐基层，同时将所述层留在激光照射过的通孔和/或沟槽的内表面上; 和（vi）在所述通孔和/或沟槽内表面上沉积导电材料，以便获得包含所需图案的电镀导电通路和/或导电轨迹的电绝缘衬底。