公开(公告)号：US20100238067A1

公开(公告)日：2010-09-23

申请号：US12661383

申请日：2010-03-16

Applicant: Kento Nakabayashi ,  Kazuma Natsume ,  Yuu Watanabe ,  Takuya Kouya

Inventor： Kento Nakabayashi ,  Kazuma Natsume ,  Yuu Watanabe ,  Takuya Kouya

IPC: G01S13/32 ,  H01Q21/00 ,  G01S13/00

CPC classification number: H01Q21/08 ,  H01Q13/206 ,  H01Q21/0075

Abstract: The array antenna includes a feed line, and a plurality of radiating element sections arranged at a predetermined arranging interval in a first direction, each of the radiating element sections including at least one radiating element fed a traveling wave through the feed line. The inter-element line length as a length of the feed line between each succeeding two of the radiating element sections is longer than the arranging interval in the first direction.

Abstract translation: 阵列天线包括馈电线，以及以第一方向以预定的布置间隔布置的多个辐射元件部分，每个辐射元件部分包括馈送通过馈电线的行波的至少一个辐射元件。 作为每个后续的两个辐射元件部分之间的馈送线的长度的元件间线长度比第一方向上的布置间隔长。

公开(公告)号：US08471775B2

公开(公告)日：2013-06-25

申请号：US12661383

申请日：2010-03-16

Applicant: Kento Nakabayashi ,  Kazuma Natsume ,  Yuu Watanabe ,  Takuya Kouya

Inventor： Kento Nakabayashi ,  Kazuma Natsume ,  Yuu Watanabe ,  Takuya Kouya

IPC: H01Q11/02

CPC classification number: H01Q21/08 ,  H01Q13/206 ,  H01Q21/0075

Abstract: The array antenna includes a feed line, and a plurality of radiating element sections arranged at a predetermined arranging interval in a first direction, each of the radiating element sections including at least one radiating element fed a traveling wave through the feed line. The inter-element line length as a length of the feed line between each succeeding two of the radiating element sections is longer than the arranging interval in the first direction.

Abstract translation: 阵列天线包括馈电线，以及以第一方向以预定的布置间隔布置的多个辐射元件部分，每个辐射元件部分包括馈送通过馈电线的行波的至少一个辐射元件。 作为每个后续的两个辐射元件部分之间的馈送线的长度的元件间线长度比第一方向上的布置间隔长。

公开(公告)号：US08247702B2

公开(公告)日：2012-08-21

申请号：US12702616

申请日：2010-02-09

Applicant: Takuya Kouya

Inventor： Takuya Kouya

IPC: H05K1/16

CPC classification number: H05K1/0204 ,  H01L23/142 ,  H01L24/16 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/29339 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/157 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/30111 ,  H05K1/021 ,  H05K3/4682 ,  H05K2201/09054 ,  Y10T428/24917 ,  H01L2924/0715 ,  H01L2924/0665 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01004 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: An integrated circuit mounted board includes a printed wiring board and an integrated circuit bare chip mounted on the printed wiring board. The printed wiring board includes a metal base, an insulating member made of an insulating material and disposed on the metal base, and a wiring pattern disposed on the insulating member. The wiring pattern includes an electrode part to which the integrated circuit bare chip is electrically coupled. The insulating member includes an under region being opposite to the electrode part. The metal base includes a metal substrate and a metal portion protruding from the metal substrate. The metal portion is buried in the under region of the insulating member.

Abstract translation: 集成电路安装板包括安装在印刷线路板上的印刷线路板和集成电路裸芯片。 印刷布线板包括金属基底，由绝缘材料制成并设置在金属基底上的绝缘构件和布置在绝缘构件上的布线图案。 布线图案包括集成电路裸芯片电耦合到的电极部分。 绝缘构件包括与电极部相对的下部区域。 金属基底包括金属基底和从金属基底突出的金属部分。 金属部分埋在绝缘部件的下部区域。

公开(公告)号：US20100226110A1

公开(公告)日：2010-09-09

申请号：US12660824

申请日：2010-03-04

Applicant: Takuya Kouya

Inventor： Takuya Kouya

IPC: H05K1/18 ,  H05K3/10 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K1/0271 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49894 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/85205 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15157 ,  H01L2924/1517 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3511 ,  H05K1/034 ,  H05K1/181 ,  H05K1/183 ,  H05K3/4632 ,  H05K2201/015 ,  H05K2201/09781 ,  H05K2201/10674 ,  H05K2201/2009 ,  H05K2203/049 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

Abstract: A printed IC board has a multilayer printed wiring board and one or more bare IC chips. The multilayer printed wiring board has insulation layers made of PTFE, and wiring patterns formed on the insulation layers which are stacked to make a lamination structure. Electrode parts as parts of the wiring patterns are electrically connected to the bare IC chip. A copper member which serves as a reinforcing member is laid in a region formed in the insulation layers other than a first insulation layer. the region is formed directly below the electrode parts. The region is formed in a direction Z along a thickness of the stacked insulation layers. The region formed directly below the electrode parts in the insulation layers in the insulation layers other than the first insulation layer has a higher rigidity than the insulation layers.

Abstract translation: 印刷IC板具有多层印刷线路板和一个或多个裸IC芯片。 多层印刷线路板具有由PTFE制成的绝缘层，以及形成在层叠以形成层压结构的绝缘层上的布线图案。 作为布线图案的一部分的电极部件与裸IC芯片电连接。 作为加强部件的铜部件被放置在除了第一绝缘层以外的绝缘层中形成的区域中。 该区域直接形成在电极部分的正下方。 该区域沿堆叠的绝缘层的厚度沿Z方向形成。 除了第一绝缘层之外，绝缘层中的绝缘层中的电极部正下方形成的区域具有比绝缘层更高的刚性。

公开(公告)号：US20100218985A1

公开(公告)日：2010-09-02

申请号：US12702616

申请日：2010-02-09

Applicant: Takuya KOUYA

Inventor： Takuya KOUYA

IPC: H05K1/18 ,  H05K1/11 ,  B05D5/12

CPC classification number: H05K1/0204 ,  H01L23/142 ,  H01L24/16 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/29339 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/157 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/30111 ,  H05K1/021 ,  H05K3/4682 ,  H05K2201/09054 ,  Y10T428/24917 ,  H01L2924/0715 ,  H01L2924/0665 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01004 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: An integrated circuit mounted board includes a printed wiring board and an integrated circuit bare chip mounted on the printed wiring board. The printed wiring board includes a metal base, an insulating member made of an insulating material and disposed on the metal base, and a wiring pattern disposed on the insulating member. The wiring pattern includes an electrode part to which the integrated circuit bare chip is electrically coupled. The insulating member includes an under region being opposite to the electrode part. The metal base includes a metal substrate and a metal portion protruding from the metal substrate. The metal portion is buried in the under region of the insulating member.

Abstract translation: 集成电路安装板包括安装在印刷线路板上的印刷线路板和集成电路裸芯片。 印刷布线板包括金属基底，由绝缘材料制成并设置在金属基底上的绝缘构件和布置在绝缘构件上的布线图案。 布线图案包括集成电路裸芯片电耦合到的电极部分。 绝缘构件包括与电极部相对的下部区域。 金属基底包括金属基底和从金属基底突出的金属部分。 金属部分埋在绝缘部件的下部区域。

公开(公告)号：US5843849A

公开(公告)日：1998-12-01

申请号：US662632

申请日：1996-06-13

Applicant: Kouichi Hoshino ,  Yoshiki Ueno ,  Takuya Kouya

Inventor： Kouichi Hoshino ,  Yoshiki Ueno ,  Takuya Kouya

IPC: H01L29/41 ,  H01L21/306 ,  H01L21/335 ,  H01L21/338 ,  H01L29/778 ,  H01L29/812 ,  H01L21/302

CPC classification number: H01L29/66462 ,  H01L21/30612 ,  H01L29/7783

Abstract: A first semiconductor layer and a second semiconductor layer are laminated on a semiconductor wafer in that order. A resist pattern having an opening is formed on the second semiconductor layer. The second semiconductor layer is etched through the opening in the formed resist pattern to expose the first semiconductor layer. A surface oxide film is formed on the exposed surface of the first semiconductor layer and then selectively etched away. Alternatively, the exposed surface of the first semiconductor layer is subjected to a separate oxidization treatment and the resulting surface oxide film is selectively removed in the subsequent etching.

Abstract translation: 依次层叠在半导体晶片上的第一半导体层和第二半导体层。 具有开口的抗蚀剂图案形成在第二半导体层上。 通过形成的抗蚀图案中的开口蚀刻第二半导体层以暴露第一半导体层。 在第一半导体层的暴露表面上形成表面氧化膜，然后选择性地蚀刻掉。 或者，对第一半导体层的暴露表面进行单独的氧化处理，并在随后的蚀刻中选择性地除去所得的表面氧化膜。