公开(公告)号：US08390308B2

公开(公告)日：2013-03-05

申请号：US12039854

申请日：2008-02-29

Applicant: Michael Carney ,  Marek Reksnis ,  Ted Toth

Inventor： Michael Carney ,  Marek Reksnis ,  Ted Toth

IPC: G01R31/00

CPC classification number: H05K1/116 ,  G01R1/07314 ,  G01R3/00 ,  H05K3/3447 ,  H05K3/429 ,  H05K2201/09627 ,  H05K2201/10303 ,  Y10T29/49124

Abstract: There is disclosed an electronic testbed, an electronic testbed board, and a method for positioning receptacles for nails in the electronic testbed board. In an embodiment, the electronic testbed board includes a mounting through-hole for mounting a receptacle for a nail. The mounting through-hole is drilled to a suitably precise diameter for mounting the receptacle substantially perpendicular to the testbed board. One or more via-holes are located adjacent the mounting through-hole, and are adapted to allow an electrical connection between any conductive layers provided at the one or more via-holes. The receptacle may be mounted more accurately and the electronic test bed may be built more accurately by separating the functions of the via-holes and the mounting through-hole.

Abstract translation: 公开了一种电子测试台，电子测试台和用于在电子测试台中定位钉子的插座的方法。 在一个实施例中，电子测试台板包括用于安装用于钉子的插座的安装通孔。 将安装通孔钻入适当精确的直径，以将基座垂直于测试台板安装。 一个或多个通孔位于安装通孔附近，并且适于允许在一个或多个通孔处提供的任何导电层之间的电连接。 可以更准确地安装插座，并且可以通过分离通孔和安装通孔的功能来更准确地构建电子测试台。

公开(公告)号：US20090219045A1

公开(公告)日：2009-09-03

申请号：US12039854

申请日：2008-02-29

Applicant: Michael CARNEY ,  Marek Reksnis ,  Ted Toth

Inventor： Michael CARNEY ,  Marek Reksnis ,  Ted Toth

IPC: G01R31/02 ,  H05K3/32

CPC classification number: H05K1/116 ,  G01R1/07314 ,  G01R3/00 ,  H05K3/3447 ,  H05K3/429 ,  H05K2201/09627 ,  H05K2201/10303 ,  Y10T29/49124

Abstract: There is disclosed an electronic testbed, an electronic testbed board, and a method for positioning receptacles for nails in the electronic testbed board. In an embodiment, the electronic testbed board includes a mounting through-hole for mounting a receptacle for a nail. The mounting through-hole is drilled to a suitably precise diameter for mounting the receptacle substantially perpendicular to the testbed board. One or more via-holes are located adjacent the mounting through-hole, and are adapted to allow an electrical connection between any conductive layers provided at the one or more via-holes. The receptacle may be mounted more accurately and the electronic test bed may be built more accurately by separating the functions of the via-holes and the mounting through-hole.

Abstract translation: 公开了一种电子测试台，电子测试台和用于在电子测试台中定位钉子的插座的方法。 在一个实施例中，电子测试台板包括用于安装用于钉子的插座的安装通孔。 将安装通孔钻入适当精确的直径，以将基座垂直于测试台板安装。 一个或多个通孔位于安装通孔附近，并且适于允许在一个或多个通孔处提供的任何导电层之间的电连接。 可以更准确地安装插座，并且可以通过分离通孔和安装通孔的功能来更准确地构建电子测试台。

公开(公告)号：US07268567B2

公开(公告)日：2007-09-11

申请号：US11051012

申请日：2005-02-04

Applicant: Alexander Koch ,  Arkady Ivannikov ,  Ted Toth

Inventor： Alexander Koch ,  Arkady Ivannikov ,  Ted Toth

IPC: G01R31/02

CPC classification number: G01R1/06705

Abstract: An improved test probe assembly has an improved mounting assembly which provides the test probe multi-directional freedom of movement with respect to a base in order to resist damage frequently caused to the test probe. The improved mounting assembly may, for example, include at least a first resilient mount disposed on the base and having at least a first support and at least a first resilient element. The at least a first resilient element, which may, for example, be at least a first spring, is deflectable when the test probe engages a structure, such as a device under testing (DUT). Accordingly, the improved test probe assembly of the invention can be deflected an infinite number of positions, in order to resist damage caused, for example, by misalignment between the probe and the DUT.

Abstract translation: 改进的测试探针组件具有改进的安装组件，其提供测试探针相对于基座的多方向运动自由度，以便抵抗经常对测试探针造成的损坏。 改进的安装组件可以例如包括设置在基座上的至少第一弹性支架，并且具有至少第一支撑件和至少第一弹性元件。 当测试探针接合诸如被测设备（DUT）的结构时，至少第一弹性元件（例如可以是至少第一弹簧）是可偏转的。 因此，本发明的改进的测试探针组件可以偏转无限数量的位置，以便抵抗例如由探针和被测物之间的对准引起的损伤。

公开(公告)号：US07501841B2

公开(公告)日：2009-03-10

申请号：US11780913

申请日：2007-07-20

Applicant: Alexander Koch ,  Arkady Ivannikov ,  Ted Toth

Inventor： Alexander Koch ,  Arkady Ivannikov ,  Ted Toth

IPC: G01R31/02

CPC classification number: G01R1/06705

Abstract: An improved test probe assembly has an improved mounting assembly which provides the test probe multi-directional freedom of movement with respect to a base in order to resist damage frequently caused to the test probe. The improved mounting assembly may, for example, include at least a first resilient mount disposed on the base and having at least a first support and at least a first resilient element. The at least a first resilient element, which may, for example, be at least a first spring, is deflectable when the test probe engages a structure, such as a device under testing (DUT). Accordingly, the improved test probe assembly of the invention can be deflected an infinite number of positions, in order to resist damage caused, for example, by misalignment between the probe and the DUT.

Abstract translation: 改进的测试探针组件具有改进的安装组件，其提供测试探针相对于基座的多方向运动自由度，以便抵抗经常对测试探针造成的损坏。 改进的安装组件可以例如包括设置在基座上的至少第一弹性支架，并且具有至少第一支撑件和至少第一弹性元件。 当测试探针接合诸如被测设备（DUT）的结构时，至少第一弹性元件（例如可以是至少第一弹簧）是可偏转的。 因此，本发明的改进的测试探针组件可以偏转无限数量的位置，以便抵抗例如由探针和被测物之间的对准引起的损伤。

公开(公告)号：US20080301930A1

公开(公告)日：2008-12-11

申请号：US11761118

申请日：2007-06-11

Applicant: Niall Gallagher ,  Ted Toth

Inventor： Niall Gallagher ,  Ted Toth

IPC: B23P17/02 ,  B65G47/00

CPC classification number: B23P21/004 ,  H01M10/0404 ,  H01M10/482 ,  Y10T29/49002 ,  Y10T29/53061 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53187

Abstract: A electronic apparatus manufacturing cell defining an electronic apparatus manufacturing cell envelope having a first side and having a second side opposite the first side. According to one aspect, the electronic apparatus manufacturing cell comprises an infeed conveyor, a pass conveyor and a reject conveyor. The infeed conveyor extends from a point outside of the electronic apparatus manufacturing cell envelope on the first side to a point inside of the envelope. The pass conveyor extends from a point inside the electronic apparatus manufacturing cell envelope to a point outside of the electronic apparatus manufacturing cell envelope on the second side. The reject conveyor extends from a point inside the electronic apparatus manufacturing cell envelope to a point outside of the electronic apparatus manufacturing cell envelope on the first side.

Abstract translation: 一种电子设备制造单元，其限定具有第一侧并且具有与第一侧相对的第二侧的电子设备制造单元封套。 根据一方面，电子设备制造单元包括进料输送机，通过输送机和拒收输送机。 进料输送机从第一侧的电子设备制造单元包络线外部的点延伸到信封内部的一个点。 通过传送器从电子设备制造单元包络内的点延伸到第二侧上的电子设备制造单元包络外的点。 拒收输送器从电子设备制造单元包络内的点延伸到第一侧上的电子设备制造单元包络外的点。

公开(公告)号：US20080012590A1

公开(公告)日：2008-01-17

申请号：US11780913

申请日：2007-07-20

Applicant: Alexander Koch ,  Arkady Ivannikov ,  Ted Toth

Inventor： Alexander Koch ,  Arkady Ivannikov ,  Ted Toth

IPC: G01R1/067

CPC classification number: G01R1/06705

Abstract: An improved test probe assembly has an improved mounting assembly which provides the test probe multi-directional freedom of movement with respect to a base in order to resist damage frequently caused to the test probe. The improved mounting assembly may, for example, include at least a first resilient mount disposed on the base and having at least a first support and at least a first resilient element. The at least a first resilient element, which may, for example, be at least a first spring, is deflectable when the test probe engages a structure, such as a device under testing (DUT). Accordingly, the improved test probe assembly of the invention can be deflected an infinite number of positions, in order to resist damage caused, for example, by misalignment between the probe and the DUT.

Abstract translation: 改进的测试探针组件具有改进的安装组件，其提供测试探针相对于基座的多方向运动自由度，以便抵抗经常对测试探针造成的损坏。 改进的安装组件可以例如包括设置在基座上的至少第一弹性支架，并且具有至少第一支撑件和至少第一弹性元件。 当测试探针接合诸如被测设备（DUT）的结构时，至少第一弹性元件（例如可以是至少第一弹簧）是可偏转的。 因此，本发明的改进的测试探针组件可以偏转无限数量的位置，以便抵抗例如由探针和被测物之间的对准引起的损伤。

公开(公告)号：US07675304B2

公开(公告)日：2010-03-09

申请号：US12360323

申请日：2009-01-27

Applicant: Alexander Koch ,  Arkady Ivannikov ,  Ted Toth

Inventor： Alexander Koch ,  Arkady Ivannikov ,  Ted Toth

IPC: G01R31/02

CPC classification number: G01R1/06705

Abstract: An improved test probe assembly has an improved mounting assembly which provides the test probe multi-directional freedom of movement with respect to a base in order to resist damage frequently caused to the test probe. The improved mounting assembly may, for example, include at least a first resilient mount disposed on the base and having at least a first support and at least a first resilient element. The at least a first resilient element, which may, for example, be at least a first spring, is deflectable when the test probe engages a structure, such as a device under testing (DUT). Accordingly, the improved test probe assembly of the invention can be deflected an infinite number of positions, in order to resist damage caused, for example, by misalignment between the probe and the DUT.

Abstract translation: 改进的测试探针组件具有改进的安装组件，其提供测试探针相对于基座的多方向运动自由度，以便抵抗经常对测试探针造成的损坏。 改进的安装组件可以例如包括设置在基座上的至少第一弹性支架，并且具有至少第一支撑件和至少第一弹性元件。 当测试探针接合诸如被测设备（DUT）的结构时，至少第一弹性元件（例如可以是至少第一弹簧）是可偏转的。 因此，本发明的改进的测试探针组件可以偏转无限数量的位置，以便抵抗例如由探针和被测物之间的对准引起的损伤。

公开(公告)号：US08132317B2

公开(公告)日：2012-03-13

申请号：US11761118

申请日：2007-06-11

Applicant: Niall Gallagher ,  Ted Toth

Inventor： Niall Gallagher ,  Ted Toth

IPC: H05K3/30

CPC classification number: B23P21/004 ,  H01M10/0404 ,  H01M10/482 ,  Y10T29/49002 ,  Y10T29/53061 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53187

Abstract: A electronic apparatus manufacturing cell defining an electronic apparatus manufacturing cell envelope having a first side and having a second side opposite the first side. According to one aspect, the electronic apparatus manufacturing cell comprises an infeed conveyor, a pass conveyor and a reject conveyor. The infeed conveyor extends from a point outside of the electronic apparatus manufacturing cell envelope on the first side to a point inside of the envelope. The pass conveyor extends from a point inside the electronic apparatus manufacturing cell envelope to a point outside of the electronic apparatus manufacturing cell envelope on the second side. The reject conveyor extends from a point inside the electronic apparatus manufacturing cell envelope to a point outside of the electronic apparatus manufacturing cell envelope on the first side.

Abstract translation: 一种电子设备制造单元，其限定具有第一侧并且具有与第一侧相对的第二侧的电子设备制造单元封套。 根据一方面，电子设备制造单元包括进料输送机，通过输送机和拒收输送机。 进料输送机从第一侧的电子设备制造单元壳体外部的点延伸到信封内部的一个点。 通过传送器从电子设备制造单元包络内的点延伸到第二侧上的电子设备制造单元包络外的点。 拒收输送器从电子设备制造单元包络内的点延伸到第一侧上的电子设备制造单元包络外的点。

公开(公告)号：US20090134899A1

公开(公告)日：2009-05-28

申请号：US12360323

申请日：2009-01-27

Applicant: Alexander Koch ,  Arkady Ivannikov ,  Ted Toth

Inventor： Alexander Koch ,  Arkady Ivannikov ,  Ted Toth

IPC: G01R31/02

CPC classification number: G01R1/06705

Abstract: An improved test probe assembly has an improved mounting assembly which provides the test probe multi-directional freedom of movement with respect to a base in order to resist damage frequently caused to the test probe. The improved mounting assembly may, for example, include at least a first resilient mount disposed on the base and having at least a first support and at least a first resilient element. The at least a first resilient element, which may, for example, be at least a first spring, is deflectable when the test probe engages a structure, such as a device under testing (DUT). Accordingly, the improved test probe assembly of the invention can be deflected an infinite number of positions, in order to resist damage caused, for example, by misalignment between the probe and the DUT.

Abstract translation: 改进的测试探针组件具有改进的安装组件，其提供测试探针相对于基座的多方向运动自由度，以便抵抗经常对测试探针造成的损坏。 改进的安装组件可以例如包括设置在基座上的至少第一弹性支架，并且具有至少第一支撑件和至少第一弹性元件。 当测试探针接合诸如被测设备（DUT）的结构时，至少第一弹性元件（例如可以是至少第一弹簧）是可偏转的。 因此，本发明的改进的测试探针组件可以偏转无限数量的位置，以便抵抗例如由探针和被测物之间的对准引起的损伤。

公开(公告)号：US20060176065A1

公开(公告)日：2006-08-10

申请号：US11051012

申请日：2005-02-04

Applicant: Alexander Koch ,  Arkady Ivannikov ,  Ted Toth

Inventor： Alexander Koch ,  Arkady Ivannikov ,  Ted Toth

IPC: G01R31/02

CPC classification number: G01R1/06705

Abstract: An improved test probe assembly has an improved mounting assembly which provides the test probe multi-directional freedom of movement with respect to a base in order to resist damage frequently caused to the test probe. The improved mounting assembly may, for example, include at least a first resilient mount disposed on the base and having at least a first support and at least a first resilient element. The at least a first resilient element, which may, for example, be at least a first spring, is deflectable when the test probe engages a structure, such as a device under testing (DUT). Accordingly, the improved test probe assembly of the invention can be deflected an infinite number of positions, in order to resist damage caused, for example, by misalignment between the probe and the DUT.