公开(公告)号：US20220340410A1

公开(公告)日：2022-10-27

申请号：US17637125

申请日：2020-06-16

Applicant: VERMON SA

Inventor： Cyril MEYNIER ,  Dominique GROSS ,  Nicolas SENEGOND

IPC: B81B3/00 ,  B81C1/00 ,  B06B1/02

Abstract: The present disclosure relates to a CUT transducer (200) comprising: —a conductive or semiconductor substrate (201) coated with a stack of one or a plurality of dielectric layers (203, 213); —a cavity (205, 215) formed in said stack; —a conductive or semiconductor membrane (221) suspended above the cavity; —at the bottom of the cavity, a conductive region (209) in contact with the upper surface of the substrate, said conductive region being interrupted on a portion of the upper surface of the substrate; and—in the cavity, a stop structure (207) made of a dielectric material localized on or above the area of interruption of the conductive region (209).

公开(公告)号：US20220289562A1

公开(公告)日：2022-09-15

申请号：US17629210

申请日：2020-07-23

Applicant: VERMON SA

Inventor： Claire BANTIGNIES ,  Guillaume FÉRIN

IPC: B81C1/00 ,  B81B7/00

Abstract: A method of manufacturing a panel transducer scale package includes securing acoustic components at predetermined locations on a first carrier substrate with a first surface of the acoustic components positioned adjacent to the first carrier substrate. ASIC components are also secured at predetermined locations on the first carrier substrate with a first surface of the ASIC components positioned adjacent to the first carrier substrate. Photoresist resin is applied over the acoustic components and the ASIC components such that a second surface of the acoustic components is left exposed from the photoresist resin. The first carrier substrate is removed to expose the first surface of the acoustic components and the first surface of the ASIC components. A buildup layer is formed including electrical pathways between each of the acoustic components and the ASIC components, and the photoresist resin is removed.

公开(公告)号：US20230190223A1

公开(公告)日：2023-06-22

申请号：US18066485

申请日：2022-12-15

Applicant: VERMON SA

Inventor： Maxime BENCHEMOUL

IPC: A61B8/06 ,  A61B8/08 ,  A61B8/00

CPC classification number: A61B8/06 ,  A61B8/488 ,  A61B8/4427 ,  A61B8/4477 ,  A61B8/54 ,  A61B8/4494

Abstract: A portable electronic device for assessing a human cardiovascular activity includes first and second probes substantially parallel to each other and located on either side of a third probe, substantially perpendicular to the first and second probes, each probe comprising an array of ultrasound transducers, and a control circuit configured to: a) estimate, by means of a first ultrasound beam emitted by the first probe, a position of a blood vessel with respect to the device; and b) adjust a second ultrasound beam, emitted by the third probe, according to the estimated position of the blood vessel.

公开(公告)号：US20220274133A1

公开(公告)日：2022-09-01

申请号：US17630059

申请日：2020-07-16

Applicant: VERMON SA

Inventor： Nicolas SENEGOND ,  Dominique GROSS ,  Cyril MEYNIER

IPC: B06B1/02

Abstract: The present disclosure relates to a method of manufacturing a CMUT transducer, comprising the steps of: a) forming a first dielectric layer on a first substrate; b) forming a second dielectric layer on a second substrate; c) forming a cavity in the first or second dielectric layer; d) assembling the first and second substrates by direct bonding of the surface of the second dielectric layer opposite to the second substrate to the surface of the first dielectric layer 103) opposite to the first substrate; e) removing the second substrate to only keep above the cavity a suspended membrane formed by the second dielectric layer; and f) forming an upper electrode on the surface of the membrane opposite to the first substrate.

公开(公告)号：US12201469B2

公开(公告)日：2025-01-21

申请号：US18066485

申请日：2022-12-15

Applicant: VERMON SA

Inventor： Maxime Benchemoul

IPC: A61B8/06 ,  A61B8/00 ,  A61B8/08

Abstract: A portable electronic device for assessing a human cardiovascular activity includes first and second probes substantially parallel to each other and located on either side of a third probe, substantially perpendicular to the first and second probes, each probe comprising an array of ultrasound transducers, and a control circuit configured to: a) estimate, by means of a first ultrasound beam emitted by the first probe, a position of a blood vessel with respect to the device; and b) adjust a second ultrasound beam, emitted by the third probe, according to the estimated position of the blood vessel.

公开(公告)号：US20240009471A1

公开(公告)日：2024-01-11

申请号：US18343154

申请日：2023-06-28

Applicant: VERMON SA

Inventor： Bogdan ROSINSKI ,  Thien HOANG ,  Nicolas FELIX

IPC: A61N1/378 ,  A61B5/00

CPC classification number: A61N1/3787 ,  A61B5/6846 ,  A61B2560/0219

Abstract: A device to emit ultrasounds to wireless recharge an electronic device, wherein the emitting device includes at least one ultrasonic transducer and an electronic circuit to control the ultrasonic transducer, wherein the control electronic circuit is configured to: apply to the transducer an excitation electric signal in order to induce the emission of an ultrasonic wave towards the electronic device; and read a feedback electric signal generated by the transducer under the action of a part of the ultrasonic wave reflected by the electronic device, wherein the control electronic circuit comprises a feedback loop configured to adjust the frequency of said ultrasonic wave, so that the energy of said reflected part of the ultrasonic wave tends to a minimum value.

公开(公告)号：US20230412989A1

公开(公告)日：2023-12-21

申请号：US18320000

申请日：2023-05-18

Applicant: VERMON SA

Inventor： Youngil KIM ,  Cyril MEYNIER ,  Dominique GROSS ,  Jacques HELLER ,  Nicolas SENEGOND

IPC: H04R19/00 ,  H04R31/00 ,  H04R17/10

CPC classification number: H04R19/005 ,  H04R17/10 ,  H04R31/006

Abstract: A method of manufacturing a CMUT transducer includes: a) forming a first silicon oxide layer on a face of a first silicon layer defining a first electrode of the transducer; b) forming a second silicon oxide layer on a face of a second silicon layer; c) subsequent to step a), forming, at the side of said face of the first silicon layer, by locally oxidizing the silicon of the first silicon layer, silicon oxide walls; and d) subsequent to steps b) and c), transferring and attaching the set comprising the second silicon layer and the second silicon oxide layer on the set comprising the first silicon layer, the first silicon oxide layer, and the silicon oxide walls.

公开(公告)号：US11679975B2

公开(公告)日：2023-06-20

申请号：US17629210

申请日：2020-07-23

Applicant: VERMON SA

Inventor： Claire Bantignies ,  Guillaume Férin

IPC: B81C1/00 ,  B81B7/00

CPC classification number: B81C1/00095 ,  B81B7/0006 ,  B81B2201/0271 ,  B81B2207/012 ,  B81B2207/07 ,  B81C2201/0194 ,  B81C2203/0792

Abstract: A method of manufacturing a panel transducer scale package includes securing acoustic components at predetermined locations on a first carrier substrate with a first surface of the acoustic components positioned adjacent to the first carrier substrate. ASIC components are also secured at predetermined locations on the first carrier substrate with a first surface of the ASIC components positioned adjacent to the first carrier substrate. Photoresist resin is applied over the acoustic components and the ASIC components such that a second surface of the acoustic components is left exposed from the photoresist resin. The first carrier substrate is removed to expose the first surface of the acoustic components and the first surface of the ASIC components. A buildup layer is formed including electrical pathways between each of the acoustic components and the ASIC components, and the photoresist resin is removed.

公开(公告)号：US20240351070A1

公开(公告)日：2024-10-24

申请号：US18608079

申请日：2024-03-18

Applicant: VERMON SA

Inventor： Mathieu LEGROS ,  Stéphane LAFON

IPC: B06B1/06 ,  A61B8/00 ,  H10N30/06 ,  H10N30/088

CPC classification number: B06B1/0629 ,  B06B1/067 ,  H10N30/06 ,  H10N30/088 ,  A61B8/4488 ,  B06B2201/76

Abstract: A row-column addressing array ultrasound transduction device including a metallized plate of active material comprising a plate of active material having a first main surface and a second main surface opposite to the first main surface, a first metallic main surface layer on the first main surface, and a second metallic main surface layer on the second main surface.

公开(公告)号：US20240324992A1

公开(公告)日：2024-10-03

申请号：US18609363

申请日：2024-03-19

Applicant: VERMON SA

Inventor： Cyril MEYNIER

IPC: A61B8/00 ,  A61B8/12 ,  A61N7/00

CPC classification number: A61B8/445 ,  A61B8/12 ,  A61B8/4494 ,  A61N7/00 ,  A61N2007/0078

Abstract: A method of manufacturing an ultrasound probe, including the following steps: a) transferring, onto a flexible interconnection substrate, a chip including a plurality of ultrasound transducers, the chip including a front side including at least one electrical connection pad and a back side; b) folding a portion of the flexible interconnection substrate, so that the flexible interconnection substrate extends over at least a portion of the back side of the chip and over at least a portion of the front side of the chip, said at least one electrical connection pad of the front side of the chip being connected to at least one corresponding electrical connection pad of the interconnection substrate; and c) cutting the chip into a plurality of elementary chips, each including one or a plurality of ultrasound transducers.