公开(公告)号：US20100164101A1

公开(公告)日：2010-07-01

申请号：US12654477

申请日：2009-12-22

Applicant: Wang-Jae Lee ,  Yong-Jin Jung ,  Jung-Hyeon Kim

Inventor： Wang-Jae Lee ,  Yong-Jin Jung ,  Jung-Hyeon Kim

IPC: H01L23/498 ,  H01R12/04

CPC classification number: H01L23/13 ,  H01L23/49811 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/111 ,  H05K3/3452 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/0989 ,  H05K2201/099 ,  Y02P70/611 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Disclosed is a ball land structure suitable for use with a semiconductor package. The ball land structure includes a ball land and a barrier on a core. The barrier may be configured to connect to the ball land so as to form a barrier hole between an edge of the ball land and an edge of the barrier thus exposing a portion of the core. A solder mask may be deposited on the ball land and a portion of the core exposed by the barrier hole so as to partially expose the core.

Abstract translation: 公开了适用于半导体封装的球面结构。 球场结构包括球场和核心上的障碍物。 阻挡层可以被构造成连接到球区，以便在球台的边缘和屏障的边缘之间形成阻挡孔，从而暴露出核心的一部分。 焊盘可以沉积在球台上，并且芯的一部分由阻挡孔暴露以部分地露出芯。

公开(公告)号：US20090126979A1

公开(公告)日：2009-05-21

申请号：US12270591

申请日：2008-11-13

Applicant: Ka-Eun CHAE ,  Wang-Jae LEE ,  Yong-Jin JUNG ,  Kun-Ho SONG

Inventor： Ka-Eun CHAE ,  Wang-Jae LEE ,  Yong-Jin JUNG ,  Kun-Ho SONG

IPC: H05K1/02 ,  H05K3/00 ,  G02B5/12

CPC classification number: H05K1/0269 ,  H05K3/0052 ,  H05K3/225 ,  H05K2201/09927 ,  H05K2201/09936 ,  H05K2201/10204 ,  Y10T29/49124

Abstract: A semiconductor package circuit board has an indicator for specifying a location of a defective circuit board unit. The semiconductor package circuit board includes circuit board units arranged in an m-by-n matrix pattern. The indicator has marking areas arranged in an m-by-n matrix pattern so that the marking areas are marked in correspondence to locations of identified defective circuit board units of the circuit board units. An operator can readily put a defective mark on the indicator without any confusion. The operator or a sensor can readily recognize the defective mark. Since the indicator can be formed on the circuit board unit, the integration of the semiconductor package circuit board can be increased, and the productivity can be substantially improved. Furthermore, a pathway of the sensor can be reduced, and interferences that might occur if the sensor moves can be hindered.

Abstract translation: 半导体封装电路板具有用于指定有缺陷的电路板单元的位置的指示器。 半导体封装电路板包括以逐个矩阵图案排列的电路板单元。 指示器具有以逐一矩阵图案排列的标记区域，使得标记区域对应于电路板单元的识别的有缺陷的电路板单元的位置被标记。 操作员可以很容易地在指示器上放置有缺陷的标记，而不会有任何混淆。 操作员或传感器可以容易地识别缺陷标记。 由于可以在电路板单元上形成指示器，因此可以提高半导体封装电路板的集成度，并且可以显着提高生产率。 此外，可以减小传感器的路径，并且如果传感器移动可能会发生干扰。

公开(公告)号：US06449156B1

公开(公告)日：2002-09-10

申请号：US09952303

申请日：2001-09-12

Applicant: Seong-Chan Han ,  Dong-Woo Shin ,  Dong-Chun Lee ,  Wang-Jae Lee

Inventor： Seong-Chan Han ,  Dong-Woo Shin ,  Dong-Chun Lee ,  Wang-Jae Lee

IPC: H05K720

CPC classification number: G11C5/04

Abstract: A novel heat sink structure for being mounted to a module board to which semiconductor chips are attached and for dissipating or spreading heat generated from the semiconductor chips is disclosed. The heat sink comprises a heat sink base, and a coupling means for coupling the heat sink base to the module board. The coupling means passes through the heat sink base. The coupling means includes integrally formed upper and lower body portions, an orifice formed at least through the lower body portion, and a flanged base formed integral with the lower body portion. The flanged base fixes the coupling means to the heat sink base. The outer dimension of the upper body portion is smaller than the inner dimension of the lower body portion. As a result, many heat sinks can be stacked stably.

Abstract translation: 公开了一种新颖的散热器结构，用于安装到模块板，半导体芯片被附着到模块板上，并用于散发或扩散从半导体芯片产生的热量。 散热器包括散热器基座和用于将散热器基座耦合到模块板的耦合装置。 联接装置通过散热器底座。 联接装置包括一体形成的上主体部分和至少穿过下主体部分的孔口，以及与下主体部分一体形成的凸缘基部。 带凸缘的底座将联接装置固定在散热器底座上。 上身部的外部尺寸小于下主体部的内部尺寸。 结果，许多散热器可以稳定堆叠。