公开(公告)号：US09679861B1

公开(公告)日：2017-06-13

申请号：US15080428

申请日：2016-03-24

Applicant: Altera Corporation

Inventor： Vincent Hool

IPC: H01L23/48 ,  H01L23/00 ,  H01L21/52

CPC classification number: H01L23/49816 ,  H01L21/4853 ,  H01L23/562 ,  H01L2224/16227 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K3/3436 ,  H05K2201/10734

Abstract: An integrated circuit package may include a package substrate having a surface, first interconnects of a first size that are arranged in a substantially circular shape that is centered on the surface of the package substrate, and second interconnects of a second size that is different from the first size, where the second interconnects are arranged in a ring shape on the surface of the package substrate. The ring shape of the second interconnects is concentric with the substantially circular shape of the first interconnects. The integrated circuit package may further include third interconnects of a third size that are arranged in peripheral corner regions on the surface of the package substrate. The third size may be smaller or bigger than at least one of the first and second sizes.

公开(公告)号：US09368440B1

公开(公告)日：2016-06-14

申请号：US13956176

申请日：2013-07-31

Applicant: Altera Corporation

Inventor： Vincent Hool

IPC: H01L23/498 ,  H01L23/48 ,  H01L23/538

CPC classification number: H01L23/49827 ,  H01L21/486 ,  H01L23/481 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/5384 ,  H01L2223/6622 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method of manufacturing an integrated circuit package substrate is disclosed. The method may include forming a hole through a substrate layer in the package substrate. The method also includes inserting a prefabricated coaxial wire segment into the hole. The prefabricated coaxial wire segment may include a signal conductor, a ground conductor that surrounds the signal conductor, and dielectric material interposed between the signal conductor and the ground conductor. Furthermore, an integrated circuit package is also disclosed.

Abstract translation: 公开了一种制造集成电路封装衬底的方法。 该方法可以包括通过封装衬底中的衬底层形成孔。 该方法还包括将预制同轴线段插入孔中。 预制同轴线段可以包括信号导体，围绕信号导体的接地导体以及介于信号导体和接地导体之间的电介质材料。 此外，还公开了集成电路封装。

公开(公告)号：US09648728B1

公开(公告)日：2017-05-09

申请号：US14601973

申请日：2015-01-21

Applicant: ALTERA CORPORATION

Inventor： Vincent Hool ,  Susan Huang

IPC: H01L25/18 ,  H01L25/065 ,  H05K1/02 ,  H01L23/00 ,  H01L23/14 ,  H05K1/03 ,  H05K1/11

CPC classification number: H05K1/0271 ,  H01L23/145 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/75701 ,  H01L2224/75704 ,  H01L2224/7598 ,  H01L2224/81815 ,  H01L2924/14 ,  H01L2924/1515 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/3511 ,  H01L2924/3512 ,  H05K1/0326 ,  H05K1/111 ,  H05K3/0097 ,  H05K2201/09063 ,  H05K2203/0169 ,  H05K2203/167 ,  H01L2924/00014

Abstract: A coreless organic substrate in which a mounting hole is formed near each corner of the substrate and is used during assembly processes to secure the substrate so as to prevent flexing.

公开(公告)号：US09385060B1

公开(公告)日：2016-07-05

申请号：US14341586

申请日：2014-07-25

Applicant: Altera Corporation

Inventor： Vincent Hool ,  Minghao Shen

IPC: H01L21/44 ,  H01L23/34 ,  H01L21/48 ,  H01L23/373

CPC classification number: H01L23/3736 ,  H01L23/295 ,  H01L23/3128 ,  H01L23/36 ,  H01L24/16 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16251 ,  H01L2924/163 ,  H01L2924/18161 ,  H01L2224/11

Abstract: Integrated circuit packages with enhanced thermal conduction are disclosed. A disclosed integrated circuit package includes a package substrate. An integrated circuit die with a layer of metal on its backside is mounted on the package substrate at a first temperature (e.g., reflow temperature). The package further includes a heat spreading lid that is bonded to the integrated circuit die at a second temperature, which is less than the first temperature. The heat spreading lid is formed over the integrated circuit die in which the heat spreading lid makes physical contact with the integrated circuit die via the layer of metal.

Abstract translation: 公开了具有增强的热传导的集成电路封装。 所公开的集成电路封装包括封装衬底。 在第一温度（例如回流温度）下，在封装衬底上安装具有金属背面的集成电路裸片。 该封装还包括散热盖，其在小于第一温度的第二温度下结合到集成电路管芯。 散热盖形成在集成电路管芯上，其中散热盖通过金属层与集成电路管芯物理接触。