公开(公告)号：US20150279767A1

公开(公告)日：2015-10-01

申请号：US14722110

申请日：2015-05-26

Applicant: AMKOR TECHNOLOGY, INC.

Inventor： Kyoung Yeon Lee ,  Byong Jin Kim ,  Kyung Su Kim ,  Hyung Il Jeon ,  Jae Doo Kwon

IPC: H01L23/495 ,  H01L23/043 ,  H01L23/31

CPC classification number: H01L23/49541 ,  H01L21/50 ,  H01L23/043 ,  H01L23/3157 ,  H01L23/49503 ,  H01L23/49861 ,  H01L2924/0002 ,  H01L2924/00

Abstract: In one embodiment, a lead frame package structure includes a lead frame having sides that surround a die paddle and on which a plurality of leads are formed. An electronic chip is attached to the die paddle and a case is attached to the lead frame to seal the leads and the electronic chip. One or more discharge holes are formed on and extending through one or more specific leads and/or on and extending through a predetermined position of the die paddle. The discharge holes are configured to discharge air pressure that forms during the assembly process thereby improving the reliability of the packaged electronic chip.

Abstract translation: 在一个实施例中，引线框架封装结构包括引线框架，引线框架具有围绕管芯焊盘的侧面并且在其上形成有多个引线。 将电子芯片安装在芯片上，并且将壳体附接到引线框架以密封引线和电子芯片。 一个或多个排出孔形成在一个或多个特定的引线上并且延伸穿过一个或多个特定的引线和/或延伸穿过管芯的预定位置。 排出孔被构造成排出在组装过程中形成的空气压力，从而提高封装的电子芯片的可靠性。

公开(公告)号：US09633932B2

公开(公告)日：2017-04-25

申请号：US14722110

申请日：2015-05-26

Applicant: AMKOR TECHNOLOGY, INC.

Inventor： Kyoung Yeon Lee ,  Byong Jin Kim ,  Kyung Su Kim ,  Hyung Il Jeon ,  Jae Doo Kwon

IPC: H01L23/495 ,  H01L23/043 ,  H01L23/31 ,  H01L21/50 ,  H01L23/498

CPC classification number: H01L23/49541 ,  H01L21/50 ,  H01L23/043 ,  H01L23/3157 ,  H01L23/49503 ,  H01L23/49861 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An electronic package structure includes a substrate having a plurality of conductive leads. A discharge hole is disposed to extend through the substrate. An electronic chip is electrically connected to the plurality of conductive leads. A case is connected to the substrate and defines a cavity between the substrate and an upper of the case. The discharge hole and the electronic chip are disposed within the cavity, and the discharge hole is open to the outside in the electronic package structure. The discharge hole is configured to discharge air pressure that forms during the assembly process thereby improving the reliability of the electronic package structure.

公开(公告)号：US20140042605A1

公开(公告)日：2014-02-13

申请号：US13949186

申请日：2013-07-23

Applicant: Amkor Technology, Inc.

Inventor： Kyoung Yeon Lee ,  Byong Jin Kim ,  Kyung Su Kim ,  Hyung Il Jeon ,  Jae Doo Kwon

IPC: H01L23/495 ,  H01L21/50

CPC classification number: H01L23/49541 ,  H01L21/50 ,  H01L23/043 ,  H01L23/3157 ,  H01L23/49503 ,  H01L23/49861 ,  H01L2924/0002 ,  H01L2924/00

Abstract: In one embodiment, a lead frame package structure includes a lead frame having sides that surround a die paddle and on which a plurality of leads are formed. An electronic chip is attached to the die paddle and a case is attached to the lead frame to seal the leads and the electronic chip. One or more discharge holes are formed on and extending through one or more specific leads and/or on and extending through a predetermined position of the die paddle. The discharge holes are configured to discharge air pressure that forms during the assembly process thereby improving the reliability of the packaged electronic chip.

Abstract translation: 在一个实施例中，引线框架封装结构包括引线框架，引线框架具有围绕管芯焊盘的侧面并且在其上形成有多个引线。 将电子芯片安装在芯片上，并且将壳体附接到引线框架以密封引线和电子芯片。 一个或多个排出孔形成在一个或多个特定的引线上并且延伸穿过一个或多个特定的引线和/或延伸穿过管芯的预定位置。 排出孔被构造成排出在组装过程中形成的空气压力，从而提高封装的电子芯片的可靠性。

公开(公告)号：US09054089B2

公开(公告)日：2015-06-09

申请号：US13949186

申请日：2013-07-23

Applicant: Amkor Technology, Inc.

Inventor： Kyoung Yeon Lee ,  Byong Jin Kim ,  Kyung Su Kim ,  Hyung Il Jeon ,  Jae Doo Kwon

IPC: H01L23/495 ,  H01L21/50 ,  H01L23/498

CPC classification number: H01L23/49541 ,  H01L21/50 ,  H01L23/043 ,  H01L23/3157 ,  H01L23/49503 ,  H01L23/49861 ,  H01L2924/0002 ,  H01L2924/00

Abstract: In one embodiment, a lead frame package structure includes a lead frame having sides that surround a die paddle and on which a plurality of leads are formed. An electronic chip is attached to the die paddle and a case is attached to the lead frame to seal the leads and the electronic chip. One or more discharge holes are formed on and extending through one or more specific leads and/or on and extending through a predetermined position of the die paddle. The discharge holes are configured to discharge air pressure that forms during the assembly process thereby improving the reliability of the packaged electronic chip.

Abstract translation: 在一个实施例中，引线框架封装结构包括引线框架，引线框架具有围绕管芯焊盘的侧面并且在其上形成有多个引线。 将电子芯片安装在芯片上，并且将壳体附接到引线框架以密封引线和电子芯片。 一个或多个排出孔形成在一个或多个特定的引线上并且延伸穿过一个或多个特定的引线和/或延伸穿过管芯的预定位置。 排出孔被构造成排出在组装过程中形成的空气压力，从而提高封装的电子芯片的可靠性。