公开(公告)号：US20240023246A1

公开(公告)日：2024-01-18

申请号：US18374420

申请日：2023-09-28

Applicant: APPLIED MATERIALS, INC.

Inventor： Phillip A. Criminale ,  Zhiqiang Guo ,  Andrew Myles ,  Martin Perez-Guzman

IPC: H05K1/18 ,  H01L21/67 ,  H01L21/66 ,  H01L21/687 ,  G05B13/02

CPC classification number: H05K1/183 ,  H01L21/67253 ,  H01L22/34 ,  H01L21/68707 ,  H01L21/68742 ,  H01L21/67259 ,  G05B13/024 ,  H05K2201/10371 ,  H05K2201/10151

Abstract: A method includes establishing, by a diagnostic disc, a secure wireless connection with a computing system using a wireless communication circuit of the diagnostic disc before or after the diagnostic disc is placed into a processing chamber. The method further includes generating, by at least one non-contact sensor of the diagnostic disc, sensor data of a component disposed within the processing chamber. The method further includes storing the sensor data in a memory of the diagnostic disc. The method further includes wirelessly transmitting the sensor data to the computing system, using the wireless communication circuit. The method further includes terminating the secure wireless connection with the computing system and clearing the sensor data from the memory of the diagnostic disc.

公开(公告)号：US20230264238A1

公开(公告)日：2023-08-24

申请号：US18138337

申请日：2023-04-24

Applicant: Applied Materials, Inc.

Inventor： Stephen D. Prouty ,  Martin Perez-Guzman ,  Sumanth Banda ,  Rajinder Dhindsa ,  Alvaro Garcia de Gorordo

IPC: B08B9/08 ,  H01L21/683 ,  B08B5/00 ,  H01L21/30

CPC classification number: B08B9/08 ,  B08B5/00 ,  H01L21/30 ,  H01L21/6833 ,  B08B2209/08

Abstract: Methods of semiconductor processing may include performing a process on a semiconductor substrate. The semiconductor substrate may be seated on a substrate support positioned within a processing region of a semiconductor processing chamber. The methods may include flowing a first backside gas through the substrate support at a first flow rate. The methods may include removing the semiconductor substrate from the processing region of the semiconductor processing chamber. The methods may include performing a plasma cleaning operation within the processing region of the semiconductor processing chamber. The methods may include flowing a second backside gas through the substrate support at a second flow rate. At least a portion of the second backside gas may flow into the processing region through accesses in the substrate support.

公开(公告)号：US20210378100A1

公开(公告)日：2021-12-02

申请号：US16890008

申请日：2020-06-02

Applicant: APPLIED MATERIALS, INC.

Inventor： Phillip A. Criminale ,  Zhiqiang Guo ,  Andrew Myles ,  Martin Perez-Guzman

IPC: H05K1/18 ,  H01L21/67 ,  H01L21/66 ,  H01L21/687

Abstract: A diagnostic disc includes a disc-shaped body having raised walls that encircle the interior of the disc-shaped body and at least one protrusion extending outwardly from the disc-shaped body. The raised walls of the disc-shaped body define a cavity of the disc-shaped body. A non-contact sensor is attached to each of the at least one protrusion. A a printed circuit board (PCB) is positioned within the cavity formed on the disc-shaped body. A vacuum and high temperature tolerant power source is disposed on the PCB along with a wireless charger and circuitry that is coupled to each non-contact sensor and includes at least a wireless communication circuit and a memory. A cover is positioned over the cavity of the disc-shaped body and shields at least a portion of the PCB, circuitry, power source, and wireless charger within the cavity from an external environment.

公开(公告)号：US20230380016A1

公开(公告)日：2023-11-23

申请号：US18197658

申请日：2023-05-15

Applicant: Applied Materials, Inc.

Inventor： Denis Martin Koosau ,  Suresh Gupta ,  Martin Perez-Guzman ,  Ashish Goel

IPC: H05B3/26

CPC classification number: H05B3/265

Abstract: A substrate support assembly includes a puck, comprising a heating element, a power distribution assembly, and an insulator comprising at least one of alumina or thermoplastic disposed between the puck and the power distribution assembly, wherein an electrical connection between the heating element and the power distribution assembly comprises a terminal and a conical washer.

公开(公告)号：US11589474B2

公开(公告)日：2023-02-21

申请号：US16890013

申请日：2020-06-02

Applicant: APPLIED MATERIALS, INC.

Inventor： Phillip A. Criminale ,  Zhiqiang Guo ,  Philip A. Kraus ,  Andrew Myles ,  Martin Perez-Guzman

IPC: H05K5/03 ,  H05K5/06 ,  H05K1/18 ,  H05K7/14

Abstract: A diagnostic disc includes a disc-shaped body having raised walls that encircle the interior of the disc-shaped body and at least one protrusion extending outwardly from the disc-shaped body. The raised walls of the disc-shaped body define a cavity of the disc-shaped body. A non-contact sensor is attached to each of the at least one protrusion. A printed circuit board (PCB) is positioned within the cavity formed on the disc-shaped body. A vacuum and high temperature tolerant power source is disposed on the PCB along with a wireless charger and circuitry that is coupled to each non-contact sensor and includes at least a wireless communication circuit and a memory. A cover is positioned over the cavity of the disc-shaped body and shields at least a portion of the PCB, circuitry, power source, and wireless charger within the cavity from an external environment.

公开(公告)号：US20210276056A1

公开(公告)日：2021-09-09

申请号：US16811282

申请日：2020-03-06

Applicant: Applied Materials, Inc.

Inventor： Stephen D. Prouty ,  Martin Perez-Guzman ,  Sumanth Banda ,  Rajinder Dhindsa ,  Alvaro Garcia de Gorordo

IPC: B08B9/08 ,  H01L21/683 ,  H01L21/30 ,  B08B5/00

Abstract: Methods of semiconductor processing may include performing a process on a semiconductor substrate. The semiconductor substrate may be seated on a substrate support positioned within a processing region of a semiconductor processing chamber. The methods may include flowing a first backside gas through the substrate support at a first flow rate. The methods may include removing the semiconductor substrate from the processing region of the semiconductor processing chamber. The methods may include performing a plasma cleaning operation within the processing region of the semiconductor processing chamber. The methods may include flowing a second backside gas through the substrate support at a second flow rate. At least a portion of the second backside gas may flow into the processing region through accesses in the substrate support.

公开(公告)号：US11924972B2

公开(公告)日：2024-03-05

申请号：US16890008

申请日：2020-06-02

Applicant: APPLIED MATERIALS, INC.

Inventor： Phillip A. Criminale ,  Zhiqiang Guo ,  Andrew Myles ,  Martin Perez-Guzman

IPC: H05K1/18 ,  G05B13/02 ,  H01L21/66 ,  H01L21/67 ,  H01L21/687

CPC classification number: H05K1/183 ,  G05B13/024 ,  H01L21/67253 ,  H01L21/67259 ,  H01L21/68707 ,  H01L21/68742 ,  H01L22/34 ,  H05K2201/10151 ,  H05K2201/10371

Abstract: A diagnostic disc includes a disc-shaped body having raised walls that encircle the interior of the disc-shaped body and at least one protrusion extending outwardly from the disc-shaped body. The raised walls of the disc-shaped body define a cavity of the disc-shaped body. A non-contact sensor is attached to each of the at least one protrusion. A a printed circuit board (PCB) is positioned within the cavity formed on the disc-shaped body. A vacuum and high temperature tolerant power source is disposed on the PCB along with a wireless charger and circuitry that is coupled to each non-contact sensor and includes at least a wireless communication circuit and a memory. A cover is positioned over the cavity of the disc-shaped body and shields at least a portion of the PCB, circuitry, power source, and wireless charger within the cavity from an external environment.

公开(公告)号：US20230377930A1

公开(公告)日：2023-11-23

申请号：US18197657

申请日：2023-05-15

Applicant: Applied Materials, Inc.

Inventor： Denis Martin Koosau ,  Suresh Gupta ,  Martin Perez-Guzman ,  Ashish Goel

IPC: H01L21/683

CPC classification number: H01L21/6833

Abstract: A substrate support assembly includes a plate structure and an insulator structure. The plate structure includes an upper plate and a lower plate. The lower plate includes a lower plate structure surface. The insulator structure is disposed beneath the plate structure. The insulator structure includes a lower insulator structure surface and an upper insulator structure surface. A first portion of the upper insulator structure surface is recessed with respect to a second portion of the upper insulator structure surface. The first portion of the upper insulator structure surface forms an interior volume with the lower plate structure surface.

公开(公告)号：US20210378119A1

公开(公告)日：2021-12-02

申请号：US16890013

申请日：2020-06-02

Applicant: APPLIED MATERIALS, INC.

Inventor： Phillip A. Criminale ,  Zhiqiang Guo ,  Philip A. Kraus ,  Andrew Myles ,  Martin Perez-Guzman

IPC: H05K5/06 ,  H05K1/18 ,  H05K7/14 ,  H05K5/03

Abstract: A diagnostic disc includes a disc-shaped body having raised walls that encircle the interior of the disc-shaped body and at least one protrusion extending outwardly from the disc-shaped body. The raised walls of the disc-shaped body define a cavity of the disc-shaped body. A non-contact sensor is attached to each of the at least one protrusion. A a printed circuit board (PCB) is positioned within the cavity formed on the disc-shaped body. A vacuum and high temperature tolerant power source is disposed on the PCB along with a wireless charger and circuitry that is coupled to each non-contact sensor and includes at least a wireless communication circuit and a memory. A cover is positioned over the cavity of the disc-shaped body and shields at least a portion of the PCB, circuitry, power source, and wireless charger within the cavity from an external environment.

公开(公告)号：US12185433B2

公开(公告)日：2024-12-31

申请号：US18197657

申请日：2023-05-15

Applicant: Applied Materials, Inc.

Inventor： Denis Martin Koosau ,  Suresh Gupta ,  Martin Perez-Guzman ,  Ashish Goel

IPC: H05B3/26 ,  H01L21/67 ,  H01L21/683

Abstract: A substrate support assembly includes a plate structure and an insulator structure. The plate structure includes an upper plate and a lower plate. The lower plate includes a lower plate structure surface. The insulator structure is disposed beneath the plate structure. The insulator structure includes a lower insulator structure surface and an upper insulator structure surface. A first portion of the upper insulator structure surface is recessed with respect to a second portion of the upper insulator structure surface. The first portion of the upper insulator structure surface forms an interior volume with the lower plate structure surface.