公开(公告)号：US20240079606A1

公开(公告)日：2024-03-07

申请号：US18344355

申请日：2023-06-29

Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA ,  ARISAWA MFG. CO., LTD.

Inventor： Takuya HATTORI ,  Nobuaki NONOYAMA ,  Makoto TAI ,  Akira YOSHIDA ,  Yurina ISHIKAWA ,  Hideaki DEGUCHI

IPC: H01M8/0221 ,  H01M8/0213 ,  H01M8/0226 ,  H01M8/0228 ,  H01M8/0254

CPC classification number: H01M8/0221 ,  H01M8/0213 ,  H01M8/0226 ,  H01M8/0228 ,  H01M8/0254

Abstract: A fuel cell separator material includes: a composite material containing electrically conductive particles and a binder resin; and soluble resin layers located on both sides of the composite material.

公开(公告)号：US20180022919A1

公开(公告)日：2018-01-25

申请号：US15549657

申请日：2016-02-08

Applicant: ARISAWA MFG. CO., LTD.

Inventor： Kazuo YOSHIKAWA ,  Makoto TAI ,  Nobuyuki IWANO

IPC: C08L75/04 ,  B32B7/12 ,  B32B27/08 ,  B32B27/40 ,  B32B27/36 ,  H05K1/03 ,  B32B27/20 ,  C08L25/06 ,  C08G18/73 ,  C08G18/44 ,  H05K1/02 ,  B32B7/06 ,  B32B27/38

CPC classification number: C08L75/04 ,  B32B7/06 ,  B32B7/12 ,  B32B27/08 ,  B32B27/20 ,  B32B27/36 ,  B32B27/38 ,  B32B27/40 ,  B32B2307/204 ,  B32B2457/08 ,  C08G18/348 ,  C08G18/44 ,  C08G18/6659 ,  C08G18/73 ,  C08G59/4269 ,  C08L25/04 ,  C08L25/06 ,  C09J163/00 ,  H01B3/302 ,  H01B3/40 ,  H05K1/0201 ,  H05K1/028 ,  H05K1/0346 ,  H05K1/0373 ,  H05K1/09 ,  H05K2201/0104 ,  H05K2201/0212

Abstract: The present invention provides a low-dielectric resin composition comprising (A) a urethane resin obtained by reacting a polycarbonate diol and an isocyanate, (B) an epoxy resin, and (C) a filler, wherein the (A) urethane resin has a carboxyl group equivalent weight of 1,100 to 5,700 g/eq; the epoxy equivalent weight of the (B) epoxy resin is 0.3 to 4.5 equivalents per 1.0 equivalent of the carboxyl group of the (A) urethane resin, the (A) urethane resin has a weight-average molecular weight of 5,000 to 80,000; the (A) urethane resin has a polycarbonate content of 35% by mass or lower; the resin composition comprises 50 parts by mass or less of the (C) filler per 100 parts by mass of the (A) urethane resin; and the resin composition comprises substantially no imido group.

公开(公告)号：US20200347177A1

公开(公告)日：2020-11-05

申请号：US16964738

申请日：2019-01-23

Applicant: ARISAWA MFG. CO., LTD.

Inventor： Makoto TAI ,  Takashi GONDAIRA

IPC: C08G18/42 ,  C08G18/08 ,  C08G18/28 ,  C08G18/32 ,  C08G18/75 ,  G03F7/027

Abstract: A photocurable resin composition according to the present invention contains an anionic-group-containing photosensitive resin comprising a photosensitive urethane resin, a photopolymerization initiator and a thermal curing agent, wherein the photosensitive urethane resin is produced by reacting a raw material mixture containing (A) a polyol having at least an ester bond and also having an unsaturated bond at least in the main chain thereof, (B) a compound having at least one active-hydrogen-containing group and at least one anionic group in the molecule thereof, (C) a polyisocyanate and (D) a compound having at least one active-hydrogen-containing group and an unsaturated bond group in the molecule thereof, and the photosensitive urethane resin has an ester bond and an unsaturated bond in the main chain in the same molecule, wherein at least one of a side chain and a terminal has an anionic group and a side chain has an unsaturated bond group.

公开(公告)号：US20200026186A1

公开(公告)日：2020-01-23

申请号：US16483547

申请日：2017-02-28

Applicant: ARISAWA MFG. CO., LTD.

Inventor： Takashi GONDAIRA ,  Makoto TAI

IPC: G03F7/029 ,  G03F7/039 ,  G03F7/038 ,  H05K1/02 ,  H05K1/03 ,  H05K3/28

Abstract: The present invention provides a photosensitive resin composition with which a dry resist film can be obtained, the dry resist film exhibiting excellent storage stability and migration resistance in thickness direction thereof. This photosensitive resin composition comprises: a photosensitive prepolymer having a carboxyl group and an ethylenically unsaturated group; a photopolymerization initiator; and a thermosetting agent. The thermosetting agent is a polycarbodiimide compound represented by formula (1), in which a carbodiimide group is protected by an amino group that dissociates at temperatures of 80° C. or greater. The polycarbodiimide compound has a weight average molecular weight of 300-3000, and a carbodiimide equivalent weight of 150-600. In formula (1), R1, R2, X1, X2, and n are as defined in the description.

公开(公告)号：US20200019054A1

公开(公告)日：2020-01-16

申请号：US16483990

申请日：2018-02-06

Applicant: ARISAWA MFG. CO., LTD.

Inventor： Takashi GONDAIRA ,  Makoto TAI

IPC: G03F7/004 ,  C08L33/06 ,  C08K5/29 ,  C08K5/00 ,  C08K5/5397 ,  H05K3/28

Abstract: This photosensitive resin composition comprises: a photosensitive prepolymer having a carboxyl group and an ethylenically unsaturated group; a photopolymerization initiator; a thermosetting agent; and a pigment. The thermosetting agent is a polycarbodiimide compound represented by formula (1), in which a carbodiimide group is protected by an amino group that dissociates at temperatures of 80□ or greater. The polycarbodiimide compound has a weight average molecular weight of 300-3000, and a carbodiimide equivalent weight of 150-600. When formed into a film having a dry film thickness of 10-40 μm, the maximum value of the transmittance of the photosensitive resin composition is at least 7% for the transmission spectrum of at least some of the wavelength from 350-430 nm. (In formula (1), R1, R2, X1, X2, and n are as defined in the description.)

公开(公告)号：US20190332011A1

公开(公告)日：2019-10-31

申请号：US16462147

申请日：2017-04-21

Applicant: ARISAWA MFG. CO., LTD.

Inventor： Takashi GONDAIRA ,  Makoto TAI

IPC: G03F7/028 ,  H05K3/28 ,  H05K1/03 ,  H05K1/09 ,  G03F7/085

Abstract: The present invention provides a photosensitive resin composition from which a dry resist film having excellent resilience, storage stability and heat resistance can be produced. The photosensitive resin composition according to the present invention includes a photosensitive prepolymer having a carboxyl group and an ethylenically unsaturated group, a photopolymerization initiator and a thermal curing agent, wherein the thermal curing agent is a polycarbodiimide compound having a carbodiimide group, the carbodiimide group in the polycarbodiimide compound is protected by an amino group that can be dissociated at a temperature equal to or higher than 80° C. and the polycarbodiimide compound has a weight average molecular weight of 400 to 5000 and a carbodiimide equivalent of 180 to 2500.

公开(公告)号：US20180242448A1

公开(公告)日：2018-08-23

申请号：US15896166

申请日：2018-02-14

Applicant: ARISAWA MFG. CO., LTD.

Inventor： Kazuo YOSHIKAWA ,  Makoto TAI ,  Nobuyuki IWANO ,  Takayuki MAYAMA

IPC: H05K1/03 ,  H05K3/00 ,  C08L53/00 ,  C08K3/36 ,  C09J153/00 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20

CPC classification number: H05K1/036 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  B32B2250/02 ,  B32B2250/05 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2379/08 ,  B32B2457/08 ,  C08K3/36 ,  C08K2003/2227 ,  C08L53/005 ,  C09J7/10 ,  C09J7/387 ,  C09J153/005 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2453/00 ,  H05K1/024 ,  H05K1/0373 ,  H05K1/0393 ,  H05K1/09 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/022 ,  H05K3/386 ,  H05K2201/0112 ,  H05K2201/0133 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/09509 ,  H05K2201/2063 ,  H05K2203/107

Abstract: The present invention provides a resin composition comprising a specific styrene polymer, a specific inorganic filler, and a curing agent, wherein the styrene polymer is a specific acid-modified styrene polymer, and the resin composition satisfies specific conditions in the form of a film having a thickness of 25 μm.