公开(公告)号：US20220004108A1

公开(公告)日：2022-01-06

申请号：US17479078

申请日：2021-09-20

Applicant: ASML NETHERLANDS B.V.

Inventor： Jelle NIJE ,  Alexander YPMA ,  Dimitra GKOROU ,  Georgios TSIROGIANNIS ,  Robert Jan VAN WIJK ,  Tzu-Chao CHEN ,  Frans Reinier SPIERING ,  Sarathi ROY ,  Cédric Désiré GROUWSTRA

IPC: G03F7/20

Abstract: A method of optimizing an apparatus for multi-stage processing of product units such as wafers, the method includes: receiving object data representing one or more parameters measured across the product units and associated with different stages of processing of the product units; and determining fingerprints of variation of the object data across the product units, the fingerprints being associated with different respective stages of processing of the product units. The fingerprints may be determined by decomposing the object data into components using principal component analysis for each different respective stage; analyzing commonality of the fingerprints through the different stages to produce commonality results; and optimizing an apparatus for processing product units based on the commonality results.

公开(公告)号：US20240339295A1

公开(公告)日：2024-10-10

申请号：US18744367

申请日：2024-06-14

Applicant: ASML NETHERLANDS B.V.

Inventor： Tzu-Chao CHEN ,  Te-Sheng WANG

IPC: H01J37/317 ,  G03F9/00 ,  H01J37/244 ,  H01J37/26 ,  H01J37/28

CPC classification number: H01J37/3177 ,  G03F9/7046 ,  H01J37/244 ,  H01J37/265 ,  H01J37/28 ,  H01J2237/24578 ,  H01J2237/24592 ,  H01J2237/2817

Abstract: Methods are disclosed for generating a sample map and processing a sample. In one arrangement, a method comprises measuring a position of a first mark in each of a plurality of field regions on sample. A first model is fitted to the measured positions of the first marks. The fitted first model represents positions of the field regions. The method comprises measuring positions of a plurality of second marks in one field region or in each of a plurality of field regions. A second model is fitted to the measured positions of the second marks. The fitted second model represents a shape of each field region. A sample map is output using the fitted first and second models.

公开(公告)号：US20210389677A1

公开(公告)日：2021-12-16

申请号：US17295193

申请日：2019-11-04

Applicant: ASML NETHERLANDS B.V.

Inventor： Chenxi LIN ,  Cyrus Emil TABERY ,  Hakki Ergün CEKLI ,  Simon Philip Spencer HASTINGS ,  Boris MENCHTCHIKOV ,  Yi ZOU ,  Yana CHENG ,  Maxime Philippe Frederic GENIN ,  Tzu-Chao CHEN ,  Davit HARUTYUNYAN ,  Youping ZHANG

IPC: G03F7/20 ,  G05B13/02 ,  G05B19/418 ,  H01L21/66

Abstract: A method for determining a root cause affecting yield in a process for manufacturing devices on a substrate, the method including: obtaining yield distribution data including a distribution of a yield parameter across the substrate or part thereof; obtaining sets of metrology data, each set including a spatial variation of a process parameter over the substrate or part thereof corresponding to a different layer of the substrate; comparing the yield distribution data and metrology data based on a similarity metric describing a spatial similarity between the yield distribution data and an individual set out of the sets of the metrology data; and determining a first similar set of metrology data out of the sets of metrology data, being the first set of metrology data in terms of processing order for the corresponding layers, which is determined to be similar to the yield distribution data.

公开(公告)号：US20210407112A1

公开(公告)日：2021-12-30

申请号：US17289874

申请日：2019-09-23

Applicant: ASML NETHERLANDS B.V.

Inventor： Wim Tjibbo TEL ,  Antoine Gaston Marie KIERS ,  Vadim Yourievich TIMOSHKOV ,  Hermanus Adrianus DILLEN ,  Yichen ZHANG ,  Te-Sheng WANG ,  Tzu-Chao CHEN

IPC: G06T7/33 ,  G06T7/00

Abstract: A method for determining an image-metric of features on a substrate, the method including: obtaining a first image of a plurality of features on a substrate; obtaining one or more further images of a corresponding plurality of features on the substrate, wherein at least one of the one or more further images is of a different layer of the substrate than the first image; generating aligned versions of the first and one or more further images by performing an alignment process on the first and one or more further images; and calculating an image-metric in dependence on a comparison of the features in the aligned version of the first image and the corresponding features in the one or more aligned versions of the one or more further images.

公开(公告)号：US20200233315A1

公开(公告)日：2020-07-23

申请号：US16486859

申请日：2018-02-22

Applicant: ASML NETHERLANDS B.V.

Inventor： Jelle NIJE ,  Alexander YPMA ,  Dimitra GKOROU ,  Georgios TSIROGIANNIS ,  Robert Jan VAN WIJK ,  Tzu-Chao CHEN ,  Frans Reinier SPIERING ,  Sarathi ROY ,  Cédric Désiré GROUWSTRA

IPC: G03F7/20

Abstract: A method of optimizing an apparatus for multi-stage processing of product units such as wafers, the method includes: receiving object data representing one or more parameters measured across the product units and associated with different stages of processing of the product units; and determining fingerprints of variation of the object data across the product units, the fingerprints being associated with different respective stages of processing of the product units. The fingerprints may be determined by decomposing the object data into components using principal component analysis for each different respective stage; analyzing commonality of the fingerprints through the different stages to produce commonality results; and optimizing an apparatus for processing product units based on the commonality results.