公开(公告)号：US20190279842A1

公开(公告)日：2019-09-12

申请号：US16357309

申请日：2019-03-18

Applicant: ASML Netherlands B.V.

Inventor： Weiming REN ,  Shuai LI ,  Xuedong LIU ,  Zhongwei CHEN ,  Jack JAU

IPC: H01J37/28

Abstract: A multi-beam apparatus for observing a sample with oblique illumination is proposed. In the apparatus, a new source-conversion unit changes a single electron source into a slant virtual multi-source array, a primary projection imaging system projects the array to form plural probe spots on the sample with oblique illumination, and a condenser lens adjusts the currents of the plural probe spots. In the source-conversion unit, the image-forming means not only forms the slant virtual multi-source array, but also compensates the off-axis aberrations of the plurality of probe spots. The apparatus can provide dark-field images and/or bright-field images of the sample.

公开(公告)号：US20220245780A1

公开(公告)日：2022-08-04

申请号：US17671522

申请日：2022-02-14

Applicant: ASML Netherlands B.V.

Inventor： Wei FANG ,  Zhao-Li ZHANG ,  Jack JAU

IPC: G06T7/00 ,  G06V10/44 ,  G06V10/50 ,  G06V10/46

Abstract: An inspection method includes the following steps: identifying a plurality of patterns within an image; and comparing the plurality of patterns with each other for measurement values thereof. The above-mentioned inspection method uses the pattern within the image as a basis for comparison; therefore, measurement values of the plurality of pixels constructing the pattern can be processed with statistical methods and then compared, and the false rate caused by variation of a few pixels is decreased significantly. An inspection system implementing the above-mentioned method is also disclosed.

公开(公告)号：US20200286710A1

公开(公告)日：2020-09-10

申请号：US16652397

申请日：2018-09-25

Applicant: ASML Netherlands B.V.

Inventor： Zhong-wei CHEN ,  Jack JAU ,  Wei FANG ,  Chiyan KUAN

IPC: H01J37/28 ,  H01L21/67

Abstract: Disclosed herein is a method comprising: determining parameters of a recipe of charged particle beam inspection of a region on a sample, based on a second set of characteristics of the sample; inspecting the region using the recipe.

公开(公告)号：US20200251305A1

公开(公告)日：2020-08-06

申请号：US16813572

申请日：2020-03-09

Applicant: ASML Netherlands B.V.

Inventor： Zhongwei CHEN ,  Jack JAU ,  Weiming REN

IPC: H01J37/28 ,  H01J37/29 ,  H01J37/285 ,  H01J37/02 ,  H01J37/22 ,  H01J37/20 ,  H01J37/14 ,  H01J37/10 ,  H01J37/244 ,  H01J37/26

Abstract: The present invention provides apparatuses to inspect small particles on the surface of a sample such as wafer and mask. The apparatuses provide both high detection efficiency and high throughput by forming Dark-field BSE images. The apparatuses can additionally inspect physical and electrical defects on the sample surface by form SE images and Bright-field BSE images simultaneously. The apparatuses can be designed to do single-beam or even multiple single-beam inspection for achieving a high throughput.

公开(公告)号：US20200227233A1

公开(公告)日：2020-07-16

申请号：US16833463

申请日：2020-03-27

Applicant: ASML Netherlands B.V.

Inventor： Kuo-Shih LIU ,  Xuedong LIU ,  Wei FANG ,  Jack JAU

IPC: H01J37/28 ,  H01J37/26

Abstract: Disclosed herein is a method comprising: generating a plurality of probe spots on a sample by a plurality of beams of charged particles; while scanning the plurality of probe spots across a region on the sample, recording from the plurality of probe spots a plurality of sets of signals respectively representing interactions of the plurality of beams of charged particles and the sample; generating a plurality of images of the region respectively from the plurality of sets of signals; and generating a composite image of the region from the plurality of images.