公开(公告)号：US10886208B2

公开(公告)日：2021-01-05

申请号：US16264602

申请日：2019-01-31

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Lin Ho ,  Chih-Cheng Lee ,  Chun Chen Chen ,  Chen Yuang Chen

IPC: H01L23/498 ,  H01L23/31 ,  H01L21/56 ,  H05K1/18 ,  H05K3/34 ,  H01L21/48

Abstract: A semiconductor device package includes a carrier, an electronic component, a connection element and an encapsulant. The electronic component is disposed on a surface of the carrier. The connection element is disposed on the surface and adjacent to an edge of the carrier. The encapsulant is disposed on the surface of the carrier. A portion of the connection element is exposed from an upper surface and an edge of the encapsulant.