公开(公告)号：US20140332947A1

公开(公告)日：2014-11-13

申请号：US14274531

申请日：2014-05-09

Applicant: ANALOG DEVICES, INC.

Inventor： Jicheng Yang ,  Asif Chowdhury ,  Manolo Mena ,  Jia Gao ,  Richard Sullivan ,  Thomas Goida ,  Carlo Tiongson ,  Dipak Sengupta

IPC: H01L23/053 ,  H01L23/10

CPC classification number: H01L23/053 ,  B81B7/0064 ,  B81C1/00269 ,  H01L23/04 ,  H01L23/06 ,  H01L23/10 ,  H01L23/552 ,  H01L23/564 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/1461 ,  H01L2924/16152 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Packaged integrated devices and methods of forming the same are provided. In one embodiment, a packaged integrated device includes a package substrate, a package lid, and an integrated circuit or microelectromechanical systems (MEMS) device. The package lid is mounted to a first surface of the package substrate using an epoxy, and the package lid and the package substrate define a package interior. The package lid includes an interior coating suited to good adhesion with the epoxy, and an exterior coating suited to RF shielding, where the materials of the interior and exterior coatings are different. In one example, the interior lid coating is nickel whereas the exterior lid coating is tin.

Abstract translation: 提供封装的集成器件及其形成方法。 在一个实施例中，封装集成器件包括封装衬底，封装盖以及集成电路或微机电系统（MEMS）器件。 封装盖使用环氧树脂安装到封装基板的第一表面上，封装盖和封装基板限定封装内部。 包装盖包括适合于与环氧树脂的良好粘附性的内部涂层，以及适用于RF屏蔽的外部涂层，其中内部和外部涂层的材料不同。 在一个实例中，内盖涂层是镍，而外盖涂层是锡。

公开(公告)号：US08853839B2

公开(公告)日：2014-10-07

申请号：US13645094

申请日：2012-10-04

Applicant: Analog Devices, Inc.

Inventor： Jia Gao ,  Jicheng Yang ,  Shafi Saiyed ,  Siu Lung Ng ,  Xiaojie Xue

IPC: H01L23/495

CPC classification number: H01L29/84 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C1/00269 ,  B81C2203/0109 ,  B81C2203/032 ,  B81C2203/035 ,  H01L23/047 ,  H01L23/49861 ,  H01L29/66007 ,  H01L2924/0002 ,  H01L2924/19107 ,  H01L2924/00

Abstract: A housing for integrated devices that includes an air-release mechanism is disclosed. This is achieved, in various embodiments, by forming a vent hole in a package substrate, and arranging a package lid over the package substrate. The vent hole allows air to be released from within the cavity package, thereby ensuring that the package lid remains stably affixed to the package substrate despite increased temperatures during processing. The vent hole may be sealed upon mounting the package onto a mounting substrate.

Abstract translation: 公开了一种用于包括空气释放机构的集成装置的壳体。 这在各种实施例中通过在封装衬底中形成通气孔并且在封装衬底上布置封装盖来实现。 通气孔允许空气从空腔包装内释放，从而确保包装盖保持稳定地固定到包装基板上，尽管加工过程中温度升高。 当将包装件安装到安装基板上时，通气孔可以被密封。

公开(公告)号：US09142470B2

公开(公告)日：2015-09-22

申请号：US14274531

申请日：2014-05-09

Applicant: ANALOG DEVICES, INC.

Inventor： Jicheng Yang ,  Asif Chowdhury ,  Manolo Mena ,  Jia Gao ,  Richard Sullivan ,  Thomas Goida ,  Carlo Tiongson ,  Dipak Sengupta

IPC: H04B1/06 ,  H01L23/053 ,  B81B7/00 ,  B81C1/00 ,  H01L23/04 ,  H01L23/06 ,  H01L23/10 ,  H01L23/552 ,  H01L23/00

CPC classification number: H01L23/053 ,  B81B7/0064 ,  B81C1/00269 ,  H01L23/04 ,  H01L23/06 ,  H01L23/10 ,  H01L23/552 ,  H01L23/564 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/1461 ,  H01L2924/16152 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Packaged integrated devices and methods of forming the same are provided. In one embodiment, a packaged integrated device includes a package substrate, a package lid, and an integrated circuit or microelectromechanical systems (MEMS) device. The package lid is mounted to a first surface of the package substrate using an epoxy, and the package lid and the package substrate define a package interior. The package lid includes an interior coating suited to good adhesion with the epoxy, and an exterior coating suited to RF shielding, where the materials of the interior and exterior coatings are different. In one example, the interior lid coating is nickel whereas the exterior lid coating is tin.

Abstract translation: 提供封装的集成器件及其形成方法。 在一个实施例中，封装集成器件包括封装衬底，封装盖以及集成电路或微机电系统（MEMS）器件。 封装盖使用环氧树脂安装到封装基板的第一表面上，封装盖和封装基板限定封装内部。 包装盖包括适合于与环氧树脂的良好粘附性的内部涂层，以及适用于RF屏蔽的外部涂层，其中内部和外部涂层的材料不同。 在一个实例中，内盖涂层是镍，而外盖涂层是锡。

公开(公告)号：US20130195284A1

公开(公告)日：2013-08-01

申请号：US13795026

申请日：2013-03-12

Applicant: ANALOG DEVICES, INC.

Inventor： Jicheng Yang ,  Thomas M. Goida

IPC: H04R1/04

CPC classification number: H04R1/04 ,  B81B7/0061 ,  B81B2201/0257 ,  B81B2207/012 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/73265 ,  H01L2924/15151 ,  H01L2924/16152 ,  H04R1/222 ,  H04R19/005 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A microphone system has a base forming a base aperture, and a lid coupled to the base to form a package having an interior chamber. The system also has a member coupled with the base within the interior chamber, and a microphone die coupled to the member within the interior chamber. The member is positioned between the base and the microphone die and has a member aperture that is laterally offset from the base aperture. The member aperture, member, and base together form an acoustic path between the base aperture and the microphone die.

Abstract translation: 麦克风系统具有形成基座孔的底座和联接到基座的盖以形成具有内部腔室的包装。 该系统还具有与内部室内的基部连接的构件，以及耦合到内部室内的构件的麦克风模具。 该构件位于基座和麦克风模具之间，并且具有从基座孔侧向偏移的构件孔。 构件孔，构件和底座一起在基座孔和麦克风管芯之间形成声路。

公开(公告)号：US20130093031A1

公开(公告)日：2013-04-18

申请号：US13645094

申请日：2012-10-04

Applicant: Analog Devices, Inc.

Inventor： Jia Gao ,  Jicheng Yang ,  Shafi Saiyed ,  Siu Lung Ng ,  Xiaojie Xue

IPC: H01L29/84 ,  H01L29/66

CPC classification number: H01L29/84 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C1/00269 ,  B81C2203/0109 ,  B81C2203/032 ,  B81C2203/035 ,  H01L23/047 ,  H01L23/49861 ,  H01L29/66007 ,  H01L2924/0002 ,  H01L2924/19107 ,  H01L2924/00

Abstract: A housing for integrated devices that includes an air-release mechanism is disclosed. This is achieved, in various embodiments, by forming a vent hole in a package substrate, and arranging a package lid over the package substrate. The vent hole allows air to be released from within the cavity package, thereby ensuring that the package lid remains stably affixed to the package substrate despite increased temperatures during processing. The vent hole may be sealed upon mounting the package onto a mounting substrate.

Abstract translation: 公开了一种用于包括空气释放机构的集成装置的壳体。 这在各种实施例中通过在封装衬底中形成通气孔并且在封装衬底上布置封装盖来实现。 通气孔允许空气从空腔包装内释放，从而确保包装盖保持稳定地固定到包装基板上，尽管加工过程中温度升高。 当将包装件安装到安装基板上时，通气孔可以被密封。