公开(公告)号：US11984302B2

公开(公告)日：2024-05-14

申请号：US17088407

申请日：2020-11-03

Applicant: Applied Materials, Inc.

Inventor： Job George Konnoth Joseph ,  Sathya Swaroop Ganta ,  Kallol Bera ,  Andrew Nguyen ,  Jay D. Pinson, II ,  Akshay Dhanakshirur ,  Kaushik Comandoor Alayavalli ,  Canfeng Lai ,  Ren-Guan Duan ,  Jennifer Y. Sun ,  Anil Kumar Kalal ,  Abhishek Pandey

IPC: H01J37/32 ,  H01J37/20

CPC classification number: H01J37/32669 ,  H01J37/20 ,  H01J2237/0264

Abstract: A plasma chamber includes a chamber body having a processing region therewithin, a liner disposed on the chamber body, the liner surrounding the processing region, a substrate support disposed within the liner, a magnet assembly comprising a plurality of magnets disposed around the liner, and a magnetic-material shield disposed around the liner, the magnetic-material shield encapsulating the processing region near the substrate support.