公开(公告)号：US11119051B2

公开(公告)日：2021-09-14

申请号：US17062231

申请日：2020-10-02

Applicant: Applied Materials, Inc.

Inventor： Todd Egan ,  Mehdi Vaez-Iravani ,  Samer Banna ,  Kyle Tantiwong ,  Gregory Kirk ,  Abraham Ravid ,  Yaoming Shen

IPC: G01N21/00 ,  G01N21/95 ,  H01L21/67 ,  G01N15/02 ,  G01N15/14 ,  G01N21/94

Abstract: A system for processing a substrate is provided. The system includes a process chamber including one or more sidewalls enclosing a processing region; and a substrate support. The system further includes a passageway connected to the process chamber; and a first particle detector disposed at a first location along the passageway. The first particle detector includes an energy source configured to emit a first beam; one or more optical devices configured to direct the first beam along one or more paths, where the one or more paths extend through at least a portion of the passageway. The first particle detector further includes a first energy detector disposed at a location other than on the one or more paths. The system further includes a controller configured to communicate with the first particle detector, wherein the controller is configured to identify a fault based on signals received from the first particle detector.

公开(公告)号：US09631919B2

公开(公告)日：2017-04-25

申请号：US14066005

申请日：2013-10-29

Applicant: APPLIED MATERIALS, INC.

Inventor： Abraham Ravid ,  Dmitry A. Dzilno ,  Todd J. Egan ,  Robert O. Miller

IPC: G01R31/02 ,  G01B7/06 ,  C25D21/12 ,  G01N27/20 ,  C25D17/00 ,  C25D7/12 ,  C25D17/12

CPC classification number: G01B7/105 ,  C25D7/123 ,  C25D17/001 ,  C25D17/12 ,  C25D21/12 ,  G01N27/20

Abstract: A measurement tool for measuring an electrical parameter of a metal film deposited on a front side of a workpiece includes an electrical sensor connected to a workpiece contact point, an energy beam source with a beam impact location on the front side, a holder and a translation mechanism capable of translating the holder relative to the workpiece support, the beam source supported on the holder, and a computer programmed to sense a behavior of an electrical parameter sensed by the sensor.

公开(公告)号：US20140367267A1

公开(公告)日：2014-12-18

申请号：US14066092

申请日：2013-10-29

Applicant: APPLIED MATERIALS, INC.

Inventor： Todd J. Egan ,  Edward W. Budiarto ,  Robert O. Miller ,  Abraham Ravid ,  Bridger E. Hoerner ,  Robert W. Batz, JR. ,  Daniel J. Woodruff

IPC: C25D21/12 ,  C25D7/12

CPC classification number: C25D17/001 ,  C25D7/123 ,  C25D17/12 ,  C25D21/12 ,  G01B7/105 ,  G01N27/20 ,  G01R31/2653 ,  G01R31/2656 ,  H01L22/20

Abstract: An electroplating reactor includes an electro-plating solution in a bath, a ring cathode in the bath and located to contact a workpiece such that only the front side of the workpiece is immersed in the solution, plural anodes immersed in the bath below the ring cathode, and plural anode voltage sources coupled to the plural anodes; plural thickness sensors at spatially separate locations on the back side of the workpiece with feedback control to the anode voltage sources.

Abstract translation: 电镀反应器包括镀槽中的电镀溶液，镀槽中的环形阴极，定位成与工件接触，使得仅将工件的前侧浸入溶液中，将多个阳极浸入阴极下方的阴极 以及耦合到所述多个阳极的多个阳极电压源; 多个厚度传感器在工件后侧的空间上分开的位置上，对阳极电压源进行反馈控制。

公开(公告)号：US20190244842A1

公开(公告)日：2019-08-08

申请号：US16388132

申请日：2019-04-18

Applicant: Applied Materials, Inc.

Inventor： Abraham Ravid ,  Kevin Griffin ,  Joseph Yudovsky ,  Kaushal Gangakhedkar ,  Dmitry A. Dzilno ,  Alex Minkovich

IPC: H01L21/67 ,  C23C16/455 ,  H01L21/687 ,  C23C16/52 ,  C23C16/458

CPC classification number: H01L21/67259 ,  C23C16/45544 ,  C23C16/4584 ,  C23C16/52 ,  H01L21/67248 ,  H01L21/68764 ,  H01L21/68771

Abstract: Apparatus and methods of measuring and controlling the gap between a susceptor assembly and a gas distribution assembly are described. Apparatus and methods for positional control and temperature control for wafer transfer purposes are also described.

公开(公告)号：US10196741B2

公开(公告)日：2019-02-05

申请号：US14471884

申请日：2014-08-28

Applicant: Applied Materials, Inc.

Inventor： Kevin Griffin ,  Abraham Ravid ,  Alex Minkovich ,  Somesh Khandelwal ,  Joseph Yudovsky ,  Todd Egan

IPC: B05C1/08 ,  B05C11/10 ,  C23C16/458 ,  C23C16/455 ,  C23C16/52 ,  G01D5/24

Abstract: Apparatus and methods of dimension control and monitoring between a processes fixture and a susceptor, and position determination of wafers are described.

公开(公告)号：US11715193B2

公开(公告)日：2023-08-01

申请号：US16744058

申请日：2020-01-15

Applicant: Applied Materials, Inc.

Inventor： Dominic J. Benvegnu ,  Robert D. Tolles ,  Boguslaw A. Swedek ,  Abraham Ravid

IPC: G06T7/00 ,  H04N23/10 ,  B24B37/013 ,  G06F3/04842 ,  G06F3/04847 ,  G06F3/0486 ,  G06T5/00 ,  G06T5/50

CPC classification number: G06T7/0006 ,  B24B37/013 ,  G06F3/0486 ,  G06F3/04842 ,  G06F3/04847 ,  G06T5/002 ,  G06T5/50 ,  G06T7/0004 ,  H04N23/10 ,  G06T2207/10024 ,  G06T2207/20024 ,  G06T2207/20216 ,  G06T2207/30148

Abstract: A metrology technique for analyzing a substrate includes storing data indicating a boundary of an area in a 2-dimensional color space having a pair of color channels including a first color channel and a second color channel as axes of the color space, receiving color data of a substrate from a camera, generating a color image of the substrate from the color data, performing a comparison of a pair of color values for the pair of color channels for the pixel to the boundary of the area in the 2-dimensional color space for each pixel of a plurality of pixels of the color image to determine whether the pair of color values meet thresholds provided by the boundary, and generating a signal to an operator based on results of the comparison for the plurality of pixels.

公开(公告)号：US20200151868A1

公开(公告)日：2020-05-14

申请号：US16744058

申请日：2020-01-15

Applicant: Applied Materials, Inc.

Inventor： Dominic J. Benvegnu ,  Robert D. Tolles ,  Boguslaw A. Swedek ,  Abraham Ravid

IPC: G06T7/00 ,  H04N9/04 ,  G06T5/50 ,  G06T5/00 ,  G06F3/0486 ,  G06F3/0484 ,  B24B37/013

Abstract: A metrology technique for analyzing a substrate includes storing data indicating a boundary of an area in a 2-dimensional color space having a pair of color channels including a first color channel and a second color channel as axes of the color space, receiving color data of a substrate from a camera, generating a color image of the substrate from the color data, performing a comparison of a pair of color values for the pair of color channels for the pixel to the boundary of the area in the 2-dimensional color space for each pixel of a plurality of pixels of the color image to determine whether the pair of color values meet thresholds provided by the boundary, and generating a signal to an operator based on results of the comparison for the plurality of pixels.

公开(公告)号：US09405287B1

公开(公告)日：2016-08-02

申请号：US14806220

申请日：2015-07-22

Applicant: APPLIED MATERIALS, INC.

Inventor： Abraham Ravid ,  Todd J. Egan ,  Eran Weiss ,  Michael R. Rice ,  Izya Kremerman

IPC: G06F7/00 ,  G06F19/00 ,  G05B19/19

CPC classification number: G05B19/402 ,  G05B2219/39157 ,  G05B2219/40572

Abstract: An optical calibration method and apparatus for calibration of wafer positioning within a reactor chamber under process conditions employs an array of cameras in a lid of the chamber using images of the wafer edge to locate the wafer relative to the reference feature.

Abstract translation: 用于在处理条件下校准在反应器室内的晶片定位的光学校准方法和装置使用晶片边缘的图像的相机的阵列中的相机相对于参考特征定位晶片。

公开(公告)号：US11430680B2

公开(公告)日：2022-08-30

申请号：US16388132

申请日：2019-04-18

Applicant: Applied Materials, Inc.

Inventor： Abraham Ravid ,  Kevin Griffin ,  Joseph Yudovsky ,  Kaushal Gangakhedkar ,  Dmitry A. Dzilno ,  Alex Minkovich

IPC: H01L21/67 ,  C23C16/52 ,  H01L21/687 ,  C23C16/455 ,  C23C16/458

Abstract: Apparatus and methods of measuring and controlling the gap between a susceptor assembly and a gas distribution assembly are described. Apparatus and methods for positional control and temperature control for wafer transfer purposes are also described.

公开(公告)号：US10312120B2

公开(公告)日：2019-06-04

申请号：US14774377

申请日：2014-03-14

Applicant: Applied Materials, Inc.

Inventor： Abraham Ravid ,  Kevin Griffin ,  Joseph Yudovsky ,  Kaushal Gangakhedkar ,  Dmitry A. Dzilno ,  Alex Minkovich

IPC: H01L21/67 ,  C23C16/44 ,  H01L21/687 ,  C23C16/52 ,  C23C16/455 ,  C23C16/458

Abstract: Apparatus and methods of measuring and controlling the gap between a susceptor assembly and a gas distribution assembly are described. Apparatus and methods for positional control and temperature control for wafer transfer purposes are also described.