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公开(公告)号：US20230042777A1
公开(公告)日：2023-02-09
申请号：US17971692
申请日：2022-10-24
Applicant: Applied Materials, Inc.
Inventor： Alexander N. LERNER , Roey SHAVIV , Prashanth KOTHNUR , Satish RADHAKRISHNAN , Xiaozhou CHE
IPC: C23C16/448 , C23C16/458 , C23C16/455 , C23C16/52 , C23C14/00 , C23C16/00
Abstract: One or more embodiments described herein generally relate to methods and systems for forming films on substrates in semiconductor processes. In embodiments described herein, a process system includes different materials each contained in separate ampoules. Each material is flowed into a separate portion of a showerhead contained within a process chamber via a heated gas line. From the showerhead, each material is flowed on to a substrate that sits on the surface of a rotating pedestal. Controlling the mass flow rate out of the showerhead and the rotation rate of the pedestal helps result in films with desirable material domain sizes to be deposited on the substrate.
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公开(公告)号：US20210028726A1
公开(公告)日：2021-01-28
申请号：US16655168
申请日：2019-10-16
Applicant: Applied Materials, Inc.
Inventor： Alexander N. LERNER , Kim Ramkumar VELLORE , Steven Trey TINDEL
IPC: H02N13/00 , H01L51/00 , H01L51/56 , C23C16/458
Abstract: A chucking station comprises a chuck, a power supply, and one or more pumping elements. The chuck comprises a plurality of first vacuum ports configured to interface with a surface of a substrate and a plurality of second vacuum ports configured to interface with a surface of a carrier. The chuck further comprises a first electrical pin configured to be in electrical communication with a first electrode of the carrier, and a second electrical pin configured to be in electrical communication with a second electrode of the carrier. The power supply is configured to apply a chucking voltage and a de-chucking voltage to the first and second electrical pins. The one or more pumping elements is coupled to the first and second vacuum ports and configured to generate a vacuum between the substrate and the chuck and a vacuum between the carrier and the chuck.
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3.发明申请公开(公告)号：US20210028044A1
公开(公告)日：2021-01-28
申请号：US16552967
申请日：2019-08-27
Applicant: Applied Materials, Inc.
Inventor： Kim Ramkumar VELLORE , Alexander N. LERNER , Steven Trey TINDEL
IPC: H01L21/68 , H01L21/67 , H01L21/677 , H01L21/687 , H01L21/683 , H01L21/673
Abstract: A method includes aligning and positioning a carrier in a predetermined orientation and location within a first front opening pod (FOUP) of a cluster tool, transferring the carrier to a charging station of the cluster tool, transferring a substrate from a second front opening pod (FOUP) of the cluster tool to the charging station and chucking the substrate onto the carrier, transferring the carrier having the substrate thereon from the charging station to a factory interface of the cluster tool, aligning the carrier having the substrate thereon in the factory interface of the cluster tool such that during substrate processing within a processing platform of the cluster tool the carrier is properly oriented and positioned relative to components of the processing platform, where the processing platform comprises one or more processing chambers, transferring the aligned carrier having the substrate thereon from the factory interface to the processing platform of the cluster tool for substrate processing, and transferring the aligned carrier having the processed substrate thereon from the processing platform to the factory interface.
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公开(公告)号：US20200373134A1
公开(公告)日：2020-11-26
申请号：US16848614
申请日：2020-04-14
Applicant: Applied Materials, Inc.
Inventor： Alexander N. LERNER , Michael P. KARAZIM , Andrew J. CONSTANT , Jeffrey A. BRODINE , Kim Ramkumar VELLORE , Kevin MORAES , Roey SHAVIV
IPC: H01J37/32 , C23C16/04 , H01L21/68 , H01L21/677 , H01L21/673
Abstract: An alignment module for housing and cleaning masks. The alignment module comprises a mask stocker, a cleaning chamber, an alignment chamber, an alignment stage a transfer robot. The mask stocker is configured to house a mask cassette configured to store a plurality of masks. The cleaning chamber is configured to clean the plurality of masks by providing one or more cleaning gases into a chamber after a mask is inserted into the cleaning chamber. The alignment stage is configured to support a carrier and a substrate. The transfer robot is configured to transfer a mask from one or more of the alignment stage and the mask stocker to the cleaning chamber.
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公开(公告)号：US20200371448A1
公开(公告)日：2020-11-26
申请号：US16807860
申请日：2020-03-03
Applicant: Applied Materials, Inc.
Inventor： Greg FREEMAN , Patricia A. SCHULZE , Ozkan CELIK , Alexander N. LERNER
Abstract: Methods and apparatuses for aligning masks with substrates are provided. A method can include receiving a carrier having a substrate disposed thereon at an alignment stage of an alignment module, transferring a mask from a mask cassette of a mask stocker of the alignment module to a position over the alignment stage, and positioning the mask on the carrier. The method can also include acquiring one or more images of the mask and the substrate, where the mask contains one or more alignment holes passing through the mask and the substrate contains one or more alignment dots disposed on an upper surface of the substrate, analyzing the one or more images to determine one or more differences between one or more alignment holes of the mask and one or more alignment dots on the substrate, and aligning the mask with the substrate based on the differences.
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Patent Agency Ranking
公开(公告)号：US20140199786A1
公开(公告)日：2014-07-17
申请号：US14189696
申请日：2014-02-25
Applicant: APPLIED MATERIALS, INC.
Inventor： Khurshed SORABJI , Alexander N. LERNER
CPC classification number: H01L21/67098 , C30B31/14 , H01L21/30 , H01L21/67109 , H01L21/67115 , H01L22/10 , H01L2924/0002 , H01L2924/00
Abstract: In one embodiment, a substrate processing apparatus includes a chamber having an interior volume with an upper portion and a lower portion, a cooling source disposed in the upper portion of the interior volume, a heating source opposing the cooling source, a magnetically movable substrate support that moves between the upper portion and the lower the portion, and a plurality of sensors coupled to the chamber to detect the position of the substrate support relative to the heating source and the cooling source
Abstract translation: 在一个实施例中，衬底处理设备包括具有内部容积的腔室，其具有上部和下部，设置在内部容积的上部的冷却源，与冷却源相对的加热源，可磁性的衬底支撑 其在上部和下部之间移动，并且多个传感器耦合到室以检测基板支撑件相对于加热源和冷却源的位置
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公开(公告)号：US20210025048A1
公开(公告)日：2021-01-28
申请号：US16923600
申请日：2020-07-08
Applicant: Applied Materials, Inc.
Inventor： Alexander N. LERNER , Roey SHAVIV , Satish RADHAKRISHNAN
Abstract: One or more embodiments described herein generally relate to methods and systems for forming films on substrates in semiconductor processes. In embodiments described herein, process chamber is provided that includes a lid plate having a plurality of cooling channels formed therein, a pedestal, the pedestal having a plurality of cooling channels formed therein, and a showerhead, wherein the showerhead comprises a plurality of segments and each segment is at least partially surrounded by a shield.
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8.发明申请公开(公告)号：US20210159106A1
公开(公告)日：2021-05-27
申请号：US17157428
申请日：2021-01-25
Applicant: Applied Materials, Inc.
Inventor： Kim Ramkumar VELLORE , Alexander N. LERNER , Steven Trey TINDEL
IPC: H01L21/68 , H01L21/67 , H01L21/677 , H01L21/673 , H01L21/683 , H01L21/687
Abstract: A method includes aligning and positioning a carrier in a predetermined orientation and location within a first front opening pod (FOUP) of a cluster tool, transferring the carrier to a charging station of the cluster tool, transferring a substrate from a second front opening pod (FOUP) of the cluster tool to the charging station and chucking the substrate onto the carrier, transferring the carrier having the substrate thereon from the charging station to a factory interface of the cluster tool, aligning the carrier having the substrate thereon in the factory interface of the cluster tool such that during substrate processing within a processing platform of the cluster tool the carrier is properly oriented and positioned relative to components of the processing platform, where the processing platform comprises one or more processing chambers, transferring the aligned carrier having the substrate thereon from the factory interface to the processing platform of the cluster tool for substrate processing, and transferring the aligned carrier having the processed substrate thereon from the processing platform to the factory interface.
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公开(公告)号：US20210069745A1
公开(公告)日：2021-03-11
申请号：US17013462
申请日：2020-09-04
Applicant: Applied Materials, Inc.
Inventor： Alexander N. LERNER , Roey SHAVIV , Phillip STOUT , Prashanth KOTHNUR , Joseph M. RANISH
Abstract: Embodiments of the present disclosure generally relate to organic vapor deposition systems and substrate processing methods related thereto. In one embodiment, a processing system comprises a lid assembly and a plurality of material delivery systems. The lid assembly includes lid plate having a first surface and a second surface disposed opposite of the first surface and a showerhead assembly coupled to the first surface. The showerhead assembly comprises a plurality of showerheads. Individual ones of the plurality of material delivery systems are fluidly coupled to one or more of the plurality of showerheads and are disposed on the second surface of the lid plate. Each of the material delivery systems comprise a delivery line, a delivery line valve disposed on the delivery line, a bypass line fluidly coupled to the delivery line at a point disposed between the delivery line valve and the showerhead, and a bypass valve disposed on the bypass line.
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公开(公告)号：US20210028039A1
公开(公告)日：2021-01-28
申请号：US16568910
申请日：2019-09-12
Applicant: Applied Materials, Inc.
Inventor： Steven Trey TINDEL , Alexander N. LERNER , Kim Ramkumar VELLORE
IPC: H01L21/673 , H01L21/68
Abstract: A carrier FOUP and a method of placing a carrier are provided. The carrier FOUP includes a body and a door. The body includes a plurality of chamfers, and one or more carriers are placed on, and supported by, the plurality of chamfers. The method of placing a carrier includes placing the carrier in the carrier FOUP and closing the door of the carrier FOUP. When the door is closed, the door pushes against the carrier and aligns the carrier with the alignment feature. The alignment features align the carrier, removing the need to be aligned by the factory interface robot when placing or removing the carrier from the carrier FOUP.
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