公开(公告)号：US20230133402A1

公开(公告)日：2023-05-04

申请号：US17968561

申请日：2022-10-18

Applicant: Applied Materials, Inc.

Inventor： Christopher S. OLSEN ,  Kartik Bhupendra SHAH ,  Chaitanya Anjaneyalu PRASAD ,  Vishwas Kumar PANDEY ,  AnilKumar BODEPUDI ,  Erika HANSEN

IPC: C23C16/455 ,  C23C16/52 ,  C23C16/458

Abstract: The present disclosure relates to a gas injection module for a process chamber. The process chamber includes a chamber body, a rotatable substrate support disposed inside a process volume of the chamber body, the substrate support configured to have a rotational spin rate; an inlet port formed in the chamber body, and an injection module coupled to the inlet port. The injection module includes a body, one or more gas inlets coupled to the body, and a plurality of nozzles formed in a supply face of the body, the supply face configured to face inside the chamber body, and gas exiting from the injection module is configured to have a flow rate; the process chamber also includes a controller configured to operate the process chamber such that the ratio of the flow rate to the rotational spin rate is between about 1/3 and 3.