公开(公告)号：US20240309547A1

公开(公告)日：2024-09-19

申请号：US18122530

申请日：2023-03-16

Applicant: Applied Materials, Inc.

Inventor： Ala MORADIAN ,  Awse MA'AYA

IPC: C30B25/08 ,  C30B25/10 ,  C30B25/14 ,  H10N10/851 ,  H10N10/853

CPC classification number: C30B25/08 ,  C30B25/105 ,  C30B25/14 ,  H10N10/853 ,  H10N10/8556

Abstract: A processing system applicable for use in semiconductor manufacturing, including a chamber including one or more sidewalls defining an internal volume, one or more heat sources configured to generate heat, a liner disposed in the internal volume and lining one or more sidewalls, and cooling channels. The processing system includes a fluid system in fluid communication with the cooling channels, the fluid system including supply lines configured to supply a fluid to the cooling channels at a first temperature, and return lines configured to flow the fluid from the cooling channels at a second temperature that is higher than the first temperature, and a fluid motor configured to move the fluid. The processing system includes an energy harnessing device configured to harness energy to produce electrical energy, the energy harnessing device comprising one or more thermoelectric generators (TEGs).

公开(公告)号：US20240309548A1

公开(公告)日：2024-09-19

申请号：US18122537

申请日：2023-03-16

Applicant: Applied Materials, Inc.

Inventor： Awse MA'AYA ,  Ala MORADIAN

IPC: C30B25/08 ,  C30B25/10 ,  C30B25/12 ,  C30B25/14 ,  F03G7/00

CPC classification number: C30B25/08 ,  C30B25/105 ,  C30B25/12 ,  C30B25/14 ,  F03G7/0252

Abstract: A processing system including a chamber that includes one or more sidewalls defining an internal volume, one or more heat sources configured to generate heat, a liner disposed in the internal volume and lining one or more sidewalls, and one or more cooling channels. The processing system includes a fluid system in fluid communication with the cooling channels, the fluid system including one or more supply lines configured to supply a fluid to the cooling channels at a first temperature, and one or more return lines configured to flow the fluid from the cooling channels at a second temperature that is higher than the first temperature, and a fluid motor configured to move the fluid. The processing system includes an energy harnessing device configured to harness energy to produce electrical energy, the energy harnessing device including one or more turbines.

公开(公告)号：US20240258141A1

公开(公告)日：2024-08-01

申请号：US18160274

申请日：2023-01-26

Applicant: Applied Materials, Inc.

Inventor： Zhepeng CONG ,  Tao SHENG ,  Nimrod SMITH ,  Khokan C. PAUL ,  Vinh N. TRAN ,  Awse MA'AYA

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/68 ,  H01L21/687

CPC classification number: H01L21/67259 ,  H01L21/67167 ,  H01L21/67742 ,  H01L21/681 ,  H01L21/68764

Abstract: An apparatus, method, and system for calibrating substrate positioning and placement on a substrate support in a process chamber via imaging. In an embodiment, a calibrating substrate is provided. The calibrating substrate generally includes a top surface having a plurality of first marking features and a at least one edge marking feature configured to be detectable relative to the remaining portions of the top surface of the body by an imaging apparatus.