公开(公告)号：US20200373178A1

公开(公告)日：2020-11-26

申请号：US16876257

申请日：2020-05-18

Applicant: Applied Materials, Inc.

Inventor： Sanggyum Kim ,  Prasanth Narayanan ,  Subramanian Tamilmani ,  Mandyam Sriram

IPC: H01L21/67 ,  H01L21/66

Abstract: Apparatus and methods to process one or more substrate are described. A processing chamber comprises a support assembly, a chamber lid, and a controller. The chamber lid has a front surface facing the support assembly, a first sensor on the front surface and a second sensor on the front surface, the first sensor positioned at a first distance from the central rotational axis, and the second sensor positioned at a second distance from the central rotational axis greater than the first distance. The controller is configured to determine if a substrate is within or outside of the substrate support region of the support assembly.

公开(公告)号：US20230307216A1

公开(公告)日：2023-09-28

申请号：US17968454

申请日：2022-10-18

Applicant: Applied Materials, Inc.

Inventor： Prasanth Narayanan ,  Shrihari Sampathkumar ,  Keiichi Tanaka ,  Mario D. Sanchez ,  Muhammad M. Rasheed ,  Mandyam Sriram

IPC: H01J37/32

CPC classification number: H01J37/32862 ,  H01J37/32357 ,  H01J37/32449 ,  H01J2237/327

Abstract: Processing chambers comprising a chamber body, a remote plasma source (RPS) outside the chamber body, a first connection line between the remote plasma source and the interior volume of the chamber body through the top wall and a second connection line between the remote plasma source and the interior volume through the sidewall of the chamber body. Methods of cleaning a processing chamber comprising flowing an etchant gas through the RPS into the chamber body, followed by a flow recovery gas through the RPS into the chamber body through both the first connection line and second connection line.

公开(公告)号：US20240141492A1

公开(公告)日：2024-05-02

申请号：US18125215

申请日：2023-03-23

Applicant: Applied Materials, Inc.

Inventor： Prasanth Narayanan ,  Vijayabhaskara Venkatagiriyappa ,  Keiichi Tanaka ,  Ning Li ,  Robert B. Moore ,  Robert C. Linke ,  Mandyam Sriram ,  Mario D. Silvetti ,  Michael Racine ,  Tae Kwang Lee

IPC: C23C16/458

CPC classification number: C23C16/4581 ,  C23C16/4583

Abstract: Susceptor assemblies having a susceptor base with a plurality of pockets formed in a surface thereof are described. Each of the pockets has a pocket edge angle in the range of 30 to 75° and a pocket edge radius in the range of 0.40±0.05 mm to 1.20 mm±0.05 mm. The pockets have a raised central region and an outer region that is deeper than the raised central region, relative to the surface of the surface of the susceptor base.

公开(公告)号：US11133205B2

公开(公告)日：2021-09-28

申请号：US16876257

申请日：2020-05-18

Applicant: Applied Materials, Inc.

Inventor： Sanggyum Kim ,  Prasanth Narayanan ,  Subramanian Tamilmani ,  Mandyam Sriram

IPC: H01L21/67 ,  H01L21/66

Abstract: Apparatus and methods to process one or more substrate are described. A processing chamber comprises a support assembly, a chamber lid, and a controller. The chamber lid has a front surface facing the support assembly, a first sensor on the front surface and a second sensor on the front surface, the first sensor positioned at a first distance from the central rotational axis, and the second sensor positioned at a second distance from the central rotational axis greater than the first distance. The controller is configured to determine if a substrate is within or outside of the substrate support region of the support assembly.