Connector block and method of making the same
    1.
    发明授权
    Connector block and method of making the same 失效
    连接器块及其制造方法

    公开(公告)号:US3665375A

    公开(公告)日:1972-05-23

    申请号:US3665375D

    申请日:1970-07-23

    CPC classification number: H01R12/721 H01R4/028

    Abstract: A connector block formed from an extruded hollow insulating body of uniform cross section having grooves in the sides of the body at selected locations along its length and terminals inserted into the body through certain of the grooves. Contacts are inserted through grooves to establish electrical connections with the terminals in the body and portions of the terminals extend from the body for establishing electrical connections with circuitry on the board.

    Circuit board eyelet
    2.
    发明授权
    Circuit board eyelet 失效
    电路板眼镜

    公开(公告)号:US3654583A

    公开(公告)日:1972-04-04

    申请号:US3654583D

    申请日:1970-06-22

    Inventor: MANCINI LLOYD

    Abstract: A circuit board solder eyelet having a flange with a flat annular printed circuit contact surface at one end of the eyelet for establishing a flush heat transmitting contact with a printed circuit pad on the board. The body portion of the eyelet may be provided with a cylindrical insulating sheath.

    Abstract translation: 一种电路板焊接孔眼,其具有在孔眼的一端处具有平坦的环形印刷电路接触表面的凸缘,用于与板上的印刷电路板建立平齐的热传递接触。 孔眼的主体部分可以设置有圆柱形绝缘护套。

    Header block assembly
    3.
    发明授权
    Header block assembly 失效
    头部组件

    公开(公告)号:US3601772A

    公开(公告)日:1971-08-24

    申请号:US3601772D

    申请日:1970-05-20

    Inventor: MANCINI LLOYD

    CPC classification number: H01R12/724 H01R4/028

    Abstract: A header block assembly for interconnecting circuit elements formed of a number of insulating wafers secured together with contact wires extending between sides of the assembly along the interfaces between wafers. The wires are fitted in grooves formed in one wafer below the interface. Ridges formed in the adjacent wafer extend into the grooves to form a tight interference fit which prevents reduction of cross resistance between wires due to seepage of fluids into the interface between wafers.

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