公开(公告)号：US09967977B1

公开(公告)日：2018-05-08

申请号：US14308283

申请日：2014-06-18

Applicant: Arkansas Power Electronics International, Inc.

Inventor： Brice McPherson

IPC: H05K1/11

CPC classification number: H05K1/111 ,  H05K2201/10803 ,  H05K2201/1081

Abstract: A step etched metal electrical contact including a main body formed from a metal sheet defining a metal tab sized to match a die/device terminal and an electrical clearance aperture, electrical clearance trench, and/or an electrical clearance gaps. A heat sink may be combined with the step etched metal electrical contact to provide double sided module cooling for increased thermal performance of power modules.

公开(公告)号：US20170027062A1

公开(公告)日：2017-01-26

申请号：US15286276

申请日：2016-10-05

Applicant: Intel Corporation

Inventor： MIHIR K. ROY ,  Mathew J. MANUSHAROW

IPC: H05K3/10 ,  H05K3/30 ,  H05K1/16 ,  H05K3/22 ,  H05K3/40

CPC classification number: H05K3/10 ,  H01B3/485 ,  H01B3/50 ,  H01B7/083 ,  H01F17/0006 ,  H05K1/0222 ,  H05K1/038 ,  H05K1/165 ,  H05K3/043 ,  H05K3/103 ,  H05K3/22 ,  H05K3/26 ,  H05K3/30 ,  H05K3/40 ,  H05K3/4046 ,  H05K2201/029 ,  H05K2201/097 ,  H05K2201/09809 ,  H05K2201/10287 ,  H05K2201/1081 ,  H05K2203/0228 ,  H05K2203/025 ,  H05K2203/1461 ,  H05K2203/175 ,  H05K2203/30

Abstract: A substrate package includes a woven fabric having electrically non-conductive strands woven between electrically conductive strands including wire strands, co-axial strands, and/or an inductor pattern of strands. The package may be formed by an inexpensive and high throughput process that first weaves the non-conductive strands (e.g., glass) between the conductive strands to form a circuit board pattern of conductive strands in a woven fabric. Next, the woven fabric is impregnated with a resin material to form an impregnated fabric, which is then cured to form a cured fabric. The upper and lower surfaces of the cured fabric are subsequently planarized. Planarizing segments and exposes ends of the wire, co-axial, and inductor pattern strands. Since the conductive strands were formed integrally within the planarized woven fabric, the substrate has a high mechanical stability and provides conductor strand based electrical components built in situ in the substrate package.

Abstract translation: 衬底封装包括织造织物，其具有在导电股线之间编织的非导电股线，包括线股，同轴股线和/或股线的电感器图案。 封装可以通过廉价且高通量的工艺来形成，该工艺首先在导电股线之间编织非导电股线（例如玻璃），以形成机织织物中导电股线的电路板图案。 接下来，用树脂材料浸渍织物以形成浸渍织物，然后将其固化以形成固化织物。 随后将固化的织物的上表面和下表面平坦化。 平面化节段并露出导线，同轴和电感图案线的端部。 由于导电丝线整体地形成在平面织造织物内，所以基底具有高的机械稳定性，并提供了在基底包装中原位构建的基于导线的电气部件。

公开(公告)号：US20080130256A1

公开(公告)日：2008-06-05

申请号：US11834703

申请日：2007-08-07

Applicant: ZHEN-SHENG WANG ,  KE-YOU HU

Inventor： ZHEN-SHENG WANG ,  KE-YOU HU

IPC: H01R9/00

CPC classification number: H05K3/308 ,  H05K2201/1081 ,  H05K2203/168

Abstract: A motherboard includes a printed circuit board having a first via and a second via, and an integrated circuit component having a first pin and a second pin. The integrated circuit component is mounted on the printed circuit board by inserting the first pin and the second pin of the integrated circuit component into the first via and the second via of the printed circuit board respectively, wherein the first pin and the second pin of the integrated circuit component are differently shaped in cross section, and the shapes of the first via and the second via are corresponding to the shapes of the first pin and the second pin. The electronic component cannot be mis-mounted on the PCB.

Abstract translation: 主板包括具有第一通孔和第二通孔的印刷电路板，以及具有第一引脚和第二引脚的集成电路部件。 通过将集成电路部件的第一引脚和第二引脚分别插入印刷电路板的第一通孔和第二通孔中，将集成电路部件安装在印刷电路板上，其中第一引脚和第二引脚 集成电路部件的截面形状不同，第一通孔和第二通孔的形状对应于第一销和第二销的形状。 电子元件不能安装在PCB上。

公开(公告)号：US20040137803A1

公开(公告)日：2004-07-15

申请号：US10721833

申请日：2003-11-25

Applicant: SynQor, Inc.

Inventor： Lennart Pitzele

IPC: H01R009/24

CPC classification number: H05K7/142 ,  H01R12/58 ,  H05K1/141 ,  H05K3/308 ,  H05K3/3447 ,  H05K3/3484 ,  H05K3/368 ,  H05K2201/1081 ,  H05K2201/10871 ,  H05K2203/0545 ,  Y10T29/49165

Abstract: A dc/dc converter is mounted to a printed circuit board with rigid terminal pins which extend into a converter substrate to provide electrical connection to circuitry on the substrate. A terminal pin includes a flange which abuts the printed circuit board and spaces the converter substrate from the printed circuit board. Connection to the printed circuit board is made by solder provided between the flange and the circuit board.

公开(公告)号：US06747217B1

公开(公告)日：2004-06-08

申请号：US09989820

申请日：2001-11-20

Applicant: Daniel A. Jochym ,  Robert H. Fix

Inventor： Daniel A. Jochym ,  Robert H. Fix

IPC: H01R1204

CPC classification number: H01R12/58 ,  H05K1/0298 ,  H05K3/4046 ,  H05K3/4623 ,  H05K2201/10303 ,  H05K2201/10416 ,  H05K2201/1059 ,  H05K2201/1081

Abstract: A printed circuit board (PCB) comprises a number of electrically conductive layers. Instead of coating, or plating, a PCB through-hole with an electrically conductive material to form a via (for the purpose of connecting together signal paths across the electrically conductive layers)—the via is formed by placing a conductive stake, or conductive pin, in the through-hole.

Abstract translation: 印刷电路板（PCB）包括多个导电层。 代替用导电材料涂覆或镀覆PCB通孔以形成通孔（为了将跨越导电层的信号​​路径连接在一起），通孔是通过放置导电块或导电引脚 ，在通孔中。

公开(公告)号：US20040012931A1

公开(公告)日：2004-01-22

申请号：US10378549

申请日：2003-03-03

Applicant: SynQor, Inc.

Inventor： Lennart Pitzele

IPC: H05K001/00

CPC classification number: H05K7/142 ,  H05K1/141 ,  H05K3/308 ,  H05K3/3447 ,  H05K3/3484 ,  H05K3/368 ,  H05K2201/1081 ,  H05K2201/10871 ,  H05K2203/0545 ,  Y10T29/49165

Abstract: A dc/dc converter is mounted to a printed circuit board with rigid terminal pins which extend into a converter substrate to provide electrical connection to circuitry on the substrate. A terminal pin includes a flange which abuts the printed circuit board and spaces the converter substrate from the printed circuit board. Connection to the printed circuit board is made by solder provided between the flange and the circuit board.

Abstract translation: DC / DC转换器安装到具有刚性端子引脚的印刷电路板上，该引脚延伸到转换器基板中以提供与基板上的电路的电连接。 端子销包括与印刷电路板抵接并将转换器基板与印刷电路板隔开的凸缘。 与印刷电路板的连接是由法兰和电路板之间的焊料制成的。

公开(公告)号：US5792985A

公开(公告)日：1998-08-11

申请号：US700942

申请日：1996-08-21

Applicant: Hisashi Watanabe ,  Shoji Takeda ,  Hideki Notake

Inventor： Hisashi Watanabe ,  Shoji Takeda ,  Hideki Notake

IPC: H01H13/52 ,  H01H1/58 ,  H01H11/00 ,  H05K3/30 ,  H01L23/02

CPC classification number: H05K3/308 ,  H01H1/5805 ,  H05K2201/10053 ,  H05K2201/10651 ,  H05K2201/1081 ,  H05K2201/10848 ,  H05K2203/1446 ,  H05K3/306

Abstract: A terminal for an electronic component having a connecting section with a rectangular shaped cross sectional for connection to the casing of the electronic component, and a taping section also with a rectangular shaped cross sectional for attachment to a tape carrying a plurality of such terminals. In between the connecting section and the taping section are a lower rod section and an upper rod section. The lower rod section facilitates the separation of the taping section from the tape. The upper section facilitates the separation of the connecting section from the remaining portion of the terminal.

Abstract translation: 一种用于电子部件的端子，具有用于连接到电子部件的壳体的具有矩形横截面的连接部分，以及具有矩形横截面的带状部分，用于附接到承载多个这种端子的带子。 在连接部和带部之间是下杆部和上杆部。 下杆部分便于将带部分与带分开。 上部便于连接部分与终端的其余部分的分离。

公开(公告)号：US4877176A

公开(公告)日：1989-10-31

申请号：US125152

申请日：1987-11-25

Applicant: Leon S. Kubis

Inventor： Leon S. Kubis

IPC: H05K3/34 ,  H05K3/42

CPC classification number: H01R12/585 ,  H05K3/3447 ,  H05K2201/10303 ,  H05K2201/1081 ,  H05K2203/044 ,  H05K3/3473 ,  H05K3/42

Abstract: Soldering splined pins into holes in printed circuit boards by providing small volumetric gaps between the splines to allow thin layers of solder lining, the holes to be sufficiently thick to block the gaps during solder flow. The solder may have a maximum thickness of 0.001 inches to block the gaps unassisted by additional solder.

Abstract translation: 通过在花键之间提供小的体积间隙，将花键焊接到印刷电路板的孔中，以允许薄的焊料衬里层，这些孔足够厚以阻止焊料流动期间的间隙。 焊料可能具有0.001英寸的最大厚度以阻挡由附加焊料辅助的间隙。

公开(公告)号：US4663815A

公开(公告)日：1987-05-12

申请号：US782351

申请日：1985-10-01

Applicant: John E. Hartman ,  John T. Venaleck

Inventor： John E. Hartman ,  John T. Venaleck

IPC: H01R12/51 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34 ,  H05K3/30

CPC classification number: H05K3/3447 ,  H01R12/58 ,  H05K2201/09036 ,  H05K2201/10189 ,  H05K2201/10303 ,  H05K2201/10424 ,  H05K2201/10568 ,  H05K2201/1081 ,  H05K2201/10984 ,  H05K2203/033 ,  H05K2203/0415 ,  Y10T29/49142 ,  Y10T83/8831 ,  Y10T83/8832

Abstract: An electrical component for mechanical mouting and electrical connection with respect to plated through holes of a printed circuit board compatibly with a surface mount attaching process includes an electrically non-conducting body, plural generally elongate contacts extending from the body for insertion into such plated through holes, and the component having a reservoir for retaining solder type material for melting, for flow into respective plated through holes, and for re-solidifying to mechanically and electrically couple the component to such printed circuit board. Preferably the component is a connector, such as a header, and the contact pins or leads thereof provide an interface connection between the printed circuit board and a separate or portable connector.A method for attaching such an electrical component to a printed circuit board compatibly with surface mount attaching processes, a method for placing solder in the reservoirs of such electrical component, and apparatus to carry out such methods also are part of the invention.

Abstract translation: 用于与表面安装附接工艺兼容的与印刷电路板的电镀通孔相关的电气连接和电连接的电气部件包括非导电体，多个大体上细长的触头，从该主体延伸以插入到该电镀通孔 并且所述部件具有用于保持用于熔化的焊料类型材料的储存器，用于流入相应的电镀通孔，并且用于再固化以将该部件机械地和电耦合到该印刷电路板。 优选地，部件是诸如集管的连接器，并且其接触销或引线在印刷电路板和单独或便携式连接器之间提供接口连接。 将这种电气部件连接到与表面安装附接工艺兼容的印刷电路板的方法，将焊料放置在这种电气部件的储存器中的方法以及用于执行这种方法的装置也是本发明的一部分。

公开(公告)号：US4641426A

公开(公告)日：1987-02-10

申请号：US747343

申请日：1985-06-21

Applicant: John E. Hartman ,  John T. Venaleck

Inventor： John E. Hartman ,  John T. Venaleck

IPC: B23K1/00 ,  H01R12/58 ,  H01R43/02 ,  H05K3/34 ,  H05K13/00 ,  H05K3/30 ,  H01R9/00

CPC classification number: H05K3/3447 ,  H01R12/58 ,  H05K2201/09036 ,  H05K2201/10189 ,  H05K2201/10303 ,  H05K2201/10424 ,  H05K2201/10568 ,  H05K2201/1081 ,  H05K2201/10984 ,  H05K2203/033 ,  H05K2203/0415 ,  Y10T29/49142

Abstract: An electrical component for mechanical mounting and electrical connection with respect to plated through holes of a printed circuit board compatibly with a surface mount attaching process includes an electrically non-conducting body, plural generally elongate contacts extending from the body for insertion into such plated through holes, and the component having a reservoir for retaining solder type material for melting, for flow into respective plated through holes, and for re-solidifying mechanically and electrically to couple the component to such printed circuit board. Preferably the component is a connector, such as a header, and the contact pins or leads thereof provide interface connection between the printed circuit board and a separate or portable connector.A method for attaching such an electrical component to a printed circuit board compatibly with surface mount attaching processes and an apparatus to carry out such method also are part of the invention.

Abstract translation: 用于与印刷电路板的电镀通孔相对于表面安装附接工艺的机械安装和电连接的电气部件包括非导电体，多个大体上细长的触头，从该主体延伸以插入到该电镀通孔 并且所述部件具有用于保持用于熔化的焊料类型材料的储存器，用于流入相应的电镀通孔，并且用于机械和电气重新凝固以将部件耦合到这种印刷电路板。 优选地，部件是诸如集管的连接器，并且其接触销或引线在印刷电路板和单独或便携式连接器之间提供接口连接。 将这种电气部件连接到与表面安装附接工艺兼容的印刷电路板的方法以及用于执行这种方法的装置也是本发明的一部分。