Abstract:
A coaxial circuit construction and method of making in which an up-plated coaxial structure is fabricated by successively applying layers of metal and photo-polymer material, the photopolymer layers being photographically processed to form patterns which provide the required insulation, and the metal layers being formed by up-plating and precision grinding.
Abstract:
A coaxial circuit construction method in which a coaxial structure is fabricated by successively applying layers of metal and photopolymer material, the photopolymer layers being photographically processed to form patterns which provide the required insulation, and the metal layers being formed by upplating and precision grinding.