-
1.发明授权Micromodular electronic package utilizing cantilevered support leads 失效MICROMODULAR电子封装使用CANTILEVERED支持引线
公开(公告)号：US3437883A
公开(公告)日：1969-04-08
申请号：US3437883D
申请日：1966-12-09
Applicant: BUNKER RAMO
Inventor： SMITH CHARLES W
CPC classification number: H05K1/144
-
2.发明授权Method and apparatus for forming an electric bond between two metallic members 失效在两个金属成员之间形成电焊的方法和装置
公开(公告)号：US3477119A
公开(公告)日：1969-11-11
申请号：US3477119D
申请日：1964-11-23
Applicant: BUNKER RAMO
Inventor： SMITH CHARLES W
CPC classification number: B23K20/10
-
3.发明授权Test apparatus for determining resistance and overload capability of thin film resistors carried on a substrate 失效用于确定承载在基板上的薄膜电阻的电阻和过载能力的测试装置
公开(公告)号：US3458807A
公开(公告)日：1969-07-29
申请号：US3458807D
申请日：1966-11-14
Applicant: BUNKER RAMO
Inventor： SMITH CHARLES W
CPC classification number: G01R27/02 , Y10T29/49004
-
Patent Agency Ranking4.发明授权Molded sandwich electrical connector with improved connector pins and encapsulating structure 失效具有改进的连接器针和封装结构的模制夹心电连接器
公开(公告)号：US3353070A
公开(公告)日：1967-11-14
申请号：US51317765
申请日：1965-12-13
Applicant: BUNKER RAMO
Inventor： PAUL ALBERT E , SMITH CHARLES W
IPC: H01R12/70
CPC classification number: H01R12/7076
-
公开(公告)号：US3355078A
公开(公告)日：1967-11-28
申请号：US41302464
申请日：1964-11-23
Applicant: BUNKER RAMO
Inventor： SMITH CHARLES W
IPC: H05K13/04
CPC classification number: H05K13/04 , Y10T29/49121
-
公开(公告)号：US3922479A
公开(公告)日：1975-11-25
申请号：US43745074
申请日：1974-01-28
Applicant: BUNKER RAMO
Inventor： OLDER ROBERT B , SMITH CHARLES W
CPC classification number: H05K3/465 , H05K1/0219 , H05K1/0221 , H05K3/0023 , H05K3/184 , H05K3/4661 , H05K2201/0376 , H05K2201/09563 , H05K2201/09809 , H05K2203/0733
Abstract: A coaxial circuit construction and method of making in which an up-plated coaxial structure is fabricated by successively applying layers of metal and photo-polymer material, the photopolymer layers being photographically processed to form patterns which provide the required insulation, and the metal layers being formed by up-plating and precision grinding.
Abstract translation: 一种同轴电路结构和制造方法，其中通过连续施加金属和光聚合物材料层来制造上镀同轴结构，光聚合物层被照相加工以形成提供所需绝缘的图案，并且金属 层通过上镀和精密研磨形成。
-
公开(公告)号：US3649274A
公开(公告)日：1972-03-14
申请号：US3649274D
申请日：1969-09-18
Applicant: BUNKER RAMO
Inventor： OLDER ROBERT B , SMITH CHARLES W
CPC classification number: H05K1/0221 , H05K3/0023 , H05K3/184 , H05K3/465 , H05K3/4661 , H05K2201/0376 , H05K2201/09563 , H05K2201/09809 , H05K2203/0733
Abstract: A coaxial circuit construction method in which a coaxial structure is fabricated by successively applying layers of metal and photopolymer material, the photopolymer layers being photographically processed to form patterns which provide the required insulation, and the metal layers being formed by upplating and precision grinding.
Abstract translation: 一种同轴电路构造方法，其中通过连续施加金属和光聚合物材料层制造同轴结构，光聚合物层被照相加工以形成提供所需绝缘的图案，并且金属层通过上镀和精密研磨形成 。
-
公开(公告)号：US3516155A
公开(公告)日：1970-06-23
申请号：US3516155D
申请日：1967-02-02
Applicant: BUNKER RAMO
Inventor： SMITH CHARLES W
CPC classification number: H05K13/0482 , H05K3/3421 , H05K3/3426 , H05K13/0465 , H05K2201/10651 , H05K2201/10772 , H05K2201/10818 , H05K2203/0173 , H05K2203/1581 , H05K2203/166 , Y02P70/613 , Y10T29/49142 , Y10T156/10
-
-
-
-
-
-
-
Search Results
8
records
(took 0.009 seconds)
