公开(公告)号：US20160068963A1

公开(公告)日：2016-03-10

申请号：US14836750

申请日：2015-08-26

Applicant: BYD Company Limited

Inventor： Qing GONG ,  Liang ZHOU ,  Weifeng MIAO ,  Xiong ZHANG

IPC: C23C18/16 ,  C23C18/20

CPC classification number: C23C18/1608 ,  B01J23/80 ,  B01J37/0201 ,  B01J37/34 ,  B01J37/349 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/182 ,  C23C18/204 ,  C23C18/36 ,  C23C18/405 ,  Y10T428/12569

Abstract: The present invention discloses a method for metallizing a plastic surface. The method may comprise the steps of: 1) gasifying the plastic surface to expose the electroless plating promoter; and 2) electroless plating a layer of copper or nickel on the plastic surface, followed by electroplating or a second electroless plating to form a metallized layer on the plastic surface. Further, the present invention discloses a method for preparing a plastic article and a plastic article as manufactured by the method as described.

Abstract translation: 本发明公开了一种金属化塑料表面的方法。 该方法可以包括以下步骤：1）气化塑料表面以暴露无电镀促进剂; 和2）在塑料表面上化学镀一层铜或镍，随后进行电镀或第二无电镀，以在塑料表面上形成金属化层。 此外，本发明公开了一种通过所述方法制造的塑料制品和塑料制品的制备方法。

公开(公告)号：US20150104668A1

公开(公告)日：2015-04-16

申请号：US14576950

申请日：2014-12-19

Applicant: BYD COMPANY LIMITED

Inventor： Qing GONG ,  Liang ZHOU ,  Weifeng MIAO ,  Xiong ZHANG

IPC: C23C28/02 ,  C25D5/56 ,  B05D1/36 ,  C23C18/50 ,  B05D3/06 ,  B05D7/00

CPC classification number: C23C28/021 ,  B05D1/36 ,  B05D3/06 ,  B05D7/54 ,  C23C18/1641 ,  C23C18/20 ,  C23C18/2006 ,  C23C18/204 ,  C23C18/50 ,  C25D5/56 ,  Y10T428/12569

Abstract: Metalized plastic substrates, and methods thereof are provided herein. The method includes providing a plastic having a plurality of accelerators dispersed in the plastic. The accelerators have a formula ABO3, wherein A is one or more elements selected from Groups 9, 10, and 11 of the Periodic Table of Elements, B is one or more elements selected from Groups 4B and 5B of the Periodic Table of Elements, and O is oxygen. The method includes the step of irradiating a surface of plastic substrate to expose at least a first accelerator. The method further includes plating the irradiated surface of the plastic substrate to form at least a first metal layer on the at least first accelerator, and then plating the first metal layer to form at least a second metal layer.

Abstract translation: 金属化塑料基板及其方法在此提供。 该方法包括提供具有分散在塑料中的多个加速器的塑料。 加速剂具有式ABO 3，其中A是选自元素周期表第9,10和11族的一种或多种元素，B是选自元素周期表的第4B和5B族的一种或多种元素，以及 O是氧气。 该方法包括照射塑料基板的表面以暴露至少第一加速器的步骤。 该方法还包括电镀塑料基板的照射表面以在至少第一加速器上形成至少第一金属层，然后电镀第一金属层以形成至少第二金属层。

公开(公告)号：US20140356645A1

公开(公告)日：2014-12-04

申请号：US14462293

申请日：2014-08-18

Applicant: BYD COMPANY LIMITED

Inventor： Qing GONG ,  Liang ZHOU ,  Weifeng MIAO ,  Xiong ZHANG

IPC: B32B15/08 ,  H05K1/05 ,  B32B15/04

CPC classification number: B32B15/08 ,  B32B15/043 ,  C23C18/1639 ,  C23C18/1641 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/2006 ,  C23C18/2013 ,  C23C18/204 ,  C23C18/22 ,  C23C18/32 ,  C23C18/40 ,  C23C18/42 ,  H05K1/056 ,  H05K3/105 ,  H05K3/182 ,  H05K2201/09118 ,  H05K2203/107 ,  Y10T428/12569

Abstract: Metalized plastic substrates, and methods thereof are provided herein. The method includes providing a plastic substrate having a plurality of accelerators dispersed in the plastic substrate. The accelerators have a formula selected from the group consisting of: CuFe2O4-δ, Ca0.25Cu0.75TiO3-β, and TiO2-σ, wherein δ, β, σ denotes oxygen vacancies in corresponding accelerators and 0.05≦δ≦0.8, 0.05≦β≦0.5, and 0.05≦σ≦1.0. The method further includes removing at least a portion of a surface of the plastic substrate to expose at least a first accelerator. The method further includes plating the exposed surface of the plastic substrate to form at least a first metal layer on the at least first accelerator, and then plating the first metal layer to form at least a second metal layer.

Abstract translation: 金属化塑料基板及其方法在此提供。 该方法包括提供具有分散在塑料基板中的多个加速器的塑料基板。 所述促进剂具有选自CuFe 2 O 4-δ，Ca 0.25 La 0.75 TiO 3 - ＆bgr，和TiO 2 - ＆amp; Gr，其中δ，＆bgr; 表示相应促进剂中的氧空位，0.05＆amp; NlE;δ＆nlE; 0.8,0.05＆nlE;＆bgr;＆nlE; 0.5和0.05＆nlE;＆sgr;＆nlE; 1.0。 该方法还包括去除塑料基板表面的至少一部分以暴露至少第一加速器。 该方法还包括电镀塑料基板的暴露表面以在至少第一加速器上形成至少第一金属层，然后电镀第一金属层以形成至少第二金属层。