公开(公告)号：US20120024583A1

公开(公告)日：2012-02-02

申请号：US13039691

申请日：2011-03-03

Applicant: Baik-Woo LEE ,  Ji-Hyuk LIM ,  Seong-Woon BOOH

Inventor： Baik-Woo LEE ,  Ji-Hyuk LIM ,  Seong-Woon BOOH

IPC: H05K1/18 ,  H05K3/42 ,  H05K3/30

CPC classification number: H05K1/186 ,  H01L2224/16225 ,  H01L2924/1461 ,  H05K3/462 ,  Y10T29/4913 ,  Y10T29/49165 ,  H01L2924/00

Abstract: A multilayer laminate package and a method of manufacturing the same are provided. The multilayer laminate package includes a cavity layer, a non-cavity layer, an electronic component, and a metalized blind via. The cavity layer includes a first adhesive layer and two first circuit layers, which are stacked with the first adhesive layer between, and an opening. The non-cavity layer includes a second adhesive layer and a second circuit layer. The non-cavity layer is bonded to the cavity layer with the second adhesive layer so as to close one side of the opening. The electronic component is mounted in the opening and is electrically connected to the non-cavity layer exposed through the opening. The metalized blind via electrically connects the non-cavity layer to one of the circuit layers of the cavity layer.

Abstract translation: 提供了一种多层层压包装及其制造方法。 多层叠层包装包括空腔层，非空腔层，电子部件和金属化盲孔。 空腔层包括第一粘合剂层和两个第一电路层，其中第一粘合剂层与开口层叠。 非空腔层包括第二粘合剂层和第二电路层。 非空腔层用第二粘合剂层结合到空腔层，以封闭开口的一侧。 电子部件安装在开口中并且电连接到通过开口暴露的非空腔层。 金属化盲孔将非空腔层电连接到空腔层的电路层之一。

公开(公告)号：US20160071831A1

公开(公告)日：2016-03-10

申请号：US14595370

申请日：2015-01-13

Applicant: Baik-Woo LEE ,  Seok-Hyun LEE

Inventor： Baik-Woo LEE ,  Seok-Hyun LEE

IPC: H01L25/18 ,  H01L23/00 ,  H01L25/065 ,  H01L23/538 ,  H01L25/16 ,  H01L23/498 ,  H01L23/31

CPC classification number: H01L25/0657 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/17 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2225/1094 ,  H01L2924/141 ,  H01L2924/1426 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/19103 ,  H01L2924/19105 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor device includes a substrate having a first part and a second part, the first and second parts being continuous with each other and at different height levels, a first semiconductor chip overlapping the first and second parts of the substrate, an electrical interconnection structure connecting the first part of the substrate and the first semiconductor chip, a distance between the first part of the substrate and the first semiconductor chip being shorter than a distance between the second part of the substrate and the first semiconductor chip, and at least one electronic component in a space between the second part of the substrate and the first semiconductor chip.

Abstract translation: 半导体器件包括具有第一部分和第二部分的衬底，第一和第二部分彼此连续并且处于不同的高度，第一半导体芯片与衬底的第一和第二部分重叠，电连接结构连接 基板的第一部分和第一半导体芯片，基板的第一部分和第一半导体芯片之间的距离短于基板的第二部分与第一半导体芯片之间的距离，以及至少一个电子部件 在基板的第二部分和第一半导体芯片之间的空间中。

公开(公告)号：US20120170231A1

公开(公告)日：2012-07-05

申请号：US13198370

申请日：2011-08-04

Applicant: Baik-Woo LEE

Inventor： Baik-Woo LEE

IPC: H05K1/18 ,  H05K3/20

CPC classification number: H05K1/145 ,  H01L21/568 ,  H01L24/24 ,  H01L24/82 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/82031 ,  H01L2224/82039 ,  H01L2924/14 ,  H05K1/028 ,  H05K1/147 ,  H05K1/185 ,  H05K1/189 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/097 ,  Y10T29/49128 ,  H01L2924/00

Abstract: A folded stacked package and a method of manufacturing the same are provided. The folded stacked package includes a flexible board or substrate comprising first, second and third device packaging units, and first and second folding unit units. The flexible board has wiring patterns formed thereon; one or more active devices disposed in at least one of the first, second, and third device packaging units; and one or more passive devices disposed on a surface of each of the first and second device packaging units. The passive devices include one or more first passive devices disposed on the surface of the first device packaging unit and one or more second passive devices disposed on the surface of the second device packaging unit. The first and second passive devices do not overlap each other when the flexible board is folded at the folding unit.

Abstract translation: 提供折叠的堆叠包装及其制造方法。 折叠的堆叠包装包括包括第一，第二和第三装置包装单元以及第一和第二折叠单元单元的柔性板或基板。 柔性板具有形成在其上的布线图案。 设置在所述第一，第二和第三装置包装单元中的至少一个中的一个或多个有源装置; 以及设置在每个第一和第二装置包装单元的表面上的一个或多个无源装置。 无源器件包括设置在第一器件封装单元的表面上的一个或多个第一无源器件和设置在第二器件封装单元的表面上的一个或多个第二无源器件。 当柔性板在折叠单元处折叠时，第一和第二被动装置彼此不重叠。