公开(公告)号：US11350518B2

公开(公告)日：2022-05-31

申请号：US16927059

申请日：2020-07-13

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Chia-Sung Lin ,  Huan-Kai Chou ,  Chia-Hsin Yen ,  Wen-Fu Chou

IPC: H05K3/30 ,  H05K1/02 ,  H05K13/04

Abstract: In a method of heat sink attachment, a heat-sink tape includes a plurality of heat sinks and a flexible carrier, and a holder is provided to allow the heat sinks on the moving heat-sink tape to peel from the flexible carrier and attach to a heat-sink mounting area of a moving circuit tape automatically and successively.

公开(公告)号：US20210227679A1

公开(公告)日：2021-07-22

申请号：US16927059

申请日：2020-07-13

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Chia-Sung Lin ,  Huan-Kai Chou ,  Chia-Hsin Yen ,  Wen-Fu Chou

IPC: H05K1/02 ,  H05K3/30

Abstract: In a method of heat sink attachment, a heat-sink tape includes a plurality of heat sinks and a flexible carrier, and a holder is provided to allow the heat sinks on the moving heat-sink tape to peel from the flexible carrier and attach to a heat-sink mounting area of a moving circuit tape automatically and successively.