公开(公告)号：US11350518B2

公开(公告)日：2022-05-31

申请号：US16927059

申请日：2020-07-13

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Chia-Sung Lin ,  Huan-Kai Chou ,  Chia-Hsin Yen ,  Wen-Fu Chou

IPC: H05K3/30 ,  H05K1/02 ,  H05K13/04

Abstract: In a method of heat sink attachment, a heat-sink tape includes a plurality of heat sinks and a flexible carrier, and a holder is provided to allow the heat sinks on the moving heat-sink tape to peel from the flexible carrier and attach to a heat-sink mounting area of a moving circuit tape automatically and successively.

公开(公告)号：US20210227679A1

公开(公告)日：2021-07-22

申请号：US16927059

申请日：2020-07-13

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Chia-Sung Lin ,  Huan-Kai Chou ,  Chia-Hsin Yen ,  Wen-Fu Chou

IPC: H05K1/02 ,  H05K3/30

Abstract: In a method of heat sink attachment, a heat-sink tape includes a plurality of heat sinks and a flexible carrier, and a holder is provided to allow the heat sinks on the moving heat-sink tape to peel from the flexible carrier and attach to a heat-sink mounting area of a moving circuit tape automatically and successively.

公开(公告)号：US20220225496A1

公开(公告)日：2022-07-14

申请号：US17504635

申请日：2021-10-19

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Gwo-Shyan Sheu ,  Hsin-Hao Huang ,  Yu-Chen Ma ,  Chia-Hsin Yen

IPC: H05K1/02

Abstract: A flexible circuit board includes a flexible substrate, a chip and a patterned circuit layer. A surface of the flexible substrate is separated into a working area and a nonworking area according to a cutting line. The chip is disposed on the working area. The patterned circuit layer is disposed on the surface and includes signal transmission wires and bypass wires, the bypass wires are not electrically connected to the chip. Each of the bypass wires includes a bypass transmission portion located on the working area and an anti-peeling portion located on the nonworking area. A blank area exists between the anti-peeling area and the bypass transmission portion, and the cutting line passes through the blank area. A distance between 100 um and 400 um exists from the anti-peeling portion to the cutting line.

公开(公告)号：US20240389224A1

公开(公告)日：2024-11-21

申请号：US18544631

申请日：2023-12-19

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Kung-Tzu Tu ,  Gwo-Shyan Sheu ,  Kuo-Liang Huang ,  Pei-Wen Wang ,  Yu-Chen Ma ,  Chia-Hsin Yen

IPC: H05K1/02

Abstract: A thin film circuit board includes a substrate and a thermal conductive film which is adhered to the substrate and includes a first conductive portion, a second conductive portion and a third conductive portion. The thermal conductive film is designed to be polygonal and non-rectangular in order to reduce stress generated in the substrate and the thermal conductive film and protect the thin film circuit board from warpage.

公开(公告)号：US11606860B2

公开(公告)日：2023-03-14

申请号：US17504635

申请日：2021-10-19

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Gwo-Shyan Sheu ,  Hsin-Hao Huang ,  Yu-Chen Ma ,  Chia-Hsin Yen

IPC: H05K1/02 ,  H05K1/18

Abstract: A flexible circuit board includes a flexible substrate, a chip and a patterned circuit layer. A surface of the flexible substrate is separated into a working area and a nonworking area according to a cutting line. The chip is disposed on the working area. The patterned circuit layer is disposed on the surface and includes signal transmission wires and bypass wires, the bypass wires are not electrically connected to the chip. Each of the bypass wires includes a bypass transmission portion located on the working area and an anti-peeling portion located on the nonworking area. A blank area exists between the anti-peeling area and the bypass transmission portion, and the cutting line passes through the blank area. A distance between 100 um and 400 um exists from the anti-peeling portion to the cutting line.