公开(公告)号：US10168582B1

公开(公告)日：2019-01-01

申请号：US15841424

申请日：2017-12-14

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Chun-Yang Su ,  Jhao-Shin Wang ,  Nian-Cih Yang ,  Xin-Wei Lo

IPC: H01L23/495 ,  G02F1/1339 ,  H01L23/00 ,  H01L23/31 ,  H01L23/367 ,  H01L23/498

Abstract: A chip package includes a flexible substrate, a chip, a pressure-proof member and a reinforcement sheet. The chip and the pressure-proof member are located on a first surface of the flexible substrate, and the reinforcement sheet is located on a second surface of the flexible substrate. The pressure-proof member at least includes a pair of pressure-proof ribs which are located outside of the chip oppositely. The pressure-proof ribs located outside the chip can protect the chip from the damage caused by the pressure of other component (e.g. curved panel) except the chip package.