公开(公告)号：US20160020166A1

公开(公告)日：2016-01-21

申请号：US14515719

申请日：2014-10-16

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Yung-Wei Hsieh ,  Cheng-Hung Shih ,  Kai-Yi Wang ,  Heh-Chang Huang ,  Po-Hao Chen

IPC: H01L23/50

CPC classification number: H01L23/49838 ,  H01L21/4846

Abstract: A trace structure of fine-pitch pattern includes a connection portion, a first conductive wire portion and a second conductive wire portion, the first conductive wire portion comprises a first section and a second section connected to the first section, the first section connects to the connection portion, the second conductive wire portion comprises a third section and a fourth section connected to the third section, the third section connects to the connection portion, wherein an etching space closed on three sides is formed by the connection portion, the third section and the first section, a first spacing is defined between the third section and the first section, a second spacing is defined between the fourth section and the second section, wherein the first spacing is larger than the second spacing so as to make an metal layer within the etching space completely removed to avoid metal layer residues.

Abstract translation: 细间距图案的迹线结构包括连接部分，第一导线部分和第二导线部分，第一导线部分包括连接到第一部分的第一部分和第二部分，第一部分连接到 连接部分，第二导线部分包括连接到第三部分的第三部分和第四部分，第三部分连接到连接部分，其中通过连接部分，第三部分和第三部分形成三面封闭的蚀刻空间， 所述第一部分在所述第三部分和所述第一部分之间限定第一间隔，在所述第四部分和所述第二部分之间限定第二间隔，其中所述第一间隔大于所述第二间隔，以使所述第一部分内的金属层在 蚀刻空间完全去除以避免金属层残留。