公开(公告)号：US20240105664A1

公开(公告)日：2024-03-28

申请号：US18234645

申请日：2023-08-16

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Yu-Chung Huang ,  Hsin-Yen Tsai ,  Fa-Chung Chen ,  Cheng-Fan Lin ,  Chen-Yu Wang

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498 ,  H01L25/065 ,  H01L25/10

CPC classification number: H01L24/32 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/27 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/16227 ,  H01L2224/27515 ,  H01L2224/2784 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81203 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/3511

Abstract: A package structure includes a first RDL, an adhesive layer and a first electronic component. Upper bumps and conductive pads are provided on a first upper surface and a first lower surface of the first RDL, respectively. The adhesive layer is located on the first upper surface of the first RDL and surrounds the upper bumps. The first electronic component is mounted on the adhesive layer and includes conductors which are visible from an active surface of the first electronic component and joined to the upper bumps, the active surface of the first electronic component faces toward the first upper surface of the first RDL. Two adhesive surfaces of the adhesive layer are adhered to the first upper surface of the first RDL and the active surface of the first electronic component, respectively.