公开(公告)号：US20180168045A1

公开(公告)日：2018-06-14

申请号：US15836860

申请日：2017-12-09

Applicant: CYNTEC CO., LTD.

Inventor： BAU-RU LU ,  CHUN HSIEN LU ,  DA-JUNG CHEN

IPC: H05K1/18 ,  H05K1/14 ,  H05K1/11

CPC classification number: H01F27/022 ,  H01F17/04 ,  H01F27/24 ,  H01F27/28 ,  H01F27/2823 ,  H01F27/32 ,  H01F27/36 ,  H01F41/00 ,  H05K1/111 ,  H05K1/115 ,  H05K1/144 ,  H05K1/181 ,  H05K2201/041 ,  H05K2201/09063 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10522 ,  H05K2201/10545

Abstract: An electronic module is disclosed, wherein the electronic module comprises: a module board and a connection board, wherein a plurality of first electronic devices are disposed over a top surface of the module board, and a plurality of second electronic devices are disposed on a bottom surface of the module board, wherein a plurality of first contact points are disposed on the bottom surface of the module board and electrically connected to a plurality of second contact points on a top surface of the connection board, wherein a plurality of third contact points are on a bottom surface of the connection board for connecting with an external circuit.

公开(公告)号：US20210105898A1

公开(公告)日：2021-04-08

申请号：US16592786

申请日：2019-10-04

Applicant: CYNTEC CO., LTD.

Inventor： KAIPENG CHIANG ,  DA-JUNG CHEN ,  BAU-RU LU ,  CHUN HSIEN LU

IPC: H05K1/18 ,  H05K1/02 ,  H05K7/20 ,  H05K3/34 ,  H02M3/156

Abstract: An electronic module, such as a VRM, has a power inductor and power wave pins disposed on a bottom surface of a circuit board so as to reduce the size and increase the heat dissipation capability of the VRM.

公开(公告)号：US20220007502A1

公开(公告)日：2022-01-06

申请号：US17477530

申请日：2021-09-17

Applicant: CYNTEC CO., LTD.

Inventor： KAIPENG CHIANG ,  DA-JUNG CHEN ,  BAU-RU LU ,  CHUN HSIEN LU

IPC: H05K1/02 ,  H05K1/14

Abstract: An electronic module, such as a VRM, has a power inductor and power wave pins disposed on a bottom surface of a circuit board so as to reduce the size and increase the heat dissipation capability of the VRM.