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公开(公告)号：US11153973B2
公开(公告)日：2021-10-19
申请号：US16592786
申请日：2019-10-04
Applicant: CYNTEC CO., LTD.
Inventor： Kaipeng Chiang , Da-Jung Chen , Bau-Ru Lu , Chun Hsien Lu
Abstract: An electronic module, such as a VRM, has a power inductor and power wave pins disposed on a bottom surface of a circuit board so as to reduce the size and increase the heat dissipation capability of the VRM.
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公开(公告)号：US11134570B2
公开(公告)日：2021-09-28
申请号：US16248814
申请日：2019-01-16
Applicant: CYNTEC CO., LTD.
Inventor： Chun Hsien Lu , Bau-Ru Lu , Kaipeng Chiang
Abstract: An electronic module includes: a lead frame having at least one metal strip and a plurality of metal leads, wherein a magnetic body encapsulates a portion of each of the at least one metal strip with two ends of each of the at least one metal strip not covered by the magnetic body; and a substrate disposed on the lead frame, wherein the substrate is electrically connected to the plurality of metal leads and the at least one metal strip.
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公开(公告)号：US10373894B2
公开(公告)日：2019-08-06
申请号：US15334308
申请日：2016-10-26
Applicant: CYNTEC CO., LTD.
Inventor： Bau-Ru Lu , Jeng-Jen Li , Kun-Hong Shih , Kaipeng Chiang
IPC: H05K1/00 , H01L23/495 , H01L21/56 , H05K1/02 , H05K1/18 , H01L23/13 , H01L23/498 , H01L23/00
Abstract: The invention discloses a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a recess is formed in the device carrier and a conductive element is disposed on the substrate, wherein the substrate is disposed on the device carrier and the conductive element is located in the recess of the device carrier. The conductive pattern in the substrate is electrically connected to the device carrier and I/O terminals of the first conductive element. The invention also discloses a method for manufacturing a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a portion of the conductive pattern in the substrate can be modified.
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Patent Agency Ranking
公开(公告)号：US10063098B2
公开(公告)日：2018-08-28
申请号：US15399742
申请日：2017-01-06
Applicant: CYNTEC CO., LTD.
Inventor： Huei-Ren You , Bau-Ru Lu , Kaipeng Chiang
IPC: H05K1/18 , H02J50/10 , H01F27/24 , H01F27/29 , H05K1/02 , H05K1/11 , H01F17/04 , H05K3/36 , H05K1/14
CPC classification number: H02J50/10 , H01F17/04 , H01F27/24 , H01F27/29 , H01F27/292 , H01F2017/048 , H05K1/0203 , H05K1/0262 , H05K1/117 , H05K1/141 , H05K1/184 , H05K3/366 , H05K2201/044 , H05K2201/066 , H05K2201/086 , H05K2201/1003 , H05K2201/10545
Abstract: An electronic module is provided. The electronic module comprises an inductor having a magnetic body with a coil encapsulated in the magnetic body and a substrate having electronic devices thereon, wherein a first electrode is disposed on a top surface of the magnetic body and a second electrode is disposed on a lateral surface of the magnetic body, wherein the top surface of the inductor and the bottom surface of the substrate are configured side by side and electrically connected to each other, wherein a plurality of third electrodes are disposed on a lateral surface of the substrate, for electrically connecting the electronic module to an external circuit board.
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公开(公告)号：US20190150285A1
公开(公告)日：2019-05-16
申请号：US16248814
申请日：2019-01-16
Applicant: CYNTEC CO., LTD.
Inventor： Chun Hsien Lu , Bau-Ru Lu , Kaipeng Chiang
Abstract: An electronic module includes: a lead frame having at least one metal strip and a plurality of metal leads, wherein a magnetic body encapsulates a portion of each of the at least one metal strip with two ends of each of the at least one metal strip not covered by the magnetic body; and a substrate disposed on the lead frame, wherein the substrate is electrically connected to the plurality of metal leads and the at least one metal strip.
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公开(公告)号：US10212817B2
公开(公告)日：2019-02-19
申请号：US15414602
申请日：2017-01-24
Applicant: CYNTEC CO., LTD.
Inventor： Chun Hsien Lu , Bau-Ru Lu , Kaipeng Chiang
Abstract: An electronic module is provided. The electronic module includes: a magnetic device having a magnetic body, electronic devices, and a substrate, wherein a first lead extends out from a first lateral surface and a second lead extends out from a second lateral surface opposite to the first lateral surface of the magnetic body and the substrate and the second lead of the magnetic device are located at a same lateral side of the magnetic body and the second lead is extended from the second lateral surface of the magnetic body to the substrate to electrically connect the magnetic device and the substrate.
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公开(公告)号：US11744009B2
公开(公告)日：2023-08-29
申请号：US17477530
申请日：2021-09-17
Applicant: CYNTEC CO., LTD.
Inventor： Kaipeng Chiang , Da-Jung Chen , Bau-Ru Lu , Chun Hsien Lu
CPC classification number: H05K1/0262 , H05K1/0209 , H05K1/141
Abstract: An electronic module, such as a VRM, has a power inductor and power wave pins disposed on a bottom surface of a circuit board so as to reduce the size and increase the heat dissipation capability of the VRM.
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公开(公告)号：US20170223835A1
公开(公告)日：2017-08-03
申请号：US15414602
申请日：2017-01-24
Applicant: CYNTEC CO., LTD.
Inventor： Chun Hsien Lu , Bau-Ru Lu , Kaipeng Chiang
CPC classification number: H05K1/181 , H01F5/00 , H01F27/06 , H01F27/29 , H01F27/292 , H01F2027/065 , H01F2027/297 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10166 , H05K2201/10174
Abstract: An electronic module is provided. The electronic module includes: a magnetic device having a magnetic body, electronic devices, and a substrate, wherein a first lead extends out from a first lateral surface and a second lead extends out from a second lateral surface opposite to the first lateral surface of the magnetic body and the substrate and the second lead of the magnetic device are located at a same lateral side of the magnetic body and the second lead is extended from the second lateral surface of the magnetic body to the substrate to electrically connect the magnetic device and the substrate.
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