公开(公告)号：US20110056739A1

公开(公告)日：2011-03-10

申请号：US12720238

申请日：2010-03-09

Applicant: Chih-Cheng LEE

Inventor： Chih-Cheng LEE

IPC: H05K1/11 ,  H05K3/46 ,  H05K3/42 ,  H05K3/02

CPC classification number: H05K1/115 ,  H05K1/0298 ,  H05K3/0023 ,  H05K3/04 ,  H05K3/045 ,  H05K3/06 ,  H05K3/10 ,  H05K3/108 ,  H05K3/4038 ,  H05K3/4644 ,  H05K3/465 ,  H05K2201/0352 ,  H05K2203/025 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A method for manufacturing a substrate structure is provided. The method includes the following steps. A substrate is provided. The substrate has a patterned first metal layer, a pattern second metal layer and a through hole. After that, a first dielectric layer and a second dielectric layer are formed at a first surface and a second surface of the substrate, respectively. The second surface is opposite to the first surface. Then, the first dielectric layer and the second dielectric layer are patterned. After that, a first trace layer is formed at a surface of the patterned first dielectric layer. The first trace layer is embedded into the patterned first dielectric layer and is coplanar with the first dielectric layer. Then, a second trace layer is formed on a surface of the second dielectric layer.

Abstract translation: 提供了一种用于制造衬底结构的方法。 该方法包括以下步骤。 提供基板。 衬底具有图案化的第一金属层，图案第二金属层和通孔。 之后，分别在基板的第一表面和第二表面上形成第一电介质层和第二电介质层。 第二表面与第一表面相对。 然后，对第一电介质层和第二电介质层进行图案化。 之后，在图案化的第一介电层的表面形成第一迹线层。 第一迹线层被嵌入到图案化的第一介电层中并且与第一介电层共面。 然后，在第二电介质层的表面上形成第二迹线层。

公开(公告)号：US20100163287A1

公开(公告)日：2010-07-01

申请号：US12574350

申请日：2009-10-06

Applicant: Chih-Cheng LEE

Inventor： Chih-Cheng LEE

IPC: H05K1/09 ,  H05K1/00 ,  B44C1/22

CPC classification number: H05K3/4007 ,  H01L21/4846 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K1/112 ,  H05K3/243 ,  H05K3/42 ,  H05K2201/0352 ,  H05K2201/0367 ,  H05K2201/09436 ,  H05K2201/09509 ,  H05K2201/10674 ,  H05K2203/054 ,  H05K2203/072 ,  H05K2203/0723 ,  H05K2203/1572 ,  H01L2924/00

Abstract: A substrate structure is provided. The substrate structure includes a substrate, a first insulation layer, a conductive part, a second insulation layer, a seed layer and a conductive layer. The substrate has a first circuit pattern layer and a second circuit pattern layer, which are located on two opposite surfaces of the substrate respectively. The first insulation layer formed on the first circuit pattern layer has a first insulation hole, which exposes a first opening in the outer surface of the first insulation layer. The conductive part formed on the first insulation hole for electrically connecting with a chip is enclosed by the edge of the first opening. The second insulation layer formed on the second circuit pattern layer has a second insulation hole in which the seed layer is formed. The conductive layer is formed on the seed layer for electrically connecting with a circuit board.

Abstract translation: 提供了基板结构。 基板结构包括基板，第一绝缘层，导电部件，第二绝缘层，种子层和导电层。 衬底具有分别位于衬底的两个相对表面上的第一电路图案层和第二电路图案层。 形成在第一电路图案层上的第一绝缘层具有第一绝缘孔，其暴露第一绝缘层的外表面中的第一开口。 形成在与芯片电连接的第一绝缘孔上的导电部分被第一开口的边缘包围。 形成在第二电路图案层上的第二绝缘层具有形成种子层的第二绝缘孔。 导电层形成在种子层上，用于与电路板电连接。