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    Electronic component cooling system
    1.
    发明授权
    Electronic component cooling system 失效
    电子元件冷却系统

    公开(公告)号：US6000464A

    公开(公告)日：1999-12-14

    申请号：US852845

    申请日：1997-05-07

    Applicant: Christopher J. Scafidi ,  David J. Pierce

    Inventor： Christopher J. Scafidi ,  David J. Pierce

    IPC: H05K7/20 ,  F28D15/00

    CPC classification number: H05K7/20572

    Abstract: An electronic component cooling system for printed circuit board enclosures includes a plurality of fans, each coupled to an air deflection unit which selectively forces air from the fans through the printed circuit boards. The system includes at least one thermal diffuser and at least one air concentrator. The thermal diffuser is placed between a stack of two or more shelving units to avoid the development of hot spots or dead zones. The air concentrator provides the ability for certain components which have a high heat output to receive a greater amount of air flow than other components which have lower heat outputs.

    Abstract translation: 用于印刷电路板外壳的电子部件冷却系统包括多个风扇，每个风扇联接到空气偏转单元，其选择性地迫使来自风扇的空气通过印刷电路板。 该系统包括至少一个热扩散器和至少一个空气浓缩器。 热扩散器放置在两个或多个搁架单元的堆叠之间，以避免发生热点或死区。 空气浓缩器为具有较高热输出的某些部件提供能够接收比具有较低热输出的其它部件更大量的气流的能力。

    Surface mounted conduction heat sink
    2.
    发明授权
    Surface mounted conduction heat sink 有权
    表面贴装传导散热片

    公开(公告)号：US06249434B1

    公开(公告)日：2001-06-19

    申请号：US09597535

    申请日：2000-06-20

    Applicant: Christopher J. Scafidi

    Inventor： Christopher J. Scafidi

    IPC: H05K720

    CPC classification number: H05K7/20445 ,  H01L2224/73204 ,  H05K1/0206 ,  H05K1/0209 ,  H05K3/341 ,  H05K3/3452 ,  H05K2201/066 ,  H05K2201/09781 ,  H05K2201/099 ,  H05K2201/09909

    Abstract: A system and method for conducting heat from electrical devices mounted on a circuit board is disclosed. A heat sink for conducting the heat is provided that includes a pair of substantially parallel vertical legs and a horizontal member coupled between the pair of substantially parallel vertical legs to form a “U” shape. The horizontal member includes an outer surface and an inner surface both having a layer of thermal interface material. The heat sink is surface mountable to a heat sink mounting pad on a surface of a printed circuit board. The heat sink mounting pad is adjacent to and thermally coupled to a heat transfer pad of an electronic device. The heat sink is thermally coupled to the electronic device.

    Abstract translation: 公开了一种用于从安装在电路板上的电气装置传导热量的系统和方法。 提供了一种用于传导热量的散热器，其包括一对基本上平行的竖直腿部和联接在所述一对基本上平行的竖直腿部之间以形成“U”形状的水平部件。 水平构件包括具有一层热界面材料层的外表面和内表面。 散热器可表面安装到印刷电路板表面上的散热片安装垫。 散热器安装垫与电子设备的传热垫相邻并热耦合。 散热器热耦合到电子设备。

    Spring-loaded assembly for a connector
    3.
    发明授权
    Spring-loaded assembly for a connector 有权
    用于连接器的弹簧装配组件

    公开(公告)号：US07258560B2

    公开(公告)日：2007-08-21

    申请号：US10828617

    申请日：2004-04-21

    Applicant: Christopher J. Scafidi ,  Karl Hamand ,  Theodore C. Stamos

    Inventor： Christopher J. Scafidi ,  Karl Hamand ,  Theodore C. Stamos

    IPC: H01R13/64

    CPC classification number: H01R13/6315 ,  H01R2201/06

    Abstract: A spring-loaded assembly for coupling a connector to a computer component includes an assembly housing operable to receive a portion of a screw used to couple the connector to a chassis of an information handling system. The assembly further includes a sliding block disposed in the assembly housing and operably engaged with the screw. The sliding block is operable to move the connector between a first position and a second position. The assembly further includes a spring placed between the sliding block and at least one wall of the assembly housing. The spring operably provides an axial force to bias the connector to a first position, whereby coupling the connector to the computer component causes the connector to move to a connected position intermediate the first and second position.

    Abstract translation: 用于将连接器耦合到计算机部件的弹簧加载组件包括可操作以接收用于将连接器耦合到信息处理系统的机架的螺钉的一部分的组件壳体。 组件还包括设置在组件壳体中并与螺钉可操作地接合的滑块。 滑动块可操作以在第一位置和第二位置之间移动连接器。 组件还包括放置在滑动块和组件壳体的至少一个壁之间的弹簧。 弹簧可操作地提供轴向力以将连接器偏置到第一位置，由此将连接器连接到计算机部件使得连接器移动到第一和第二位置之间的连接位置。

    Surface mounted conduction heat sink
    4.
    发明授权
    Surface mounted conduction heat sink 有权
    表面贴装传导散热片

    公开(公告)号：US06356447B2

    公开(公告)日：2002-03-12

    申请号：US09841087

    申请日：2001-04-24

    Applicant: Christopher J. Scafidi

    Inventor： Christopher J. Scafidi

    IPC: H05K720

    CPC classification number: H05K7/20445 ,  H01L2224/73204 ,  H05K1/0206 ,  H05K1/0209 ,  H05K3/341 ,  H05K3/3452 ,  H05K2201/066 ,  H05K2201/09781 ,  H05K2201/099 ,  H05K2201/09909

    Abstract: A system and method for conducting heat from electrical devices mounted on a circuit board is disclosed. A heat sink for conducting the heat is provided that includes a pair of substantially parallel vertical legs and a horizontal member coupled between the pair of substantially parallel vertical legs to form a “U” shape. The horizontal member includes an outer surface and an inner surface both having a layer of thermal interface material. The heat sink is surface mountable to a heat sink mounting pad on a surface of a printed circuit board. The heat sink mounting pad is adjacent to and thermally coupled to a heat transfer pad of an electronic device. The heat sink is thermally coupled to the electronic device.

    Abstract translation: 公开了一种用于从安装在电路板上的电气装置传导热量的系统和方法。 提供了一种用于传导热量的散热器，其包括一对基本上平行的竖直腿部和联接在所述一对基本上平行的竖直腿部之间以形成“U”形状的水平部件。 水平构件包括具有一层热界面材料层的外表面和内表面。 散热器可表面安装到印刷电路板表面上的散热片安装垫。 散热器安装垫与电子设备的传热垫相邻并热耦合。 散热器热耦合到电子设备。

    Battery heating system using internal battery resistance
    5.
    发明授权
    Battery heating system using internal battery resistance 失效
    电池供电系统采用内部电池电阻

    公开(公告)号：US5362942A

    公开(公告)日：1994-11-08

    申请号：US110891

    申请日：1993-08-24

    Applicant: William T. Vanderslice, Jr. ,  Christopher J. Scafidi

    Inventor： William T. Vanderslice, Jr. ,  Christopher J. Scafidi

    IPC: H01M10/50 ,  H02J7/00 ,  H05B1/02 ,  H05B3/60

    CPC classification number: H05B1/023 ,  H01M10/615 ,  H01M10/625 ,  H01M10/633 ,  H01M10/637 ,  H01M10/6571 ,  H02J7/00 ,  H05B3/60

    Abstract: A battery heater uses the internal resistance of the battery as the battery heating element. In one embodiment, a DC battery charger and a programmable battery load, is used in a closed loop temperature control system. In another embodiment, a DC battery charger and a resistor or small auxiliary battery heater, is used in a closed loop temperature control system. The programmable load or the small auxiliary battery heater, is enabled during full charge, low temperature conditions. The resistor or small auxiliary heater serves to both heat the battery and draw down the battery charge. In yet another embodiment, an AC heater power supply and a DC battery charger, is coupled to the battery in a closed loop temperature control system.

    Abstract translation: 电池加热器使用电池的内部电阻作为电池加热元件。 在一个实施例中，DC电池充电器和可编程电池负载被用在闭环温度控制系统中。 在另一个实施例中，在闭环温度控制系统中使用DC电池充电器和电阻器或小型辅助电池加热器。 可编程负载或小型辅助电池加热器在充满电，低温条件下使能。 电阻器或小型辅助加热器用于加热电池并拉低电池电量。 在另一个实施例中，AC加热器电源和DC电池充电器在闭环温度控制系统中耦合到电池。

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