公开(公告)号：US20150151959A1

公开(公告)日：2015-06-04

申请号：US14555913

申请日：2014-11-28

Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE ALT

Inventor： Xavier BAILLIN

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0038 ,  B81C1/00285 ,  H01L23/10 ,  H01L23/26 ,  H01L23/3121 ,  H01L2924/0002 ,  H01L2924/0001 ,  H01L2924/00012 ,  H01L2924/00

Abstract: An encapsulation structure comprising at least: a hermetically sealed cavity in which a micro-device is encapsulated, a substrate of which one face delimits one side of the cavity, at least two trenches formed through said face of the substrate, the interior volumes of each of the trenches communicating together, first portions of getter material covering at least in part side walls of the trenches without entirely filling the trenches, and completely covering the trenches at said face of the substrate, an opening formed through one of the first portions of getter material or through the substrate and making the interior volumes of the trenches communicate with an interior volume of the cavity.

Abstract translation: 一种封装结构，其至少包括：密封腔体，其中微型器件被封装在其中;衬底，其一个面限定所述空腔的一侧;至少两个通过所述衬底的所述面形成的沟槽， 沟槽连通的第一部分吸气材料覆盖沟槽的至少部分侧壁，而不完全填充沟槽，并且完全覆盖基板的所述表面处的沟槽，通过吸气剂的第一部分之一形成的开口 材料或通过基底并使沟槽的内部容积与空腔的内部容积连通。

公开(公告)号：US20150050428A1

公开(公告)日：2015-02-19

申请号：US14445511

申请日：2014-07-29

Applicant: Commissariat A L'energie Atomique Et Aux Ene Alt

Inventor： Xavier BAILLIN ,  Didier GASPURATTO

IPC: C23C18/08 ,  C23C18/02 ,  C23C18/10 ,  C23C18/04

CPC classification number: C23C18/08 ,  C23C18/02 ,  C23C18/04 ,  C23C18/10 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1653 ,  C23C18/1893 ,  C23C18/2086 ,  H01L21/288 ,  H01L21/76841 ,  H01L21/76874 ,  H01L21/76898

Abstract: The invention concerns a method for producing a metal coating on a portion of the surface of a substrate of a microelectronic device, wherein it comprises, using a modified nucleic acid strand comprising a nucleic acid strand structure, at least one metal nanoparticle and/or a metal atom and at least one chemical function, at least one step of fixing the chemical function of the at least one modified nucleic acid strand on the portion of the surface of the substrate.

Abstract translation: 本发明涉及一种用于在微电子器件的衬底的一部分表面上制备金属涂层的方法，其中包括使用包含核酸链结构的修饰的核酸链，至少一种金属纳米颗粒和/或 金属原子和至少一种化学功能，将至少一种修饰的核酸链的化学功能固定在基底表面的部分上的至少一个步骤。

公开(公告)号：US20140038364A1

公开(公告)日：2014-02-06

申请号：US13950822

申请日：2013-07-25

Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE ALT

Inventor： Stephane NICOLAS ,  Xavier BAILLIN

IPC: B81C1/00 ,  H01L21/56

CPC classification number: B81C1/00285 ,  B81B7/02 ,  B81C1/00293 ,  B81C2203/0145 ,  H01L21/56 ,  H01L24/96 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Method of encapsulating at least one microelectronic device, comprising at least the following steps: encapsulate the microelectronic device in a cavity hermetically sealed against air, a cap of the cavity comprising at least one wall permeable to at least one noble gas, inject the noble gas into the cavity through the wall permeable to the noble gas, hermetically seal the cavity against air and the noble gas injected into the cavity.

Abstract translation: 封装至少一个微电子器件的方法，包括至少以下步骤：将微电子器件封装在密封于空气中的空腔中，空腔的帽包括至少一个可渗透至少一种惰性气体的壁，将惰性气体 通过可渗透惰性气体的壁进入空腔，将空腔气密地密封，并将空气和注入空腔的惰性气体密封。

公开(公告)号：US20150028433A1

公开(公告)日：2015-01-29

申请号：US14331285

申请日：2014-07-15

Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE ALT

Inventor： Xavier BAILLIN ,  Bernard DIEM ,  Jean-Philippe POLIZZI ,  Andre ROUZAUD

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0058 ,  B81B7/0038 ,  B81B7/0077 ,  B81B2201/0228 ,  B81B2207/096 ,  B81C1/00285 ,  B81C1/00301 ,  B81C1/00682 ,  B81C2201/053 ,  B81C2203/0136 ,  B81C2203/0163 ,  H01L2224/16145 ,  H01L2224/16225

Abstract: A structure (100) for encapsulating at least one microdevice (104) produced on and/or in a substrate (102) and positioned in at least one cavity (110) formed between the substrate and a cap (106) rigidly attached to the substrate, in which the cap includes at least: one layer (112) of a first material, one face of which (114) forms an inner wall of the cavity, and mechanical reinforcement portions (116) rigidly attached at least to the said face of the layer of the first material, partly covering the said face of the layer of the first material, and having gas absorption and/or adsorption properties, and in which the Young's modulus of a second material of the mechanical reinforcement portions is higher than that of the first material.

Abstract translation: 一种用于封装至少一个在基板（102）上和/或基板（102）上产生并位于至少一个形成在基板和刚性地附接到基板的盖（106）之间的空腔（110）中的微器件（104）的结构（100） ，其中所述盖至少包括：第一材料的一层（112），其一个面（114）形成所述空腔的内壁，以及至少刚性地附接到所述表面的所述表面的机械加强部分（116） 所述第一材料层，部分覆盖所述第一材料层的所述表面，并且具有气体吸收和/或吸附性能，并且其中所述机械增强部分的第二材料的杨氏模量高于 第一种材料。

公开(公告)号：US20130207281A1

公开(公告)日：2013-08-15

申请号：US13764244

申请日：2013-02-11

Applicant: Commissariat A L'Energie Atomique Et Aux Ene Alt

Inventor： Xavier BAILLIN ,  Jean-Louis Pornin

IPC: B81C1/00 ,  B81B3/00

CPC classification number: B81C1/00134 ,  B81B3/0018 ,  B81B7/0038 ,  B81C1/00357 ,  B81C2201/0108 ,  B81C2201/019 ,  B81C2203/0109 ,  B81C2203/0136 ,  B81C2203/0145 ,  H01L21/2007

Abstract: Microelectronic substrate comprising at least: a support layer, a top layer comprising at least one semiconductor, a layer comprising at least one organic material able to be etched selectively with respect to the semiconductor of the top layer by using a dry etching, and disposed between the support layer and the top layer, and also comprising one or more portions of dielectric material the hardness of which is greater than that of the organic material, disposed in the layer of organic material, and the thickness of which is substantially equal to that of the layer of organic material.

Abstract translation: 微电子衬底包括至少包括：支撑层，包括至少一个半导体的顶层，包含至少一种有机材料的层，所述至少一种有机材料可以通过使用干蚀刻相对于顶层的半导体选择性地被蚀刻，并且设置在 支撑层和顶层，并且还包括设置在有机材料层中的硬度大于有机材料的硬度的介电材料的一个或多个部分，其厚度基本上等于 有机材料层。