公开(公告)号：US20160366759A1

公开(公告)日：2016-12-15

申请号：US14461900

申请日：2014-08-18

Applicant: Cray Inc.

Inventor： Hyunjun Kim ,  Jeffrey Scott Conger ,  Gregory Erwin Scott

IPC: H05K1/02 ,  H05K3/42 ,  H05K3/40 ,  H05K1/11

CPC classification number: H05K1/0225 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/0245 ,  H05K1/0298 ,  H05K1/114 ,  H05K1/115 ,  H05K3/4007 ,  H05K3/42 ,  H05K2201/093 ,  H05K2201/09336 ,  H05K2201/09609 ,  H05K2201/09618 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A multi-layer printed circuit board has a number of landing pads that are configured to engage a connector secured thereto. Between the landing pads associated with different signals is at least one micro via that is electrically connected to a ground plane on an outer surface of the multi-layer printed circuit board, and a ground plane on an inner layer of the multi-layer printed circuit board.

公开(公告)号：US20150013155A1

公开(公告)日：2015-01-15

申请号：US14507201

申请日：2014-10-06

Applicant: Cray Inc.

Inventor： Hyunjun Kim ,  Jeffrey Scott Conger ,  Gregory Erwin Scott

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0225 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/0245 ,  H05K1/0298 ,  H05K1/114 ,  H05K1/115 ,  H05K3/4007 ,  H05K3/42 ,  H05K2201/093 ,  H05K2201/09336 ,  H05K2201/09609 ,  H05K2201/09618 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A multi-layer printed circuit board has a number of landing pads that are configured to engage a connector secured thereto. Between the landing pads associated with different signals is at least one micro via that is electrically connected to a ground plane on an outer surface of the multi-layer printed circuit board, and a ground plane on an inner layer of the multi-layer printed circuit board.

Abstract translation: 多层印刷电路板具有多个着陆焊盘，其被配置为接合固定到其上的连接器。 在与不同信号相关联的着陆垫之间是至少一个微通孔，其电连接到多层印刷电路板的外表面上的接地平面，以及多层印刷电路的内层上的接地平面 板。