公开(公告)号：US10377676B2

公开(公告)日：2019-08-13

申请号：US15297722

申请日：2016-10-19

Applicant: Denka Company Limited

Inventor： Koki Ikarashi ,  Shuhei Nonaka ,  Toshikatsu Mitsunaga ,  Hideki Hirotsuru ,  Mitsuru Shiiba

IPC: C04B35/583 ,  C04B41/00 ,  C04B41/84 ,  C04B41/83 ,  C04B41/48 ,  C04B41/49 ,  H01L23/14 ,  H01L23/373 ,  H05K1/03 ,  C04B111/00

Abstract: A resin-impregnated boron nitride sintered body having superior thermal conductivity and superior strength, and a resin-impregnated boron nitride sintered body having superior conductivity and small anisotropy of thermal conductivity are provided. A resin-impregnated boron nitride sintered body, including: 30 to 90 volume % of a boron nitride sintered body having boron nitride particles bonded three-dimensionally; and 10 to 70 volume % of a resin; wherein the boron nitride sintered body has a porosity of 10 to 70%; the boron nitride particles of the boron nitride sintered body has an average long diameter of 10 μm or more; the boron nitride sintered body has a graphitization index by powder X-ray diffractometry is 4.0 or less; and an orientation degree of the boron nitride particles of the boron nitride sintered body by I.O.P is 0.01 to 0.05 or 20 to 100; and a resin-impregnated boron nitride sintered body, including: 30 to 90 volume % of a boron nitride sintered body having boron nitride particles bonded three-dimensionally is provided.

公开(公告)号：US20170036963A1

公开(公告)日：2017-02-09

申请号：US15297722

申请日：2016-10-19

Applicant: Denka Company Limited

Inventor： Koki Ikarashi ,  Shuhei Nonaka ,  Toshikatsu Mitsunaga ,  Hideki Hirotsuru ,  Mitsuru Shiiba

IPC: C04B41/84 ,  H01L23/373 ,  H05K1/03 ,  C04B41/49

CPC classification number: C04B41/84 ,  C04B35/583 ,  C04B41/009 ,  C04B41/48 ,  C04B41/4853 ,  C04B41/4905 ,  C04B41/4961 ,  C04B41/83 ,  C04B2111/00844 ,  C04B2235/3208 ,  C04B2235/386 ,  C04B2235/3895 ,  C04B2235/5292 ,  C04B2235/5436 ,  C04B2235/5472 ,  C04B2235/787 ,  C04B2235/9607 ,  H01L23/145 ,  H01L23/3737 ,  H01L2924/0002 ,  H05K1/0373 ,  H05K2201/0209 ,  H01L2924/00 ,  C04B38/00

Abstract: A resin-impregnated boron nitride sintered body having superior thermal conductivity and superior strength, and a resin-impregnated boron nitride sintered body having superior conductivity and small anisotropy of thermal conductivity are provided. A resin-impregnated boron nitride sintered body, including: 30 to 90 volume % of a boron nitride sintered body having boron nitride particles bonded three-dimensionally; and 10 to 70 volume % of a resin; wherein the boron nitride sintered body has a porosity of 10 to 70%; the boron nitride particles of the boron nitride sintered body has an average long diameter of 10 μm or more; the boron nitride sintered body has a graphitization index by powder X-ray diffractometry is 4.0 or less; and an orientation degree of the boron nitride particles of the boron nitride sintered body by I.O.P is 0.01 to 0.05 or 20 to 100; and a resin-impregnated boron nitride sintered body, including: 30 to 90 volume % of a boron nitride sintered body having boron nitride particles bonded three-dimensionally is provided.

Abstract translation: 提供具有优良导热性和优异强度的树脂浸渍氮化硼烧结体，以及具有优异导电性和小导热性各向异性的树脂浸渍氮化硼烧结体。 一种树脂浸渍氮化硼烧结体，其包括：三维结合氮化硼颗粒的氮化硼烧结体的30〜90体积％ 和10〜70体积％的树脂; 其中，所述氮化硼烧结体的孔隙率为10〜70％。 氮化硼烧结体的氮化硼粒子的平均长径为10μm以上， 氮化硼烧结体的粉末X射线衍射法的石墨化指数为4.0以下; 氮化硼烧结体的氮化硼粒子的取向度为0.01〜0.05或20〜100; 和树脂浸渍的氮化硼烧结体，其包括：三维结合氮化硼颗粒的氮化硼烧结体的30〜90体积％。

公开(公告)号：US10087112B2

公开(公告)日：2018-10-02

申请号：US14895469

申请日：2014-06-02

Applicant: Denka Company Limited

Inventor： Koki Ikarashi ,  Shuhei Nonaka ,  Toshikatsu Mitsunaga ,  Hideki Hirotsuru ,  Mitsuru Shiiba

IPC: C04B35/583 ,  C04B41/00 ,  C04B41/49 ,  C04B41/48 ,  C04B41/84 ,  C04B41/83 ,  H01L23/14 ,  H01L23/373 ,  H05K1/03 ,  C04B111/00

Abstract: A resin-impregnated boron nitride sintered body having superior thermal conductivity and superior strength, and a resin-impregnated boron nitride sintered body having superior conductivity and small anisotropy of thermal conductivity are provided. A resin-impregnated boron nitride sintered body, including: 30 to 90 volume % of a boron nitride sintered body having boron nitride particles bonded three-dimensionally; and 10 to 70 volume % of a resin; wherein the boron nitride sintered body has a porosity of 10 to 70%; the boron nitride particles of the boron nitride sintered body has an average long diameter of 10 μm or more; the boron nitride sintered body has a graphitization index by powder X-ray diffractometry is 4.0 or less; and an orientation degree of the boron nitride particles of the boron nitride sintered body by I.O.P is 0.01 to 0.05 or 20 to 100; and a resin-impregnated boron nitride sintered body, including: 30 to 90 volume % of a boron nitride sintered body having boron nitride particles bonded three-dimensionally is provided.

公开(公告)号：US09516741B2

公开(公告)日：2016-12-06

申请号：US14911707

申请日：2014-08-12

Applicant: Denka Company Limited

Inventor： Hideki Hirotsuru ,  Shuhei Nonaka ,  Toshikatsu Mitsunaga ,  Koki Ikarashi ,  Kouji Miyata ,  Taiki Nishi ,  Saori Inoue ,  Fumiya Kobayashi

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/03 ,  C08K7/00 ,  H05K3/02 ,  H05K3/38 ,  C08K3/38

CPC classification number: H05K1/0271 ,  C08K7/00 ,  C08K2003/385 ,  C08K2201/004 ,  H05K1/0203 ,  H05K1/0306 ,  H05K1/0353 ,  H05K1/0373 ,  H05K1/09 ,  H05K3/022 ,  H05K3/38 ,  H05K2201/0104 ,  H05K2201/066

Abstract: A boron nitride/resin composite circuit board having high heat dissipation characteristics and high reliability is provided. A boron nitride/resin composite circuit board, including: a plate-shaped resin-impregnated boron nitride sintered body having a plate thickness of 0.2 to 1.5 mm, the plate-shaped resin-impregnated boron nitride sintered body including 30 to 85 volume % of a boron nitride sintered body having boron nitride particles bonded three-dimensionally, the boron nitride particles having an average long diameter of 5 to 50 μm, and 70 to 15 volume % of a resin; and a metal circuit adhered onto both principal planes of the plate-shaped resin-impregnated boron nitride sintered body, the metal circuit being copper or aluminum, wherein: a ratio of a linear thermal expansion coefficient in a plane direction of the resin-impregnated boron nitride sintered body at 40 to 150° C. (CTE1) and a linear thermal expansion coefficient of the metal circuit at 40 to 150° C. (CTE2) (CTE1/CTE2) is 0.5 to 2.0.

Abstract translation: 提供具有高散热特性和高可靠性的氮化硼/树脂复合电路板。 一种氮化硼/树脂复合电路板，包括：板厚为0.2〜1.5mm的板状树脂浸渍氮化硼烧结体，含有30〜85体积％的板状树脂浸渍氮化硼烧结体 具有三维结合的氮化硼颗粒的氮化硼烧结体，平均长径为5〜50μm的氮化硼颗粒和70〜15体积％的树脂; 以及附着在板状树脂浸渍氮化硼烧结体的两个主平面上的金属电路，金属电路为铜或铝，其中：树脂浸渍硼的平面方向的线性热膨胀系数的比例 40℃〜150℃（CTE1）的金属电路的线性热膨胀系数（CTE2）（CTE1 / CTE2）为40〜150℃。

公开(公告)号：US20160130187A1

公开(公告)日：2016-05-12

申请号：US14895469

申请日：2014-06-02

Applicant: DENKA COMPANY LIMITED

Inventor： Koki Ikarashi ,  Shuhei Nonaka ,  Toshikatsu Mitsunaga ,  Hideki Hirotsuru ,  Mitsuru Shiiba

IPC: C04B35/583 ,  C04B41/00 ,  C04B41/49 ,  C04B41/48

CPC classification number: C04B41/84 ,  C04B35/583 ,  C04B41/009 ,  C04B41/48 ,  C04B41/4853 ,  C04B41/4905 ,  C04B41/4961 ,  C04B41/83 ,  C04B2111/00844 ,  C04B2235/3208 ,  C04B2235/386 ,  C04B2235/3895 ,  C04B2235/5292 ,  C04B2235/5436 ,  C04B2235/5472 ,  C04B2235/787 ,  C04B2235/9607 ,  H01L23/145 ,  H01L23/3737 ,  H01L2924/0002 ,  H05K1/0373 ,  H05K2201/0209 ,  H01L2924/00 ,  C04B38/00

Abstract: A resin-impregnated boron nitride sintered body having superior thermal conductivity and superior strength, and a resin-impregnated boron nitride sintered body having superior conductivity and small anisotropy of thermal conductivity are provided. A resin-impregnated boron nitride sintered body, including: 30 to 90 volume % of a boron nitride sintered body having boron nitride particles bonded three-dimensionally; and 10 to 70 volume % of a resin; wherein the boron nitride sintered body has a porosity of 10 to 70%; the boron nitride particles of the boron nitride sintered body has an average long diameter of 10 μm or more; the boron nitride sintered body has a graphitization index by powder X-ray diffractometry is 4.0 or less; and an orientation degree of the boron nitride particles of the boron nitride sintered body by I.O.P is 0.01 to 0.05 or 20 to 100; and a resin-impregnated boron nitride sintered body, including: 30 to 90 volume % of a boron nitride sintered body having boron nitride particles bonded three-dimensionally is provided.

Abstract translation: 提供具有优良导热性和优异强度的树脂浸渍氮化硼烧结体，以及具有优异导电性和小导热性各向异性的树脂浸渍氮化硼烧结体。 一种树脂浸渍氮化硼烧结体，其包括：三维结合氮化硼颗粒的氮化硼烧结体的30〜90体积％ 和10〜70体积％的树脂; 其中，所述氮化硼烧结体的孔隙率为10〜70％。 氮化硼烧结体的氮化硼粒子的平均长径为10μm以上， 氮化硼烧结体的粉末X射线衍射法的石墨化指数为4.0以下; 氮化硼烧结体的氮化硼粒子的取向度为0.01〜0.05或20〜100; 和树脂浸渍的氮化硼烧结体，其包括：三维结合氮化硼颗粒的氮化硼烧结体的30〜90体积％。