公开(公告)号：US20160105958A1

公开(公告)日：2016-04-14

申请号：US14785422

申请日：2014-04-21

Applicant: DENSO CORPORATION

Inventor： Toshihiro NAKAMURA ,  Shinya UCHIBORI ,  Koji NUMAZAKI ,  Atsushi KASHIWAZAKI ,  Masaji IMADA ,  Eiji YABUTA

IPC: H05K1/03 ,  H05K3/00 ,  H05K3/06 ,  H05K3/34 ,  H01L23/498 ,  H05K1/18

CPC classification number: H05K1/0306 ,  H01L23/145 ,  H01L23/15 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19105 ,  H05K1/0313 ,  H05K1/038 ,  H05K1/181 ,  H05K3/0067 ,  H05K3/067 ,  H05K3/341 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4655 ,  H05K2201/029 ,  H05K2201/0347 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10166 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: In a multi-layer substrate, a glass cloth of a build-up layer is deformed toward a land below the land. A thickness of a resin layer of the build-up layer from the glass cloth to a surface adjacent to the land is set to be smaller than a dimension from the glass cloth to a front surface of a core layer. With the above configuration, a progress or an enlargement of a crack can be suppressed from a stage in which the crack is smaller. Therefore, the progress and the enlargement of the crack can be delayed. As a result, even if the crack is generated, an insulating property between the land and an inner layer wire is ensured, and the land and the inner layer wire can be restricted from being short-circuited.

Abstract translation: 在多层基板中，堆积层的玻璃布朝向陆地下方的陆地变形。 从玻璃布到邻接的台面的堆积层的树脂层的厚度被设定为小于从玻璃布到芯层的前表面的尺寸。 利用上述结构，可以从裂纹较小的阶段抑制裂纹的进行或扩大。 因此，破裂的进展和扩大可能会延迟。 结果，即使产生裂缝，也能够确保焊盘与内层电线之间的绝缘性，能够限制焊盘和内层电线的短路。

公开(公告)号：US20150319840A1

公开(公告)日：2015-11-05

申请号：US14427458

申请日：2013-09-24

Applicant: DENSO CORPORATION

Inventor： Yuuki SANADA ,  Norihisa IMAIZUMI ,  Shinya UCHIBORI ,  Masaji IMADA ,  Toshihiro NAKAMURA ,  Eiji YABUTA ,  Masayuki TAKENAKA

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0204 ,  H01L23/13 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/3735 ,  H01L2224/32225 ,  H01L2924/13055 ,  H01L2924/19105 ,  H05K1/0206 ,  H05K1/0209 ,  H05K1/181 ,  H05K1/182 ,  H05K7/205 ,  H05K7/20854 ,  H05K2201/09781 ,  H05K2201/10166 ,  H01L2924/00

Abstract: In an electronic device, a heat generating element is connected directly to an electrically-conductive joining material that is the start point of the heat dissipation path on the one surface of the substrate, and the other surface of the substrate is provided by an other surface side insulating layer. An electrically-conductive other surface side electrode connected to an external heat dissipation member is disposed on the surface of the other surface side insulating layer right under the heat generating element. On the other surface side of the substrate, an other surface side inner layer wire that is the end point of the heat dissipation path extends to the other surface side insulating layer and is insulated electrically from the other surface side electrode through the other surface side insulating layer.

Abstract translation: 在电子设备中，发热元件直接连接到作为基板的一个表面上的散热路径的起始点的导电接合材料，并且基板的另一个表面由另一个表面 侧绝缘层。 连接到外部散热构件的导电的另一表面侧电极设置在发热元件正下方的另一表面侧绝缘层的表面上。 在基板的另一面侧，作为散热路径的端点的另一面侧内层线延伸到另一表面侧绝缘层，并且通过另一表面侧绝缘而与另一表面侧电极电绝缘 层。