公开(公告)号：US20140225144A1

公开(公告)日：2014-08-14

申请号：US14222249

申请日：2014-03-21

Applicant: Dexerials Corporation

Inventor： Hidetsugu NAMIKI ,  Shiyuki KANISAWA ,  Hideaki UMAKOSHI

IPC: H01L33/62 ,  H01L23/00 ,  H01L33/60

CPC classification number: H01B1/02 ,  C08G59/42 ,  C08K9/02 ,  C09J9/02 ,  C09J11/04 ,  C09J163/00 ,  H01B1/22 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L33/46 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/29393 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81903 ,  H01L2224/83851 ,  H01L2224/9211 ,  H01L2924/00014 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/181 ,  Y10T428/2991 ,  Y10T428/2993 ,  Y10T428/2998 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/05432 ,  H01L2924/05341 ,  H01L2924/05342 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/05599

Abstract: A light-reflective conductive particle for an anisotropic conductive adhesive used for connecting a light-emitting element to a wiring board by anisotropic conductive connection includes a core particle covered with a metal material and a light reflecting layer formed of a light-reflective inorganic particle having a refractive index of 1.52 or greater on the surface of the core particle. Examples of the light-reflective inorganic particles having a refractive index of 1.52 or greater include a titanium oxide particle, a zinc oxide particle, and an aluminum oxide particle. The coverage of the light reflecting layer on the surface of the core particle is 70% or more.

Abstract translation: 用于通过各向异性导电连接将发光元件连接到布线板的用于各向异性导电粘合剂的光反射导电颗粒包括被金属材料覆盖的芯颗粒和由反光无机颗粒形成的光反射层，所述光反射层具有 核心颗粒表面的折射率为1.52或更大。 折射率为1.52以上的光反射性无机粒子的实例包括氧化钛颗粒，氧化锌颗粒和氧化铝颗粒。 芯粒子表面的光反射层的覆盖率为70％以上。

公开(公告)号：US20140248477A1

公开(公告)日：2014-09-04

申请号：US14275460

申请日：2014-05-12

Applicant: DEXERIALS CORPORATION

Inventor： Akira ISHIGAMI ,  Shiyuki KANISAWA ,  Hidetsugu NAMIKI ,  Hideaki UMAKOSHI ,  Masaharu AOKI

IPC: H01L23/00 ,  C08L83/04 ,  C08L79/08 ,  C08L67/00 ,  C08L27/06

Abstract: A buffer film for multi-chip packaging which does not cause out of alignment during multi-chip packaging and ensures favorable connection reliability has a structure in which a heat-resistant resin layer having a linear expansion coefficient of 80 ppm/° C. or less and a flexible resin layer made of a resin material having a Shore A hardness according to JIS K6253 of 10 to 80 are laminated. A multi-chip module can be produced by aligning a plurality of chip devices on a substrate through an adhesive to perform temporary adhesion, disposing the buffer film for multi-chip packaging between the chip devices and a bonding head so that the heat-resistant resin layer is on a chip device side, and connecting the plurality of chip devices with the substrate by applying heat and pressure to the chip devices toward the substrate with the bonding head.

Abstract translation: 用于多芯片封装的缓冲膜在多芯片封装期间不会导致对准并且确保良好的连接可靠性具有这样的结构，其中线膨胀系数为80ppm /℃或更低的耐热树脂层 并且层压由具有根据JIS K6253的肖氏A硬度为10至80的树脂材料制成的柔性树脂层。 可以通过粘合剂对基板上的多个芯片装置进行临时粘合，在芯片装置之间设置用于多芯片封装的缓冲膜和接合头，从而制造多芯片模块，使得耐热树脂 层位于芯片器件侧，并且通过利用接合头向衬底施加热和压力来将多个芯片器件与衬底连接。

公开(公告)号：US20150353781A1

公开(公告)日：2015-12-10

申请号：US14830070

申请日：2015-08-19

Applicant: DEXERIALS CORPORATION

Inventor： Hidetsugu NAMIKI ,  Shiyuki KANISAWA ,  Hideaki UMAKOSHI ,  Masaharu AOKI ,  Akira ISHIGAMI

IPC: C09J9/02 ,  C23C14/22 ,  H01L33/48 ,  C23C14/02 ,  H01L33/62 ,  H01L33/60

CPC classification number: C09J11/00 ,  C08K7/16 ,  C08K9/00 ,  C09J9/02 ,  C23C14/025 ,  C23C14/205 ,  C23C14/223 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/29413 ,  H01L2224/29439 ,  H01L2224/29455 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81903 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/05599

Abstract: Provided is a light emitting device high in the intensity of emitted light. A blue LED chip having a peak of emitted light in a wavelength range of at least 360 nm and at most 500 nm is adhered to an electrode substrate by an anisotropic conductive adhesive. A light reflecting layer made of a silver alloy on a surface of each conductive particle contained in the anisotropic conductive adhesive, and has high reflectance with respect to blue light. The light reflecting layer is formed by sputtering of a sputtering target that contains Ag, Bi, and Nd with the content ratio of Bi set to at least 0.1 weight % (wt %) and at most 3.0 wt % and the content ratio of Nd set to at least 0.1 weight % and at most 2.0 wt % with respect to the total weight of Ag, Bi, and Nd of 100 wt %. The conductive particle has high anti-migration properties.

Abstract translation: 提供了发光强度高的发光装置。 通过各向异性导电粘合剂将具有至少360nm且至多500nm的波长范围内的发射峰的峰值的蓝色LED芯片粘附到电极基板。 在各向异性导电粘合剂中含有的各导电粒子的表面上由银合金制成的光反射层，对蓝色光具有高反射率。 光反射层通过溅射含有Ag，Bi和Nd的溅射靶，其Bi含量比设定为至少0.1重量％（wt％）至多3.0重量％，Nd含量比 相对于100重量％的Ag，Bi和Nd的总重量为至少0.1重量％且至多2.0重量％。 导电颗粒具有高的抗迁移性能。

公开(公告)号：US20150034989A1

公开(公告)日：2015-02-05

申请号：US14515648

申请日：2014-10-16

Applicant: DEXERIALS CORPORATION

Inventor： Hidetsugu NAMIKI ,  Shiyuki KANISAWA ,  Hideaki UMAKOSHI ,  Masaharu AOKI ,  Akira ISHIGAMI

IPC: C09J9/02 ,  C23C14/14 ,  H01L33/00 ,  H01L33/46 ,  H01L33/62

CPC classification number: C09J9/02 ,  C08J3/128 ,  C08K3/08 ,  C08K9/12 ,  C09J11/00 ,  C09J201/00 ,  C22C5/06 ,  C23C14/14 ,  H01B1/22 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L33/005 ,  H01L33/46 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/06102 ,  H01L2224/13144 ,  H01L2224/1403 ,  H01L2224/16238 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29455 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2224/81192 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00

Abstract: an anisotropic conductive adhesive which uses conductive particles where a silver-based metal is used as a conductive layer, having high light reflectance and excellent migration resistance is provided. The anisotropic conductive adhesive includes light reflective conductive particles in an insulating adhesive resin. The light reflective conductive particle includes a light reflective metal layer made of a metal alloy including silver, gold and hafnium formed on the surface of a resin particle as a core by sputtering method. The light reflective metal layer is preferably formed having a composition ratio of a silver of at least 50% by weight to at most 80% by weight: a gold of at least 10% by weight to at most 45%: a hafnium of at least 10% by weight to at most 40% by weight, and a total ratio does not exceed 100% by weight.

Abstract translation: 提供使用银基金属作为导电层的导电性粒子的各向异性导电粘合剂，具有高的光反射率和优异的耐迁移性。 各向异性导电粘合剂包括绝缘粘合树脂中的光反射导电颗粒。 光反射性导电性粒子包括通过溅射法在由树脂粒子的表面形成的包含银，金和铪的金属合金制成的光反射金属层。 光反射金属层优选形成为具有至少50重量％至至多80重量％的银的组成比：至少10重量％至至多45重量％的金：至少一个铪 10重量％至至多40重量％，总比例不超过100重量％。

公开(公告)号：US20140217450A1

公开(公告)日：2014-08-07

申请号：US14246618

申请日：2014-04-07

Applicant: DEXERIALS CORPORATION

Inventor： Akira ISHIGAMI ,  Shiyuki KANISAWA ,  Hidetsugu NAMIKI ,  Hideaki UMAKOSHI ,  Masaharu AOKI

IPC: H01L33/46 ,  H01L33/60

CPC classification number: H01L33/46 ,  C09J9/00 ,  C09J11/00 ,  H01B1/22 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49107 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/07811 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An anisotropic conductive adhesive which uses conductive particles where a silver-based metal is used as a conductive layer, having high light reflectance and excellent migration resistance is provided. The anisotropic conductive adhesive includes light reflective conductive particles in an insulating adhesive resin. The light reflective conductive particle includes a light reflective metal layer made of a metal having at least 60% of reflectance at a peak wavelength of 460 nm formed on the surface of a resin particle as a core, and a coating layer made of a silver alloy formed on the surface of the light reflective metal layer. The light reflective metal layer is preferably formed by a plating method.

Abstract translation: 提供了使用银基金属作为导电层的导电性粒子的各向异性导电性粘合剂，具有高的光反射率和优异的耐迁移性。 各向异性导电粘合剂包括绝缘粘合树脂中的光反射导电颗粒。 光反射性导电性粒子包括在作为芯的树脂粒子的表面上形成的在460nm的峰值波长具有至少60％的反射率的金属制成的光反射金属层，以及由银合金 形成在光反射金属层的表面上。 光反射金属层优选通过电镀法形成。