公开(公告)号：US20220181369A1

公开(公告)日：2022-06-09

申请号：US17437350

申请日：2020-03-02

Applicant: DEXERIALS CORPORATION

Inventor： Yusuke TANAKA ,  Yusuke KAMATA ,  Hidetsugu NAMIKI ,  Manabu SUZUKI

IPC: H01L27/146 ,  H04N5/369

Abstract: A method of manufacturing a connection structure, connection structure, film structure, and a method of manufacturing a film structure capable of mounting an electronic component having a plurality of terminal rows on a mounting surface by using existing equipment, including: a pasting step of pasting, from a film structure including a tape-shaped base material and a connection film formed thereon, connection films having a unit region of a predetermined length in the length direction of the base material and a predetermined width in the width direction to a first or second electronic component having a plurality of terminal rows; and a connecting step of connecting terminals of the first and second electronic components through the connection films, wherein the film structure includes, in the unit region, in addition to portions corresponding to the plurality of terminal rows, a non-pasting portion in which the connection film is not pasted.

公开(公告)号：US20190244937A1

公开(公告)日：2019-08-08

申请号：US16081673

申请日：2017-02-20

Applicant: DEXERIALS CORPORATION

Inventor： Keiji HONJO ,  Hidetsugu NAMIKI ,  Yasuyuki HIGUCHI

IPC: H01L25/075

CPC classification number: H01L25/0753 ,  G02B5/20 ,  G09F9/00 ,  G09F9/33 ,  H01L33/50 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2224/95

Abstract: A display device which can achieve increased brightness and resolution and a method for manufacturing the same as well as a light-emitting device and a method for manufacturing the same are provided. The device includes a plurality of light-emitting elements having a first face, arranged in units of subpixels, and having at least one of a first electrically conducting electrode and second electrically conducting electrode on the first face, a substrate having an electrode corresponding to the electrode on the first face of the plurality of light-emitting elements, an anisotropic conductive film providing an anisotropic conductive connection between the electrode on the first face of the plurality of light-emitting elements and the electrode of the substrate, and a wavelength conversion member converting a wavelength of light from the light-emitting elements in units of subpixels.

公开(公告)号：US20190016930A1

公开(公告)日：2019-01-17

申请号：US16068206

申请日：2016-12-19

Applicant: DEXERIALS CORPORATION

Inventor： Hidetsugu NAMIKI ,  Tomoyuki ISHIMATSU ,  Takashi MATSUMURA ,  Masaharu AOKI

IPC: C09J9/02 ,  C09J11/04 ,  C09J11/08 ,  C09J11/06 ,  C09J163/00 ,  H01L33/62 ,  H01L33/60

Abstract: An adhesive composition having excellent life properties is provided. This adhesive composition achieves excellent life properties by containing an epoxy compound, an aluminum chelating agent, and a hindered amine compound. This is presumably because the aluminum chelating agent stably exists due to the coordination of the nitrogen atom of the hindered amine compound with aluminum of the aluminum chelating agent.

公开(公告)号：US20180171184A1

公开(公告)日：2018-06-21

申请号：US15579050

申请日：2016-06-01

Applicant: DEXERIALS CORPORATION

Inventor： Masaharu AOKI ,  Hidetsugu NAMIKI

IPC: C09J9/02 ,  C09J163/00 ,  C09J133/02 ,  C09J133/08 ,  C09J11/04 ,  C09J11/08 ,  H01L33/62 ,  C09J181/04

CPC classification number: C09J9/02 ,  C08G59/66 ,  C08G59/70 ,  C08K5/17 ,  C08L81/02 ,  C09J11/04 ,  C09J11/06 ,  C09J11/08 ,  C09J133/00 ,  C09J133/02 ,  C09J133/066 ,  C09J133/08 ,  C09J163/00 ,  C09J181/04 ,  C09J201/02 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2224/73204 ,  C08L33/20

Abstract: An adhesive composition, capable of achieving excellent life performance and a wide margin for mounting, includes a cationic polymerizable compound, an aluminum chelate/silanol-based curing catalyst, and a nucleophilic compound containing a sulfur atom having an unshared electron pair. The nucleophilic compound is a thiol compound or an episulfide compound. The aluminum chelate/silanol-based curing catalyst includes an aluminum chelate curing agent, and a silanol compound or a silane coupling agent. The aluminum chelate curing agent constitutes a latent aluminum chelate curing agent carried by a porous resin obtained through interfacial polymerization of a polyfunctional isocyanate compound.

公开(公告)号：US20250128361A1

公开(公告)日：2025-04-24

申请号：US18688455

申请日：2022-08-05

Applicant: DEXERIALS CORPORATION

Inventor： Sarii YAMAGUCHI ,  Hidetsugu NAMIKI ,  Takeshi NISHIO

IPC: B23K35/02 ,  B23K35/26

Abstract: A solder particle manufacturing method includes a curing step of curing solder particles such that a hardness K of the solder particles under compressive deformation to 70% is 850 N/mm2 or greater and 1,500 N/mm2 or less, and a classifying step of classifying the solder particles after being cured by forcibly generating an airflow using a classifying device.

公开(公告)号：US20250031468A1

公开(公告)日：2025-01-23

申请号：US18905331

申请日：2024-10-03

Applicant: DEXERIALS CORPORATION

Inventor： Yusuke TANAKA ,  Yusuke KAMATA ,  Hidetsugu NAMIKI ,  Manabu SUZUKI

IPC: H01L27/146 ,  H01L23/00

Abstract: A method of manufacturing a connection structure, connection structure, film structure, and a method of manufacturing a film structure capable of mounting an electronic component having a plurality of terminal rows on a mounting surface by using existing equipment, including: a pasting step of pasting, from a film structure including a tape-shaped base material and a connection film formed thereon, connection films having a unit region of a predetermined length in the length direction of the base material and a predetermined width in the width direction to a first or second electronic component having a plurality of terminal rows; and a connecting step of connecting terminals of the first and second electronic components through the connection films, wherein the film structure includes, in the unit region, in addition to portions corresponding to the plurality of terminal rows, a non-pasting portion in which the connection film is not pasted.

公开(公告)号：US20160194531A1

公开(公告)日：2016-07-07

申请号：US14916490

申请日：2014-09-09

Applicant: DEXERIALS CORPORATION

Inventor： Masaharu AOKI ,  Shiyuki KANISAWA ,  Hidetsugu NAMIKI ,  Taichi KOYAMA ,  Akira ISHIGAMI

IPC: C09J133/20 ,  C09J9/02 ,  H01L33/62

CPC classification number: C09J133/20 ,  C08F220/18 ,  C08L33/066 ,  C08L33/068 ,  C08L2205/22 ,  C09J9/02 ,  C09J133/066 ,  C09J163/00 ,  H01B1/22 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L33/62 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/29311 ,  H01L2224/29316 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29371 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/2939 ,  H01L2224/29393 ,  H01L2224/294 ,  H01L2224/32225 ,  H01L2224/81424 ,  H01L2224/81487 ,  H01L2224/81903 ,  H01L2224/83424 ,  H01L2224/83487 ,  H01L2224/83851 ,  H01L2224/83862 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/0635 ,  H01L2924/01006 ,  H01L2924/0543 ,  H01L2924/01049 ,  H01L2924/0544 ,  H01L2924/0105 ,  C08F2220/1825 ,  C08F2220/1808 ,  C08F220/44 ,  C08F220/06 ,  C08F220/20 ,  C08K5/151

Abstract: This adhesive contains an epoxy compound, a cationic catalyst, and an acrylic resin that includes acrylic acid and an acrylic acid ester having a hydroxyl group. The acrylic acid in the acrylic resin reacts with the epoxy compound, creating a link between the acrylic resin island part and the epoxy compound sea part, and strengthening the anchoring effect with respect to the epoxy compound sea part by roughening the surface of an oxide film. Furthermore, the hydroxyl-group-containing acrylic acid ester in the acrylic resin becomes electrostatically adhesive to wiring due to the polarity of the hydroxyl group. Excellent adhesive strength can be obtained by adhering, in this way, the entire cured product composed of the acrylic resin island part and the epoxy compound sea part to the oxide film.

Abstract translation: 该粘合剂包含环氧化合物，阳离子催化剂和丙烯酸树脂，其包括丙烯酸和具有羟基的丙烯酸酯。 丙烯酸树脂中的丙烯酸与环氧化合物反应，产生丙烯酸树脂岛部分和环氧化合物海部之间的连接，并通过使氧化膜的表面粗糙化来增强相对于环氧化合物海部的锚固效果 。 此外，由于羟基的极性，丙烯酸树脂中的含羟基的丙烯酸酯与布线成为静电粘合剂。 通过将由丙烯酸树脂岛部和环氧化合物海部构成的整个固化物以这种方式粘附到氧化膜，可以获得良好的粘合强度。

公开(公告)号：US20140225144A1

公开(公告)日：2014-08-14

申请号：US14222249

申请日：2014-03-21

Applicant: Dexerials Corporation

Inventor： Hidetsugu NAMIKI ,  Shiyuki KANISAWA ,  Hideaki UMAKOSHI

IPC: H01L33/62 ,  H01L23/00 ,  H01L33/60

CPC classification number: H01B1/02 ,  C08G59/42 ,  C08K9/02 ,  C09J9/02 ,  C09J11/04 ,  C09J163/00 ,  H01B1/22 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L33/46 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/29393 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81903 ,  H01L2224/83851 ,  H01L2224/9211 ,  H01L2924/00014 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/181 ,  Y10T428/2991 ,  Y10T428/2993 ,  Y10T428/2998 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/05432 ,  H01L2924/05341 ,  H01L2924/05342 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/05599

Abstract: A light-reflective conductive particle for an anisotropic conductive adhesive used for connecting a light-emitting element to a wiring board by anisotropic conductive connection includes a core particle covered with a metal material and a light reflecting layer formed of a light-reflective inorganic particle having a refractive index of 1.52 or greater on the surface of the core particle. Examples of the light-reflective inorganic particles having a refractive index of 1.52 or greater include a titanium oxide particle, a zinc oxide particle, and an aluminum oxide particle. The coverage of the light reflecting layer on the surface of the core particle is 70% or more.

Abstract translation: 用于通过各向异性导电连接将发光元件连接到布线板的用于各向异性导电粘合剂的光反射导电颗粒包括被金属材料覆盖的芯颗粒和由反光无机颗粒形成的光反射层，所述光反射层具有 核心颗粒表面的折射率为1.52或更大。 折射率为1.52以上的光反射性无机粒子的实例包括氧化钛颗粒，氧化锌颗粒和氧化铝颗粒。 芯粒子表面的光反射层的覆盖率为70％以上。

公开(公告)号：US20140097463A1

公开(公告)日：2014-04-10

申请号：US14104320

申请日：2013-12-12

Applicant: Dexerials Corporation

Inventor： Hidetsugu NAMIKI ,  Shiyuki KANISAWA ,  Genki KATAYANAGI

IPC: H01L23/00 ,  H01L33/62

CPC classification number: H01L24/29 ,  C09J9/02 ,  C09J163/00 ,  H01B1/22 ,  H01L24/83 ,  H01L33/62 ,  H01L2924/07811 ,  H01L2924/12041 ,  H05K3/323 ,  H01L2924/00

Abstract: An anisotropic conductive adhesive includes an epoxy adhesive containing an epoxy compound and a curing agent and conducive particles dispersed in the epoxy adhesive. When elastic moduluses at 35° C., 55° C., 95° C., and 150° C. of a cured product of the anisotropic conductive adhesive are denoted by EM35, EM55, EM95, and EM150, respectively, and change rates in the elastic modulus between 55° C. and 95° C. and between 95° C. and 150° C. are denoted by ΔEM55-95 and ΔEM95-150, respectively, the following expressions (1) to (5) are satisfied 700 Mpa≦EM35≦3000 MPa  (1) EM150

Abstract translation: 各向异性导电粘合剂包括含有环氧化合物和固化剂的环氧粘合剂和分散在环氧粘合剂中的导电颗粒。 在各向异性导电粘合剂的固化物的35℃，55℃，95℃，150℃下的弹性模量分别由EM35，EM55，EM95，EM150表示，变化率 在55℃和95℃之间的弹性模量和95℃和150℃之间的弹性模量分别由＆Dgr; EM55-95和＆Dgr; EM95-150表示，下列表达式（1）至（ 5）满足700 Mpa＆nlE; EM35＆nlE; 3000 MPa（1）EM150

公开(公告)号：US20240367270A1

公开(公告)日：2024-11-07

申请号：US18682007

申请日：2022-07-27

Applicant: DEXERIALS CORPORATION

Inventor： Hidetsugu NAMIKI ,  Sarii YAMAGUCHI ,  Takeshi NISHIO

IPC: B23K35/02 ,  B22F1/05 ,  B22F1/145 ,  B23K35/26 ,  B23K35/365

Abstract: Solder particles containing an oxidized film on the surface thereof, wherein the average film thickness of the oxidized film is 3 nm or greater, and the average surface roughness Ra of the solder particles is 10 nm or greater are provided.