公开(公告)号：US20170114255A1

公开(公告)日：2017-04-27

申请号：US15301836

申请日：2015-05-22

Applicant: DEXERIALS CORPORATION

Inventor： Masaharu AOKI ,  Shiyuki KANISAWA ,  Hidetsugu NAMIKI ,  Akira ISHIGAMI

IPC: C09J163/00 ,  H05K3/38 ,  H05K1/18 ,  H05K1/02 ,  C09J11/04 ,  H05K1/11

CPC classification number: C09J163/00 ,  C09J11/04 ,  C09J11/06 ,  C09J133/00 ,  C09J133/04 ,  H01R11/01 ,  H05K1/0203 ,  H05K1/11 ,  H05K1/181 ,  H05K3/32 ,  H05K3/34 ,  H05K3/386 ,  H05K2201/10106

Abstract: An adhesive agent having excellent bonding properties with oxide films and excellent heat-dissipation properties and a connection structure using the same. The adhesive agent contains an epoxy compound, a cationic catalyst, and an acrylic resin containing acrylic acid and acrylic acid ester having a hydroxyl group. Acrylic acid in the acrylic resin reacts with the epoxy compound to generate connections between an island of acrylic resin and a sea of epoxy compound and roughen the surface of an oxide film to improve an anchor effect with the sea of epoxy compound; solder particles contained in the adhesive agent are melted to form metal bonding with an electrode, thereby enabling improvement in adhesive strength between the adhesive agent and the electrode and further improving heat dissipation from a surface of the metal bonding.

公开(公告)号：US20140248477A1

公开(公告)日：2014-09-04

申请号：US14275460

申请日：2014-05-12

Applicant: DEXERIALS CORPORATION

Inventor： Akira ISHIGAMI ,  Shiyuki KANISAWA ,  Hidetsugu NAMIKI ,  Hideaki UMAKOSHI ,  Masaharu AOKI

IPC: H01L23/00 ,  C08L83/04 ,  C08L79/08 ,  C08L67/00 ,  C08L27/06

Abstract: A buffer film for multi-chip packaging which does not cause out of alignment during multi-chip packaging and ensures favorable connection reliability has a structure in which a heat-resistant resin layer having a linear expansion coefficient of 80 ppm/° C. or less and a flexible resin layer made of a resin material having a Shore A hardness according to JIS K6253 of 10 to 80 are laminated. A multi-chip module can be produced by aligning a plurality of chip devices on a substrate through an adhesive to perform temporary adhesion, disposing the buffer film for multi-chip packaging between the chip devices and a bonding head so that the heat-resistant resin layer is on a chip device side, and connecting the plurality of chip devices with the substrate by applying heat and pressure to the chip devices toward the substrate with the bonding head.

Abstract translation: 用于多芯片封装的缓冲膜在多芯片封装期间不会导致对准并且确保良好的连接可靠性具有这样的结构，其中线膨胀系数为80ppm /℃或更低的耐热树脂层 并且层压由具有根据JIS K6253的肖氏A硬度为10至80的树脂材料制成的柔性树脂层。 可以通过粘合剂对基板上的多个芯片装置进行临时粘合，在芯片装置之间设置用于多芯片封装的缓冲膜和接合头，从而制造多芯片模块，使得耐热树脂 层位于芯片器件侧，并且通过利用接合头向衬底施加热和压力来将多个芯片器件与衬底连接。

公开(公告)号：US20160194531A1

公开(公告)日：2016-07-07

申请号：US14916490

申请日：2014-09-09

Applicant: DEXERIALS CORPORATION

Inventor： Masaharu AOKI ,  Shiyuki KANISAWA ,  Hidetsugu NAMIKI ,  Taichi KOYAMA ,  Akira ISHIGAMI

IPC: C09J133/20 ,  C09J9/02 ,  H01L33/62

CPC classification number: C09J133/20 ,  C08F220/18 ,  C08L33/066 ,  C08L33/068 ,  C08L2205/22 ,  C09J9/02 ,  C09J133/066 ,  C09J163/00 ,  H01B1/22 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L33/62 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/29311 ,  H01L2224/29316 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29371 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/2939 ,  H01L2224/29393 ,  H01L2224/294 ,  H01L2224/32225 ,  H01L2224/81424 ,  H01L2224/81487 ,  H01L2224/81903 ,  H01L2224/83424 ,  H01L2224/83487 ,  H01L2224/83851 ,  H01L2224/83862 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/0635 ,  H01L2924/01006 ,  H01L2924/0543 ,  H01L2924/01049 ,  H01L2924/0544 ,  H01L2924/0105 ,  C08F2220/1825 ,  C08F2220/1808 ,  C08F220/44 ,  C08F220/06 ,  C08F220/20 ,  C08K5/151

Abstract: This adhesive contains an epoxy compound, a cationic catalyst, and an acrylic resin that includes acrylic acid and an acrylic acid ester having a hydroxyl group. The acrylic acid in the acrylic resin reacts with the epoxy compound, creating a link between the acrylic resin island part and the epoxy compound sea part, and strengthening the anchoring effect with respect to the epoxy compound sea part by roughening the surface of an oxide film. Furthermore, the hydroxyl-group-containing acrylic acid ester in the acrylic resin becomes electrostatically adhesive to wiring due to the polarity of the hydroxyl group. Excellent adhesive strength can be obtained by adhering, in this way, the entire cured product composed of the acrylic resin island part and the epoxy compound sea part to the oxide film.

Abstract translation: 该粘合剂包含环氧化合物，阳离子催化剂和丙烯酸树脂，其包括丙烯酸和具有羟基的丙烯酸酯。 丙烯酸树脂中的丙烯酸与环氧化合物反应，产生丙烯酸树脂岛部分和环氧化合物海部之间的连接，并通过使氧化膜的表面粗糙化来增强相对于环氧化合物海部的锚固效果 。 此外，由于羟基的极性，丙烯酸树脂中的含羟基的丙烯酸酯与布线成为静电粘合剂。 通过将由丙烯酸树脂岛部和环氧化合物海部构成的整个固化物以这种方式粘附到氧化膜，可以获得良好的粘合强度。

公开(公告)号：US20140225144A1

公开(公告)日：2014-08-14

申请号：US14222249

申请日：2014-03-21

Applicant: Dexerials Corporation

Inventor： Hidetsugu NAMIKI ,  Shiyuki KANISAWA ,  Hideaki UMAKOSHI

IPC: H01L33/62 ,  H01L23/00 ,  H01L33/60

CPC classification number: H01B1/02 ,  C08G59/42 ,  C08K9/02 ,  C09J9/02 ,  C09J11/04 ,  C09J163/00 ,  H01B1/22 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L33/46 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/29393 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81903 ,  H01L2224/83851 ,  H01L2224/9211 ,  H01L2924/00014 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/181 ,  Y10T428/2991 ,  Y10T428/2993 ,  Y10T428/2998 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/05432 ,  H01L2924/05341 ,  H01L2924/05342 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/05599

Abstract: A light-reflective conductive particle for an anisotropic conductive adhesive used for connecting a light-emitting element to a wiring board by anisotropic conductive connection includes a core particle covered with a metal material and a light reflecting layer formed of a light-reflective inorganic particle having a refractive index of 1.52 or greater on the surface of the core particle. Examples of the light-reflective inorganic particles having a refractive index of 1.52 or greater include a titanium oxide particle, a zinc oxide particle, and an aluminum oxide particle. The coverage of the light reflecting layer on the surface of the core particle is 70% or more.

Abstract translation: 用于通过各向异性导电连接将发光元件连接到布线板的用于各向异性导电粘合剂的光反射导电颗粒包括被金属材料覆盖的芯颗粒和由反光无机颗粒形成的光反射层，所述光反射层具有 核心颗粒表面的折射率为1.52或更大。 折射率为1.52以上的光反射性无机粒子的实例包括氧化钛颗粒，氧化锌颗粒和氧化铝颗粒。 芯粒子表面的光反射层的覆盖率为70％以上。

公开(公告)号：US20140097463A1

公开(公告)日：2014-04-10

申请号：US14104320

申请日：2013-12-12

Applicant: Dexerials Corporation

Inventor： Hidetsugu NAMIKI ,  Shiyuki KANISAWA ,  Genki KATAYANAGI

IPC: H01L23/00 ,  H01L33/62

CPC classification number: H01L24/29 ,  C09J9/02 ,  C09J163/00 ,  H01B1/22 ,  H01L24/83 ,  H01L33/62 ,  H01L2924/07811 ,  H01L2924/12041 ,  H05K3/323 ,  H01L2924/00

Abstract: An anisotropic conductive adhesive includes an epoxy adhesive containing an epoxy compound and a curing agent and conducive particles dispersed in the epoxy adhesive. When elastic moduluses at 35° C., 55° C., 95° C., and 150° C. of a cured product of the anisotropic conductive adhesive are denoted by EM35, EM55, EM95, and EM150, respectively, and change rates in the elastic modulus between 55° C. and 95° C. and between 95° C. and 150° C. are denoted by ΔEM55-95 and ΔEM95-150, respectively, the following expressions (1) to (5) are satisfied 700 Mpa≦EM35≦3000 MPa  (1) EM150

Abstract translation: 各向异性导电粘合剂包括含有环氧化合物和固化剂的环氧粘合剂和分散在环氧粘合剂中的导电颗粒。 在各向异性导电粘合剂的固化物的35℃，55℃，95℃，150℃下的弹性模量分别由EM35，EM55，EM95，EM150表示，变化率 在55℃和95℃之间的弹性模量和95℃和150℃之间的弹性模量分别由＆Dgr; EM55-95和＆Dgr; EM95-150表示，下列表达式（1）至（ 5）满足700 Mpa＆nlE; EM35＆nlE; 3000 MPa（1）EM150

公开(公告)号：US20170121571A1

公开(公告)日：2017-05-04

申请号：US15116081

申请日：2015-02-13

Applicant: DEXERIALS CORPORATION

Inventor： Hidetsugu NAMIKI ,  Shiyuki KANISAWA ,  Akira ISHIGAMI ,  Masaharu AOKI

IPC: C09J9/02 ,  C09J11/04 ,  H01L33/64 ,  C09J163/00 ,  C08K9/02 ,  C08K3/22 ,  H01L33/62 ,  H01L33/60

CPC classification number: C09J9/02 ,  C08K3/22 ,  C08K7/16 ,  C08K9/02 ,  C08K2003/0806 ,  C08K2003/2241 ,  C08K2201/001 ,  C08K2201/003 ,  C08K2201/005 ,  C09J11/04 ,  C09J163/00 ,  C09J201/00 ,  H01B1/22 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L33/644 ,  H01L33/647 ,  H01L2224/16238 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29386 ,  H01L2224/2939 ,  H01L2224/29439 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49107 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01L2224/81203 ,  H01L2933/0066 ,  H01L2933/0075 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0272 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/05341 ,  H01L2924/05432

Abstract: Provided is an anisotropic conductive adhesive in which excellent optical characteristics and heat dissipation characteristics are obtainable. The anisotropic conductive adhesive contains conductive particles each comprising a metal layer having Ag as a primary constituent formed on an outermost surface of a resin particle, solder particles having a smaller average particle diameter than the conductive particles, reflective insulating particles having a smaller average particle diameter than the solder particles and a binder into which the conductive particles solder particles and reflective insulating particles are dispersed. The conductive particles and the reflective insulating particles efficiently reflect light, thereby improving light-extraction efficiency of an LED mounting body. Additionally, inter-terminal solder bonding of the solder particles during compression bonding increases contact area between opposing terminals, thereby enabling achievement of high heat dissipation characteristics.

公开(公告)号：US20160204313A1

公开(公告)日：2016-07-14

申请号：US15078734

申请日：2016-03-23

Applicant: DEXERIALS CORPORATION

Inventor： Hidetsugu NAMIKI ,  Shiyuki KANISAWA ,  Akira ISHIGAMI

IPC: H01L33/38 ,  H01L33/48 ,  H01B1/22 ,  H01L33/62

CPC classification number: H01L33/62 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L24/91 ,  H01L2224/1184 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13644 ,  H01L2224/16238 ,  H01L2224/16502 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/2939 ,  H01L2224/29444 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81395 ,  H01L2224/81444 ,  H01L2224/81805 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83395 ,  H01L2224/83444 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2224/83885 ,  H01L2224/9221 ,  H01L2933/0016 ,  H01L2933/0066 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/0665 ,  H01L2924/01047 ,  H01L2224/83801

Abstract: In order to provide a light emitting device having high connection reliability, the light-emitting device includes a board provided with a wiring pattern, an anisotropic conductive paste arranged on an board electrode of the wiring pattern, and a light-emitting element embedded in the anisotropic conductive paste, and at least one of the board electrode and the element electrode is plated with an AuSn alloy layer. The anisotropic conductive paste contains an epoxy compound, an acid anhydride, white inorganic particles, and conductive particles obtained by coating resin particles with an Au coating layer. It is possible to maintain electrical connection between the board electrode and the element electrode by the Au coating layers of the conductive particles even when a crack is generated in a eutectic bonding portion. Therefore, it is possible to obtain high connection reliability.

Abstract translation: 为了提供具有高连接可靠性的发光装置，发光装置包括设置有布线图案的基板，布置在布线图案的基板电极上的各向异性导电浆料和嵌入在该布线图案中的发光元件 各向异性导电膏，并且板电极和元件电极中的至少一个电镀有AuSn合金层。 各向异性导电糊包含环氧化合物，酸酐，白色无机颗粒和通过用Au涂层涂覆树脂颗粒而获得的导电颗粒。 即使在共晶接合部中产生裂纹，也可以通过导电性粒子的Au被覆层来保持基板电极与元件电极之间的电连接。 因此，可以获得高连接可靠性。

公开(公告)号：US20150353781A1

公开(公告)日：2015-12-10

申请号：US14830070

申请日：2015-08-19

Applicant: DEXERIALS CORPORATION

Inventor： Hidetsugu NAMIKI ,  Shiyuki KANISAWA ,  Hideaki UMAKOSHI ,  Masaharu AOKI ,  Akira ISHIGAMI

IPC: C09J9/02 ,  C23C14/22 ,  H01L33/48 ,  C23C14/02 ,  H01L33/62 ,  H01L33/60

CPC classification number: C09J11/00 ,  C08K7/16 ,  C08K9/00 ,  C09J9/02 ,  C23C14/025 ,  C23C14/205 ,  C23C14/223 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/29413 ,  H01L2224/29439 ,  H01L2224/29455 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81903 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/05599

Abstract: Provided is a light emitting device high in the intensity of emitted light. A blue LED chip having a peak of emitted light in a wavelength range of at least 360 nm and at most 500 nm is adhered to an electrode substrate by an anisotropic conductive adhesive. A light reflecting layer made of a silver alloy on a surface of each conductive particle contained in the anisotropic conductive adhesive, and has high reflectance with respect to blue light. The light reflecting layer is formed by sputtering of a sputtering target that contains Ag, Bi, and Nd with the content ratio of Bi set to at least 0.1 weight % (wt %) and at most 3.0 wt % and the content ratio of Nd set to at least 0.1 weight % and at most 2.0 wt % with respect to the total weight of Ag, Bi, and Nd of 100 wt %. The conductive particle has high anti-migration properties.

Abstract translation: 提供了发光强度高的发光装置。 通过各向异性导电粘合剂将具有至少360nm且至多500nm的波长范围内的发射峰的峰值的蓝色LED芯片粘附到电极基板。 在各向异性导电粘合剂中含有的各导电粒子的表面上由银合金制成的光反射层，对蓝色光具有高反射率。 光反射层通过溅射含有Ag，Bi和Nd的溅射靶，其Bi含量比设定为至少0.1重量％（wt％）至多3.0重量％，Nd含量比 相对于100重量％的Ag，Bi和Nd的总重量为至少0.1重量％且至多2.0重量％。 导电颗粒具有高的抗迁移性能。

公开(公告)号：US20150034989A1

公开(公告)日：2015-02-05

申请号：US14515648

申请日：2014-10-16

Applicant: DEXERIALS CORPORATION

Inventor： Hidetsugu NAMIKI ,  Shiyuki KANISAWA ,  Hideaki UMAKOSHI ,  Masaharu AOKI ,  Akira ISHIGAMI

IPC: C09J9/02 ,  C23C14/14 ,  H01L33/00 ,  H01L33/46 ,  H01L33/62

CPC classification number: C09J9/02 ,  C08J3/128 ,  C08K3/08 ,  C08K9/12 ,  C09J11/00 ,  C09J201/00 ,  C22C5/06 ,  C23C14/14 ,  H01B1/22 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L33/005 ,  H01L33/46 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/06102 ,  H01L2224/13144 ,  H01L2224/1403 ,  H01L2224/16238 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29455 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2224/81192 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00

Abstract: an anisotropic conductive adhesive which uses conductive particles where a silver-based metal is used as a conductive layer, having high light reflectance and excellent migration resistance is provided. The anisotropic conductive adhesive includes light reflective conductive particles in an insulating adhesive resin. The light reflective conductive particle includes a light reflective metal layer made of a metal alloy including silver, gold and hafnium formed on the surface of a resin particle as a core by sputtering method. The light reflective metal layer is preferably formed having a composition ratio of a silver of at least 50% by weight to at most 80% by weight: a gold of at least 10% by weight to at most 45%: a hafnium of at least 10% by weight to at most 40% by weight, and a total ratio does not exceed 100% by weight.

Abstract translation: 提供使用银基金属作为导电层的导电性粒子的各向异性导电粘合剂，具有高的光反射率和优异的耐迁移性。 各向异性导电粘合剂包括绝缘粘合树脂中的光反射导电颗粒。 光反射性导电性粒子包括通过溅射法在由树脂粒子的表面形成的包含银，金和铪的金属合金制成的光反射金属层。 光反射金属层优选形成为具有至少50重量％至至多80重量％的银的组成比：至少10重量％至至多45重量％的金：至少一个铪 10重量％至至多40重量％，总比例不超过100重量％。

公开(公告)号：US20140217450A1

公开(公告)日：2014-08-07

申请号：US14246618

申请日：2014-04-07

Applicant: DEXERIALS CORPORATION

Inventor： Akira ISHIGAMI ,  Shiyuki KANISAWA ,  Hidetsugu NAMIKI ,  Hideaki UMAKOSHI ,  Masaharu AOKI

IPC: H01L33/46 ,  H01L33/60

CPC classification number: H01L33/46 ,  C09J9/00 ,  C09J11/00 ,  H01B1/22 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49107 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/07811 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An anisotropic conductive adhesive which uses conductive particles where a silver-based metal is used as a conductive layer, having high light reflectance and excellent migration resistance is provided. The anisotropic conductive adhesive includes light reflective conductive particles in an insulating adhesive resin. The light reflective conductive particle includes a light reflective metal layer made of a metal having at least 60% of reflectance at a peak wavelength of 460 nm formed on the surface of a resin particle as a core, and a coating layer made of a silver alloy formed on the surface of the light reflective metal layer. The light reflective metal layer is preferably formed by a plating method.

Abstract translation: 提供了使用银基金属作为导电层的导电性粒子的各向异性导电性粘合剂，具有高的光反射率和优异的耐迁移性。 各向异性导电粘合剂包括绝缘粘合树脂中的光反射导电颗粒。 光反射性导电性粒子包括在作为芯的树脂粒子的表面上形成的在460nm的峰值波长具有至少60％的反射率的金属制成的光反射金属层，以及由银合金 形成在光反射金属层的表面上。 光反射金属层优选通过电镀法形成。