公开(公告)号：US09447308B2

公开(公告)日：2016-09-20

申请号：US14775789

申请日：2014-03-13

Applicant: Dow Corning Corporation

Inventor： John Albaugh ,  Brian Chislea ,  Adriana Zambova

IPC: C08K9/10 ,  C09J9/02 ,  C09J183/04 ,  H01R4/04 ,  C08K9/02 ,  C08K3/08

CPC classification number: C09J9/02 ,  C08K3/08 ,  C08K9/02 ,  C08K9/10 ,  C08K2003/0806 ,  C08K2003/085 ,  C08K2201/001 ,  C08L83/00 ,  C09J183/04 ,  H01R4/04

Abstract: A curable silicone composition comprising a curable organosiloxane composition, copper-silver (Cu—Ag) core-shell particles, and hydrocarbon vehicle; the curable silicone composition being characterizable by: a concentration of the Cu—Ag core-shell particles of from 70 to 89 weight percent and a total concentration of silver of from 7.0 to 14 weight percent, all based on weight of the curable silicone composition; wherein the composition remains curable to an electrically conductive silicone adhesive having a volume resistivity of less than 0.020 Ohm-centimeter measured according to Volume Resistivity Test Method.

Abstract translation: 包含可固化的有机硅氧烷组合物，铜 - 银（Cu-Ag）核 - 壳颗粒和烃载体的可固化的有机硅组合物; 可固化的有机硅组合物可以通过以下方法表征：Cu-Ag核 - 壳颗粒的浓度为70-89％（重量），银的总浓度为7.0〜14％（重量），均以可固化的有机硅组合物的重量计; 其中所述组合物保持可固化至根据体积电阻率测试方法测量的体积电阻率小于0.020欧姆厘米的导电硅氧烷粘合剂。

公开(公告)号：US20150315437A1

公开(公告)日：2015-11-05

申请号：US14650733

申请日：2013-12-13

Applicant: DOW CORNING CORPORATION

Inventor： John Albaugh ,  Brian Chislea ,  Adriana Zambova

IPC: C09J183/04 ,  H05K1/03 ,  C08K3/04 ,  C08K3/08 ,  H01B1/22 ,  C09J9/02

CPC classification number: C08K3/08 ,  C08G77/12 ,  C08G77/14 ,  C08G77/20 ,  C08K3/04 ,  C08K3/041 ,  C08K5/56 ,  C08K9/02 ,  C08K2003/0806 ,  C08K2201/001 ,  C08L83/00 ,  C09J9/02 ,  C09J183/04 ,  C09J2201/602 ,  H01B1/22 ,  H05K1/0373 ,  C08L83/04

Abstract: A curable silicone composition containing a curable organosiloxane composition, silver, and at least one electrically conductive metal other than silver, the curable silicone composition being characterizable by a total silver concentration of from 50 to less than 60 weight percent and a thixotropic index that is adjustable from 3 to 10 measured according to TI Test Method while the composition remains curable to an electrically conductive silicone adhesive having a volume resistivity of less than 0.001 Ohm-centimeter measured according to Volume Resistivity Test Method without increasing the total concentration of electrically conduct metal in the curable silicone composition to 72 weight percent or higher, the electrically conductive silicone adhesive, an electrical device comprising the electrically conductive silicone adhesive, and a method of manufacturing the electrical device.

Abstract translation: 一种含有可固化的有机硅氧烷组合物，银和除了银以外的至少一种导电金属的可固化的硅氧烷组合物，可固化的有机硅组合物可以由总银浓度为50至小于60重量％表征，触变指数可调 根据TI测试方法测量的3至10，而组合物可固化至根据体积电阻率测试方法测量的体积电阻率小于0.001欧姆厘米的导电硅酮粘合剂，而不增加导电性金属的总浓度 可固化硅氧烷组合物至72重量％或更高，导电硅氧烷粘合剂，包括导电硅树脂粘合剂的电气装置，以及制造电气装置的方法。

公开(公告)号：US09441086B2

公开(公告)日：2016-09-13

申请号：US14650733

申请日：2013-12-13

Applicant: Dow Corning Corporation

Inventor： John Albaugh ,  Brian Chislea ,  Adriana Zambova

IPC: C08K3/08 ,  C09J9/02 ,  C08K3/04 ,  H05K1/03 ,  C08K9/02 ,  C09J183/04 ,  H01B1/22 ,  C08G77/12 ,  C08G77/14 ,  C08G77/20

CPC classification number: C08K3/08 ,  C08G77/12 ,  C08G77/14 ,  C08G77/20 ,  C08K3/04 ,  C08K3/041 ,  C08K5/56 ,  C08K9/02 ,  C08K2003/0806 ,  C08K2201/001 ,  C08L83/00 ,  C09J9/02 ,  C09J183/04 ,  C09J2201/602 ,  H01B1/22 ,  H05K1/0373 ,  C08L83/04

Abstract: A curable silicone composition containing a curable organosiloxane composition, silver, and at least one electrically conductive metal other than silver, the curable silicone composition being characterizable by a total silver concentration of from 50 to less than 60 weight percent and a thixotropic index that is adjustable from 3 to 10 measured according to TI Test Method while the composition remains curable to an electrically conductive silicone adhesive having a volume resistivity of less than 0.001 Ohm-centimeter measured according to Volume Resistivity Test Method without increasing the total concentration of electrically conductive metal in the curable silicone composition to 72 weight percent or higher, the electrically conductive silicone adhesive, an electrical device comprising the electrically conductive silicone adhesive, and a method of manufacturing the electrical device.

Abstract translation: 一种含有可固化的有机硅氧烷组合物，银和除了银以外的至少一种导电金属的可固化的硅氧烷组合物，可固化的有机硅组合物可以由总银浓度为50至小于60重量％表征，触变指数可调 根据TI测试方法测量的3至10，而组合物可固化至根据体积电阻率测试方法测量的体积电阻率小于0.001欧姆厘米的导电硅酮粘合剂，而不增加导电性金属的总浓度 可固化硅氧烷组合物至72重量％或更高，导电硅氧烷粘合剂，包括导电硅树脂粘合剂的电气装置，以及制造电气装置的方法。