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    Asynchronous transfer mode switch with logical multicasting
    2.
    发明授权
    Asynchronous transfer mode switch with logical multicasting 失效
    具有逻辑组播的异步传输模式切换

    公开(公告)号：US06320858B1

    公开(公告)日：2001-11-20

    申请号：US09082350

    申请日：1998-05-20

    Applicant: David R. King ,  Mark A. Krumpoch ,  Scott E. Lane ,  W. Douglas Strubeck

    Inventor： David R. King ,  Mark A. Krumpoch ,  Scott E. Lane ,  W. Douglas Strubeck

    IPC: H04L1228

    CPC classification number: H04L49/309 ,  H04L12/5601 ,  H04L2012/562 ,  H04L2012/5642

    Abstract: A method and system for logical multicasting on an Asynchronous Transfer Mode (“ATM”) switch. There is a logical replication of cells on the same physical port of the ATM switch. A block of consecutive CIs is used by the controller in the switch to create new cells. The CIs are used to control the flow through the switch and for updating the VPI and VCI. These routing tags are part of the header information and multicast to the same physical port

    Abstract translation: 用于在异步传输模式（“ATM”）交换机上进行逻辑组播的方法和系统。 在ATM交换机的同一物理端口上存在单元的逻辑复制。 交换机中的控制器使用一组连续的CI来创建新的单元。 CI用于控制通过交换机的流量并更新VPI和VCI。 这些路由标签是头信息的一部分，并且组播到相同的物理端口

    Ultra fine line cable and a method for fabricating the same
    9.
    发明授权
    Ultra fine line cable and a method for fabricating the same 失效
    超细线电缆及其制造方法

    公开(公告)号：US4992059A

    公开(公告)日：1991-02-12

    申请号：US445292

    申请日：1989-12-01

    Applicant: David R. King ,  David B. Harris

    Inventor： David R. King ,  David B. Harris

    IPC: H01L23/498

    CPC classification number: H01L23/4985 ,  H01L23/49827 ,  H01L2924/0002 ,  Y10T29/49158 ,  Y10T29/4921

    Abstract: The invention is a fine line electrical cable with two ends having a plurality of first conductor lines in a plane. The lines of the cable are embedded in an insulating laminate material, are closely spaced at one end to be compatible with the closely spaced contacts from IC chips and are fanned out along the length of the cable to the other end where the lines are spaced somewhat apart and compatible with conventional electrical connectors. Contact posts extent from each line end so that external connections may be made with the IC chips and the conventional connectors. At least one second conductor line may be embedded within the other side of the laminate material and appropriate contact posts extend from the line ends so that external connections may also be made at these locations. A method for fabricating the fine line elecrical cable is also disclosed.

    Abstract translation: 本发明是一种细线电缆，其两端在平面内具有多条第一导体线。 电缆的线被嵌入绝缘层压材料中，在一端紧密间隔开以与IC芯片紧密隔开的触点相容，并沿着电缆的长度被扇形地延伸至另一端，其中线间隔一些 与传统的电连接器兼容。 每个线端的接触柱范围，以便可以利用IC芯片和常规连接器进行外部连接。 至少一个第二导体线可以嵌入在层压材料的另一侧内，并且适当的接触柱从线端延伸，使得也可以在这些位置处形成外部连接。 还公开了一种用于制造细线电缆的方法。

    Printed circuit boards and method for manufacturing printed circuit boards
    10.
    发明授权
    Printed circuit boards and method for manufacturing printed circuit boards 失效
    印刷电路板和制造印刷电路板的方法

    公开(公告)号：US4912020A

    公开(公告)日：1990-03-27

    申请号：US240852

    申请日：1988-09-02

    Applicant: David R. King ,  Mark S. Lee ,  Richard W. Decker

    Inventor： David R. King ,  Mark S. Lee ,  Richard W. Decker

    IPC: H05K1/11 ,  H05K3/20 ,  H05K3/24 ,  H05K3/28 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46

    CPC classification number: H05K3/205 ,  H05K1/112 ,  H05K3/4614 ,  H05K3/4647 ,  H05K3/4658 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2203/0152 ,  H05K2203/061 ,  H05K2203/063 ,  H05K2203/0726 ,  H05K2203/0733 ,  H05K3/243 ,  H05K3/28 ,  H05K3/4007 ,  H05K3/423 ,  H05K3/4652

    Abstract: A printed circuit board is described in which an electrically insulating laminate material (40) has first and second sides. An electrically conducting first circuit pattern (15) is embedded in the first side of the laminate material (40), and an electrically conducting second circuit pattern (20) is embedded in the second side of the laminate material (40) electrically insulated from the first circuit pattern (15) by the laminate material (40). A solid interconnection member (20) extends through the laminate material (40) and electrically contacts both the first and second circuit patterns (15,20) at selected locations thereof.The method for fabricating the board includes as a first step the fabrication of a first board panel (10) having a raised electrically conducting first circuit pattern (15) extending from a base layer (14) of conductive material and a raised electrically conducting second circuit pattern (20) extending from the first circuit pattern (15). A second board panel (30) is also fabricated, having a raised electrically conducting third circuit pattern (35) extending from another base layer (34) of conductive material. The first board panel (10) is laminated to the second board panel (30) with a laminate insulating material (40) disposed therebetween electrically insulating the first circuit pattern (15) from the third circuit pattern (35) and with the second circuit pattern (20) electrically contacting the first circuit pattern (15) at selected portions thereof. Finally, the base layers (14,34) of conductive material are removed from the laminate insulating material (40).

    Abstract translation: 描述了一种印刷电路板，其中电绝缘层压材料（40）具有第一和第二侧面。 导电第一电路图案（15）嵌入在层压材料（40）的第一侧中，并且导电的第二电路图案（20）嵌入在层压材料（40）的第二侧中，与第 第一电路图案（15）由层压材料（40）构成。 固体互连构件（20）延伸穿过层压材料（40）并且在其选定位置处电连接第一和第二电路图案（15,20）。 制造基板的方法包括作为第一步骤制造具有从导电材料的基底层（14）延伸的升高的导电第一电路图案（15）的第一板面板（10）和升高的导电的第二电路 图案（20）从第一电路图案（15）延伸。 还制造了第二板面板（30），其具有从导电材料的另一基底层（34）延伸的凸起的导电第三电路图案（35）。 第一板面板（10）用位于其间的层叠绝缘材料（40）层叠到第二板面板（30），使第一电路图案（15）与第三电路图案（35）电绝缘，并且第二电路图案 （20）在其选定部分与第一电路图案（15）电接触。 最后，将导电材料的基层（14,34）从叠层绝缘材料（40）中去除。

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