公开(公告)号：US20230146529A1

公开(公告)日：2023-05-11

申请号：US17974785

申请日：2022-10-27

Applicant: Delta Electronics, Inc.

Inventor： Kun Jiang ,  Xi Liu ,  Jianxin Chen ,  Geguo Men

IPC: H05K3/34 ,  H01F41/02 ,  H05K1/02

CPC classification number: H05K3/3494 ,  H01F41/0206 ,  H05K1/0298

Abstract: The present disclosure is related to an electronic module assembly structure including a system board, an electronic module and an adhesive material. The system board includes a first upper surface and a first lower surface opposite to each other. The electronic module spatially corresponds to the first upper surface and includes plurality leading pins and a carrier. Each leading pin has a soldering surface and is connected to the first upper surface through a first reflow soldering process. When the plurality leading pins are connected to the first upper surface, a height difference is formed between the carrying surface of the carrier and the soldering surfaces. The adhesive material is disposed on the carrying surface or the first upper surface. The carrier is connected with the first upper surface through the adhesive material, so that the electronic module is fixed to the first upper surface through the adhesive material.

公开(公告)号：US20230262889A1

公开(公告)日：2023-08-17

申请号：US18096356

申请日：2023-01-12

Applicant: Delta Electronics, Inc.

Inventor： Jianxin Chen ,  Kun Jiang ,  Quansong Luo

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/30 ,  H02M7/00

CPC classification number: H05K1/113 ,  H05K1/0201 ,  H05K3/30 ,  H02M7/003

Abstract: A power module and a manufacturing method are provided. The power module includes a first electronic assembly and a second electronic assembly. The first electronic assembly includes at least one pin. The second electronic assembly includes a first surface and a second surface opposite to each other. The first surface is more adjacent to the first electronic assembly than the second surface. A direction from the first surface toward the second surface is defined as a reference direction. The second electronic assembly includes a first region and a second region. The first region has a first thickness in the reference direction. The second region has a second thickness in the reference direction. The second thickness is less than the first thickness. The second region includes at least one through hole. The pin is penetrated through the at least one through hole and fixed on the second electronic assembly.